Download or read book Efficient Analyses and Models of VLSI and MCM Interconnects written by Andrew B. Kahng and published by . This book was released on 1996 with total page 49 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Interconnects in VLSI Design written by Hartmut Grabinski and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 234 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999. This publication addresses the need of developers and researchers in the field of VLSI chip and package design. It offers a survey of current problems regarding the influence of interconnect effects on the electrical performance of electronic circuits and suggests innovative solutions. In this sense the present book represents a continua tion and a supplement to the first book "Signal Propagation on Interconnects", Kluwer Academic Publishers, 1998. The papers in this book cover a wide area of research directions: Beneath the des cription of general trends they deal with the solution of signal integrity problems, the modeling of interconnects, parameter extraction using calculations and measurements and last but not least actual problems in the field of optical interconnects.

Download or read book Analysis of MCMs Using Asymptotic Waveform Evaluation AWE written by M. M. Alaybeyi and published by . This book was released on 1992 with total page 4 pages. Available in PDF, EPUB and Kindle. Book excerpt: Abstract: "Finer feature sizes, increasing system complexity, and higher signal speeds have combined to make interconnect the dominant determinant of electronic circuit and system performance. These trends will continue into the forseeable future, and new technologies that may be introduced will only add to them. Key components to interconnect analysis are efficient simulation of interconnect models, and macro-modeling to make the models fit efficiently into existing simulation strategies. Asymptotic Waveform Evaluation (AWE) is an elegant and efficient solution to this problem. This paper illustrates the applicability of AWE to the analysis of MCM interconnect structures -- from chip level through packaging, through thick or thin film interconnect and back again."

Download or read book Modeling and Simulation of High Speed VLSI Interconnects written by Michel S. Nakhla and published by Springer Science & Business Media. This book was released on 2011-06-28 with total page 104 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modeling and Simulation of High Speed VLSI Interconnects brings together in one place important contributions and state-of-the-art research results in this rapidly advancing area. Modeling and Simulation of High Speed VLSI Interconnects serves as an excellent reference, providing insight into some of the most important issues in the field.

Download or read book Proceedings written by and published by . This book was released on 1997 with total page 192 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Statistical Performance Analysis and Modeling Techniques for Nanometer VLSI Designs written by Ruijing Shen and published by Springer Science & Business Media. This book was released on 2014-07-08 with total page 326 pages. Available in PDF, EPUB and Kindle. Book excerpt: Since process variation and chip performance uncertainties have become more pronounced as technologies scale down into the nanometer regime, accurate and efficient modeling or characterization of variations from the device to the architecture level have become imperative for the successful design of VLSI chips. This book provides readers with tools for variation-aware design methodologies and computer-aided design (CAD) of VLSI systems, in the presence of process variations at the nanometer scale. It presents the latest developments for modeling and analysis, with a focus on statistical interconnect modeling, statistical parasitic extractions, statistical full-chip leakage and dynamic power analysis considering spatial correlations, statistical analysis and modeling for large global interconnects and analog/mixed-signal circuits. Provides readers with timely, systematic and comprehensive treatments of statistical modeling and analysis of VLSI systems with a focus on interconnects, on-chip power grids and clock networks, and analog/mixed-signal circuits; Helps chip designers understand the potential and limitations of their design tools, improving their design productivity; Presents analysis of each algorithm with practical applications in the context of real circuit design; Includes numerical examples for the quantitative analysis and evaluation of algorithms presented. Provides readers with timely, systematic and comprehensive treatments of statistical modeling and analysis of VLSI systems with a focus on interconnects, on-chip power grids and clock networks, and analog/mixed-signal circuits; Helps chip designers understand the potential and limitations of their design tools, improving their design productivity; Presents analysis of each algorithm with practical applications in the context of real circuit design; Includes numerical examples for the quantitative analysis and evaluation of algorithms presented.

Download or read book Accurate Interconnect Modeling for Efficient Transient Simulation in VLSI Chip Design written by Qinwei Xu and published by . This book was released on 2006 with total page 142 pages. Available in PDF, EPUB and Kindle. Book excerpt: Aggressive VLSI feature size shrinking makes integrated circuits and systems both larger and faster. CMOS integrated circuits are now operating at well more than 3 GHz of clock; nevertheless, it is projected that the VLSI chip speed will enhance in a decade by a factor of four. As the interconnect scaling poses a serious challenge to signal integrity and circuit speed, these interconnects must be represented as distributed RLC transmission lines. The huge number of interconnects within the chip makes the traditional simulators prohibitively slow. Therefore, among other techniques to speed up the simulation, efficient interconnect modeling algorithms are needed to obtain accurate models for efficient circuit simulation in VLSI chip design.

Download or read book APCCAS written by and published by . This book was released on 1996 with total page 592 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Physical Design for Multichip Modules written by Mysore Sriram and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 205 pages. Available in PDF, EPUB and Kindle. Book excerpt: Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material consists of a survey of published results as well as original work by the authors. All major aspects of MCM physical design are discussed, including interconnect analysis and modeling, system partitioning and placement, and multilayer routing. For readers unfamiliar with MCMs, this book presents an overview of the different MCM technologies available today. An in-depth discussion of various recent approaches to interconnect analysis are also presented. Remaining chapters discuss the problems of partitioning, placement, and multilayer routing, with an emphasis on timing performance. For the first time, data from a wide range of sources is integrated to present a clear picture of a new, challenging and very important research area. For students and researchers looking for interesting research topics, open problems and suggestions for further research are clearly stated. Points of interest include : Clear overview of MCM technology and its relationship to physical design; Emphasis on performance-driven design, with a chapter devoted to recent techniques for rapid performance analysis and modeling of MCM interconnects; Different approaches to multilayer MCM routing collected together and compared for the first time; Explanation of algorithms is not overly mathematical, yet is detailed enough to give readers a clear understanding of the approach; Quantitative data provided wherever possible for comparison of different approaches; A comprehensive list of references to recent literature on MCMs provided.

Download or read book Conference Proceedings written by and published by . This book was released on 1995 with total page 744 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Electrothermal Analysis of VLSI Systems written by Yi-Kan Cheng and published by Springer Science & Business Media. This book was released on 2005-12-01 with total page 220 pages. Available in PDF, EPUB and Kindle. Book excerpt: This useful book addresses electrothermal problems in modern VLSI systems. It discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires. The authors present three important applications of VLSI electrothermal analysis: temperature-dependent electromigration diagnosis, cell-level thermal placement, and temperature-driven power and timing analysis.

Download or read book A Higher order Moment Model for Multiport Circuits written by Fang-Jou Liu and published by . This book was released on 1999 with total page 178 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Proceedings of the Midwest Symposium on Circuits and Systems written by and published by . This book was released on 1999 with total page 630 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Microelectronics Packaging Handbook written by R.R. Tummala and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 1060 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

Download or read book Proceedings International Symposium on VLSI Design written by and published by . This book was released on 1996 with total page 492 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book 2000 22nd International Conference on Microelectronics written by IEEE Electron Devices Society and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1999 with total page 392 pages. Available in PDF, EPUB and Kindle. Book excerpt: The papers in this volume are a partial selection from the International Conference on Microelectronic 1999 which provides a forum for the presentation and discussion of the recent developments and future trends in the field of microelectronics."

Download or read book Electrical Electronics Abstracts written by and published by . This book was released on 1997 with total page 1948 pages. Available in PDF, EPUB and Kindle. Book excerpt: