Download or read book Wetting Balance Studies written by Russell Brian Cinque and published by . This book was released on 1995 with total page 156 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book The Mechanics of Solder Alloy Wetting and Spreading written by Michael Hosking and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 367 pages. Available in PDF, EPUB and Kindle. Book excerpt: In 1992 Congress passed the Defense Manufacturing Engineering Education Act with the intent of encouraging academic institutions to increase their emphasis on manufacturing curricula. The need for this incentive to integrate the academic and industrial communities was clear: gaps in manufacturing science were inhibiting the evolution of new manufacturing technologies that are required for the U.S. to maintain a competitive posture in the world marketplace. The Army Research Laboratory and Sandia National Laboratories sought to contribute to the congressional intent by initiating a new series of graduate level college textbooks. The goal was to focus next-generation scientists onto issues that were common to the needs of the commercial market, the affordability of DoD weapons systems, and the mobilization readiness of the U.S. Armed Forces. The textbook The Mechanics of Solder Wetting and Spreading was written in this spirit by nationally renowned scientists for academe and industry. Research ers using the book are encouraged to formulate programs that will establish scien tific correlations between manufacturing process controls and product reliability. Such correlations are essential to the building of a new electronics industry which is based upon the futuristic concepts of Virtual Factories, Prototyping, and Testing.
Download or read book A Guide to Lead free Solders written by John W. Evans and published by Springer Science & Business Media. This book was released on 2007-01-05 with total page 212 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book is important because it reflects a trend, especially in microelectronics manufacture toward recyclability. Europe and Asia are moving towards legislation to ban the use of lead in solders and public demand in the US will likely have the same result. Producers of solders and manufacturers who use them will have to invent and employ suitable substitutes and A Guide to Lead-free Solders will show them how to do so.
Download or read book Energy Research Abstracts written by and published by . This book was released on 1994-05 with total page 438 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electronic Materials Handbook written by and published by ASM International. This book was released on 1989-11-01 with total page 1234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Download or read book Amorphous and Nano Alloys Electroless Depositions written by Bangwei Zhang and published by Elsevier. This book was released on 2015-12-07 with total page 774 pages. Available in PDF, EPUB and Kindle. Book excerpt: Amorphous and Nano Alloys Electroless Depositions: Technology, Theory, Structure and Property describes the whole development and the most important subjects (technology, theory, structure and property) up to date of electroless plating (EP). The author concentrates on the fundamental scientific and academic problems (principle, mechanism and theory) in EP today.Based on the history of EP, this valuable reference describes lots of new EP processes, including electroless Fe based alloy system deposits, formation and theoretical description of electroless alloys, microscopic theory of electroless plating deposits, microscopic structures and surface morphology of electroless deposits, and weldability property of electroless deposits. - Focus on the fundamental scientific and academic problems (principles, mechanisms and theory) in electroless plating - The book gives a very good overview of the research and development in this field and each chapter is fully referenced - Detailed analysis and review of the current data, logically structured for ease of use
Download or read book Wetting and Wettability written by Mahmood Aliofkhazraei and published by BoD – Books on Demand. This book was released on 2015-12-16 with total page 386 pages. Available in PDF, EPUB and Kindle. Book excerpt: On the liquid 's surface, the molecules have fewer neighbors in comparison with the bulk volume. As a result, the energy interaction shows itself in the surface tension. Traditionally, the surface tension can be assumed as a force in the unit of the length which can be counted by the unit of Newton on squared meter, or energy on the units of the surface. The surface tension, implies the interface between liquid and vapor, which is an example of the surface tensions. The equilibrium between these surface tensions, decides that a droplet on a solid surface, would have a droplet form or will change to layer form. This book collects new developments in wetting and wettability science.
Download or read book Handbook of Lead Free Solder Technology for Microelectronic Assemblies written by Karl J. Puttlitz and published by CRC Press. This book was released on 2004-02-27 with total page 1044 pages. Available in PDF, EPUB and Kindle. Book excerpt: This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.
Download or read book Electronic Waste Management written by G H Eduljee and published by Royal Society of Chemistry. This book was released on 2019-09-06 with total page 374 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronic waste, which includes everything from refrigerators to smartphones, is one of the world’s fastest growing waste streams. Often these items are simply discarded as new technology becomes available. A huge amount of electronic waste is generated globally and currently only around 20% of it is recycled. The complex mixture of materials and components within electronic waste makes it difficult to manage and many of these components can pose hazards to human health or the environment if not disposed of carefully. There have been significant changes in the global approach to electronic waste management and the legislation around it since the publication of the first edition of Electronic Waste Management. This new edition provides an updated overview across the world as well as presenting new chapters on current issues in recycling and management of this waste. This is an essential reference not only for those working in recycling and waste management, but also for those working in manufacturing and product development who wish to consider the full lifecycle of their products. It also provides valuable insights for policymakers developing more environmentally sound and sustainable systems and strategies for the management of electronic waste.
Download or read book Materials Transactions written by and published by . This book was released on 2009 with total page 670 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Wettability at High Temperatures written by N. Eustathopoulos and published by Elsevier. This book was released on 1999-11-24 with total page 439 pages. Available in PDF, EPUB and Kindle. Book excerpt: The purpose of this book is to bring together current scientific understanding of wetting behaviour that has been gained from theoretical models and quantitative experimental observations. The materials considered are liquid metals or inorganic glasses in contact with solid metals or ceramics at temperatures of 200-2000oC. Wetting has been a significant scientific concern for the last two centuries and reference will be made to classical work by nineteenth century scientists such as Dupré, Laplace and Young that was validated by observations of the behaviour of chemically inert ambient temperature systems.In attempting to achieve the aims of the book, the text has been divided into ten Chapters that can be grouped into four stages of presentation. The first stage comprises two Chapters that review established and newly developed models for their relevance to wetting behaviour at high temperatures, including recent models that encompass the role of chemical reactions at the solid/liquid interfaces. Attention is paid both to equilibrium wetting behaviour (Chapter 1) and to the factors that control the approach to equilibrium (Chapter 2). Then follow Chapters concerned with experimental techniques for scientific measurement of the extent of wetting (Chapter 3) and with the surface energy data for both metals and non-metals that are essential for quantitative interpretation of wetting behaviour (Chapter 4). Descriptions of experimentally determined and quantified wetting behaviour are presented and interpreted in the third part comprising five Chapters dealing with the characteristics of metal/metal, metal/oxide, metal/non-oxide, metal/carbon and molten glass/solid systems. The book concludes with a Chapter commenting on the role of wetting behaviour in joining similar and dissimilar materials by liquid route techniques.
Download or read book Surface Chemistry of Proteins and Polypeptides written by G. I. Loeb and published by . This book was released on 1965 with total page 50 pages. Available in PDF, EPUB and Kindle. Book excerpt: The report is a review of recent literature in the field of polypeptide and protein surface chemistry, concentrating on the last decade. Theoretical approaches to polymers at liquid interfaces are considered, and surface measurement techniques are briefly outlined. The various classes of polypeptides are considered, followed by a discussion of proteins in general and specific proteins in particular. Enzymatic activity, structure, and adsorption at various surfaces are considered also. (Author).
Download or read book Proceedings written by and published by . This book was released on 1981 with total page 544 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Fiberglass Science and Technology written by Hong Li and published by Springer Nature. This book was released on 2021-08-20 with total page 555 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book highlights recent developments in fiberglass research and technology development, including high-performance fiberglass chemistry; in-depth glass network structure information derived from the-state-of-the-art spectroscopic measurements, molecular dynamics simulations, and their correlations with properties; fiber surface chemistry in relation to sizing chemistry - a critical part of composite performance; fiber process stability; fundamental understanding of the batch-to-melt conversion processes and melt flow simulations; and environmental concerns such as energy efficiency and emission of volatile species, which are key to environmentally-friendly product manufacturing. The book aims to guide fiberglass researchers and manufacturers towards better awareness and, perhaps, provides potential options for global ecosystem management. More than 500 current references are included, which will enable researchers from fiber glass industry and research institution access to the most recent progress in fiberglass science and technology. Advances scientific understanding of fiberglass-forming processes, rising in popularity as a building material throughout the world; Describes the current advances in the structure and formation of fiber glass, beginning with chemistry, a wide range of characterizations, and processes, through to applications; Contains information on environmental aspects of fiberglass production, addressing energy consumption and emission.
Download or read book Characterization of Integrated Circuit Packaging Materials written by Thomas Moore and published by Elsevier. This book was released on 2013-10-22 with total page 293 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.
Download or read book Advances in Contact Angle Wettability and Adhesion Volume 1 written by K. L. Mittal and published by John Wiley & Sons. This book was released on 2013-08-16 with total page 324 pages. Available in PDF, EPUB and Kindle. Book excerpt: The topic of wettabilty is extremely important from both fundamental and applied aspects. The applications of wettability range from self-cleaning windows to micro- and nanofluidics. This book represents the cumulative wisdom of a contingent of world-class (researchers engaged in the domain of wettability. In the last few years there has been tremendous interest in the "Lotus Leaf Effect" and in understanding its mechanism and how to replicate this effect for myriad applications. The topics of superhydrophobicity, omniphobicity and superhydrophilicity are of much contemporary interest and these are covered in depth in this book.
Download or read book Masters Theses in the Pure and Applied Sciences written by Wade H. Shafer and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 426 pages. Available in PDF, EPUB and Kindle. Book excerpt: Masters Theses in the Pure and Applied Sciences was first conceived, published, and disseminated by the Center for Information and Numerical Data Analysis and Synthesis (CINDAS)* at Purdue University in 1957, starting its coverage of theses with the academic year 1955. Beginning with Volume 13, the printing and dis semination phases of the activity were transferred to University Microfilms/Xerox of Ann Arbor, Michigan, with the thought that such an arrangement would be more beneficial to the academic and general scientific and technical community. After five years of this joint undertaking we had concluded that it was in the interest of all concerned if the printing and distribution of the volumes were handled by an international publishing house to assure improved service and broader dissemination. Hence, starting with Volume 18, Masters Theses in the Pure and Applied Sciences has been disseminated on a worldwide basis by Plenum Publishing Corporation of New York, and in the same year the coverage was broadened to include Canadian universities. All back issues can also be ordered from Plenum. We have reported in Volume 38 (thesis year 1993) a total of 13,787 thesis titles from 22 Canadian and 164 United States universities. We are sure that this broader base for these titles reported will greatly enhance the value of this impor tant annual reference work. While Volume 38 reports theses submitted in 1993, on occasion, certain uni versities do report theses submitted in previous years but not reported at the time.
