Download or read book Substrate Noise Coupling in Mixed Signal ASICs written by Stéphane Donnay and published by Springer Science & Business Media. This book was released on 2006-05-31 with total page 311 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is the first in a series of three dedicated to advanced topics in Mixed-Signal IC design methodologies. It is one of the results achieved by the Mixed-Signal Design Cluster, an initiative launched in 1998 as part of the TARDIS project, funded by the European Commission within the ESPRIT-IV Framework. This initiative aims to promote the development of new design and test methodologies for Mixed-Signal ICs, and to accelerate their adoption by industrial users. As Microelectronics evolves, Mixed-Signal techniques are gaining a significant importance due to the wide spread of applications where an analog front-end is needed to drive a complex digital-processing subsystem. In this sense, Analog and Mixed-Signal circuits are recognized as a bottleneck for the market acceptance of Systems-On-Chip, because of the inherent difficulties involved in the design and test of these circuits. Specially, problems arising from the use of a common substrate for analog and digital components are a main limiting factor. The Mixed-Signal Cluster has been formed by a group of 11 Research and Development projects, plus a specific action to promote the dissemination of design methodologies, techniques, and supporting tools developed within the Cluster projects. The whole action, ending in July 2002, has been assigned an overall budget of more than 8 million EURO.

Download or read book Modeling of Substrate Noise Coupling in Mixed signal Integrated Circuits written by Nawej Mwez and published by . This book was released on 2002 with total page 234 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Analysis and Solutions for Switching Noise Coupling in Mixed Signal ICs written by X. Aragones and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 242 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modern microelectronic design is characterized by the integration of full systems on a single die. These systems often include large high performance digital circuitry, high resolution analog parts, high driving I/O, and maybe RF sections. Designers of such systems are constantly faced with the challenge to achieve compatibility in electrical characteristics of every section: some circuitry presents fast transients and large consumption spikes, whereas others require quiet environments to achieve resolutions well beyond millivolts. Coupling between those sections is usually unavoidable, since the entire system shares the same silicon substrate bulk and the same package. Understanding the way coupling is produced, and knowing methods to isolate coupled circuitry, and how to apply every method, is then mandatory knowledge for every IC designer. Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs is an in-depth look at coupling through the common silicon substrate, and noise at the power supply lines. It explains the elementary knowledge needed to understand these phenomena and presents a review of previous works and new research results. The aim is to provide an understanding of the reasons for these particular ways of coupling, review and suggest solutions to noise coupling, and provide criteria to apply noise reduction. Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs is an ideal book, both as introductory material to noise-coupling problems in mixed-signal ICs, and for more advanced designers facing this problem.

Download or read book Analysis of Substrate Noise Coupling in Mixed Signal Integrated Circuits written by Cole Erwin Zemke and published by . This book was released on 2003 with total page 76 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Resistive Model of Substrate Noise Coupling in Mixed Signal Circuits written by Hongmei Li and published by . This book was released on 2002 with total page 76 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Synthesized Compact Models for Substrate Noise Coupling in Mixed signal ICS written by Hai Lan and published by . This book was released on 2006 with total page 142 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Noise Coupling in System on Chip written by Thomas Noulis and published by CRC Press. This book was released on 2018-01-09 with total page 519 pages. Available in PDF, EPUB and Kindle. Book excerpt: Noise Coupling is the root-cause of the majority of Systems on Chip (SoC) product fails. The book discusses a breakthrough substrate coupling analysis flow and modelling toolset, addressing the needs of the design community. The flow provides capability to analyze noise components, propagating through the substrate, the parasitic interconnects and the package. Using this book, the reader can analyze and avoid complex noise coupling that degrades RF and mixed signal design performance, while reducing the need for conservative design practices. With chapters written by leading international experts in the field, novel methodologies are provided to identify noise coupling in silicon. It additionally features case studies that can be found in any modern CMOS SoC product for mobile communications, automotive applications and readout front ends.

Download or read book Substrate Noise Coupling in Mixed signal Integrated Circuits written by Simon Kristiansson and published by . This book was released on 2007 with total page 120 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Mixed Signal Design Cluster written by and published by . This book was released on 2001 with total page 148 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Substrate Coupling in Mixed Signal IC s written by Elie M. Issa and published by . This book was released on 2007 with total page 98 pages. Available in PDF, EPUB and Kindle. Book excerpt: "Integrating digital with sensitive analog circuitry has created concerns for signal integrity. The fast switching digital signal creates noise that injects through the doped silicon substrate abd travels through it, due to its low resistivity to the analog circuits causing damages and operational bandwidth reduction. How much is the coupling and how to control it? These are the questions that will be answered in this thesis using 3D filed solver, COMSOL, to extract the substrate coupling parameters." (v)

Download or read book Low power HF Microelectronics written by Gerson A. S. Machado and published by IET. This book was released on 1996 with total page 1072 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book brings together innovative modelling, simulation and design techniques in CMOS, SOI, GaAs and BJT to achieve successful high-yield manufacture for low-power, high-speed and reliable-by-design analogue and mixed-mode integrated systems.

Download or read book Modeling and Analysis of Thermally aware Substrate Noise Coupling in Nanometer scale Mixed signal ICs written by Injoon Jo and published by . This book was released on 2004 with total page 124 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Analyse Et Caract risation Des Couplages Substrat Et de la Connectique Dans Les Circuits 3D written by Fengyuan Sun and published by Editions Publibook. This book was released on 2016 with total page 178 pages. Available in PDF, EPUB and Kindle. Book excerpt: The proposal of doubling the number of transistors on an IC chip (with minimum costs and subtle innovations) every 24 months by Gordon Moore in 1965 (the so-called called Moore's law) has been the most powerful driver for the emphasis of the microelectronics industry in the past 50 years. This law enhances lithography scaling and integration, in 2D, of all functions on a single chip, increasingly through system-on-chip (SOC). On the other hand, the integration of all these functions can be achieved through 3D integrations . Generally speaking, 3D integration consists of 3D IC packaging, 3D IC integration, and 3D Si integration. They are different and mostly the TSV (through-silicon via) separates 3D IC packaging from 3D IC/Si integrations since the latter two uses TSVs, but 3D IC packaging does not. TSV (with a new concept that every chip or interposer could have two surfaces with circuits) is the heart of 3D IC/Si integrations. Continued technology scaling together with the integration of disparate technologies in a single chip means that device performance continues to outstrip interconnect and packaging capabilities, and hence there exist many difficult engineering challenges, most notably in power management, noise isolation, and intra and inter-chip communication. 3D Si integration is the right way to go and compete with Moore's law (more than Moore versus more Moore). However, it is still a long way to go. In this book, Fengyuan SUN proposes new substrate network extraction techniques. Using this latter, the substrate coupling and loss in IC's can be analyzed. He implements some Green/TLM (Transmission Line Matrix) algorithms in MATLAB. It permits to extract impedances between any number of embedded contacts or/and TSVS. He does investigate models of high aspect ratio TSV, on both analytical and numerical methods electromagnetic simulations. This model enables to extract substrate and TSV impedance, S parameters and parasitic elements, considering the variable resistivity of the substrate. It is full compatible with SPICE-like solvers and should allow an investigation in depth of TSV impact on circuit performance.

Download or read book Extraction and Simulation Techniques for Substrate coupled Noise in Mixed signal Integrated Circuits written by Nishath K. Verghese and published by . This book was released on 1995 with total page 136 pages. Available in PDF, EPUB and Kindle. Book excerpt: Abstract: "This thesis presents several techniques for the analysis of substrate-coupled noise in mixed-signal integrated circuits. Advantages and limitations of several commonly employed analysis techniques for substrate coupling are outlined. A preprocessed boundary element technique introduced in this thesis is shown to overcome all the limitations of the prior approaches and results that confirm its accuracy and superior performance are presented. Methods are also discussed that dramatically accelerate the solution of the preprocessed boundary element equations. A methodology that applies these fast techniques to the verification of large mixed-signal circuits and results that confirm its efficiency are described. An application of this complete methodology to the design and verification of an industrial mixed-signal video analog-to- digital converter IC for substrate noise problems that ensured its success on first pass silicon is presented."

Download or read book Advances in Analog Circuits written by Esteban Tlelo-Cuautle and published by BoD – Books on Demand. This book was released on 2011-02-02 with total page 384 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book highlights key design issues and challenges to guarantee the development of successful applications of analog circuits. Researchers around the world share acquired experience and insights to develop advances in analog circuit design, modeling and simulation. The key contributions of the sixteen chapters focus on recent advances in analog circuits to accomplish academic or industrial target specifications.

Download or read book Substrate Noise Analysis and Techniques for Mitigation in Mixed signal RF Systems written by Nisha Checka and published by . This book was released on 2005 with total page 158 pages. Available in PDF, EPUB and Kindle. Book excerpt: (Cont.) Existing techniques have prohibitively long simulation times and are only suitable for final verification. Determination of substrate noise coupling during the design phase would be extremely beneficial to circuit designers who can incorporate the effect of the noise and re-design accordingly before fabrication. This would reduce the turn around time for circuits and prevent costly redesign. SNAT can be used at any stage of the design cycle to accurately predict (less than 12% error when compared to measurements) the substrate noise performance of any digital circuit with a large degree of computational efficiency.

Download or read book Integrated Circuit and System Design written by Enrico Macii and published by Springer. This book was released on 2004-08-24 with total page 926 pages. Available in PDF, EPUB and Kindle. Book excerpt: WelcometotheproceedingsofPATMOS2004,thefourteenthinaseriesofint- national workshops. PATMOS 2004 was organized by the University of Patras with technical co-sponsorship from the IEEE Circuits and Systems Society. Over the years, the PATMOS meeting has evolved into an important - ropean event, where industry and academia meet to discuss power and timing aspects in modern integrated circuit and system design. PATMOS provides a forum for researchers to discuss and investigate the emerging challenges in - sign methodologies and tools required to develop the upcoming generations of integrated circuits and systems. We realized this vision this year by providing a technical program that contained state-of-the-art technical contributions, a keynote speech, three invited talks and two embedded tutorials. The technical program focused on timing, performance and power consumption, as well as architectural aspects, with particular emphasis on modelling, design, charac- rization, analysis and optimization in the nanometer era. This year a record 152 contributions were received to be considered for p- sible presentation at PATMOS. Despite the choice for an intense three-day m- ting, only 51 lecture papers and 34 poster papers could be accommodated in the single-track technical program. The Technical Program Committee, with the - sistance of additional expert reviewers, selected the 85 papers to be presented at PATMOS and organized them into 13 technical sessions. As was the case with the PATMOS workshops, the review process was anonymous, full papers were required, and several reviews were received per manuscript.