Download or read book Reliability Physics 1982 written by and published by . This book was released on 1982 with total page 344 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Product Reliability Maintainability and Supportability Handbook written by Michael Pecht and published by CRC Press. This book was released on 1995-05-04 with total page 450 pages. Available in PDF, EPUB and Kindle. Book excerpt: This unique publication addresses the role of reliability, maintainability, and supportability in the life-cycle of a product, in the context of product effectiveness and worth. It emphasizes all aspects of producing an effective electrical or mechanical system. This is the only handbook available on this subject and the only book that is this comprehensive and informative. The Product Reliability, Maintainability, and Supportability Handbook examines the logistics, cost, and the physics of failure-topics never before found in a single volume on reliability. It describes the factors that affect product effectiveness and worth: performance, reliability, design effectiveness and margin for error, availability, affordability, use effectiveness, and logistic effectiveness. The handbook contains 13 in-depth chapters, opening with an introduction on product effectiveness and worth and concluding with reliability and maintainability data that can be combined with performance data to assess overall effectiveness of the product. The pages are filled with valuable information that can be easily and quickly put to practical use. Basic principles of the mathematical theory of probability and necessary background are provided. Concepts and basic theory of reliability in terms of probability and statistical inference are also given. Techniques for deriving probabilistic models from observational data as well as reliability models and associated validation techniques are detailed. Software and software reliability, quality, and safety are all covered, including the development life-cycle process and mechanisms by which software errors are introduced. The book presents design guidelines and techniques and the requirements for materials, manufacturing, and assembly. Learn how to analyze the reliability of redundant and fault-tolerant products. Use the methods for modeling and analyzing failures of repairable products that normally exhibit wearout characteristics. The Product Reliability, Maintainability, and Supportability Handbook also provides reliability improvement techniques to improve the competitiveness of existing products. The book includes helpful summaries and numerous problem sections to reinforce and test learned information. This reference source is the guide that professionals and technical managers should turn to when they need a comprehensive and detailed overview of everything that goes into producing systems and products that meet customer needs in an effective and timely manner.
Download or read book Reliability Physics 1984 written by and published by . This book was released on 1984 with total page 332 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book CRC Handbook of Thermal Engineering written by Raj P. Chhabra and published by CRC Press. This book was released on 2017-11-08 with total page 1801 pages. Available in PDF, EPUB and Kindle. Book excerpt: The CRC Handbook of Thermal Engineering, Second Edition, is a fully updated version of this respected reference work, with chapters written by leading experts. Its first part covers basic concepts, equations and principles of thermodynamics, heat transfer, and fluid dynamics. Following that is detailed coverage of major application areas, such as bioengineering, energy-efficient building systems, traditional and renewable energy sources, food processing, and aerospace heat transfer topics. The latest numerical and computational tools, microscale and nanoscale engineering, and new complex-structured materials are also presented. Designed for easy reference, this new edition is a must-have volume for engineers and researchers around the globe.
Download or read book ULSI Science and Technology 1987 written by S. Broydo and published by . This book was released on 1987 with total page 874 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Reliability Abstracts and Technical Reviews written by and published by . This book was released on 1966 with total page 556 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Reliability Wearout Mechanisms in Advanced CMOS Technologies written by Alvin W. Strong and published by John Wiley & Sons. This book was released on 2009-10-13 with total page 642 pages. Available in PDF, EPUB and Kindle. Book excerpt: This invaluable resource tells the complete story of failure mechanisms—from basic concepts to the tools necessary to conduct reliability tests and analyze the results. Both a text and a reference work for this important area of semiconductor technology, it assumes no reliability education or experience. It also offers the first reference book with all relevant physics, equations, and step-by-step procedures for CMOS technology reliability in one place. Practical appendices provide basic experimental procedures that include experiment design, performing stressing in the laboratory, data analysis, reliability projections, and interpreting projections.
Download or read book Speciality Polymers Polymer Physics written by and published by Springer. This book was released on 2006-01-21 with total page 202 pages. Available in PDF, EPUB and Kindle. Book excerpt: Das Buch enthält Kapitel über: N. Kinjo, M. Ogata, Ibaraki-ken; K. Nishi, Tokyo; A. Kaneda, Yokohama, Japan: Epoxyd-Formmassen als Einschlu€materialien für mikroelektronische Geräte Yu.S. Lipatov, T.E. Lipatova, L.F. Kosyanchuk, Kiev, UdSSR: Synthese und Struktur struktureller Makromoleküle K. Horie, I. Mita, Tokyo, Japan: Reaktionen und Photodynamik in polymeren Festkörpern Yu.K. Godovsky, V.S. Papkov, Moskau, UdSSR: Thermotrope Mesophasen elementorganischer Polymere.
Download or read book Microelectronics Packaging Handbook written by R.R. Tummala and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 742 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies. from mainframe and supercomputer applications at any cost. to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example. going from $500IMIP when products were first introduced in 1981, to a projected $lIMIP within 10 years. Thin. light portable. user friendly and very low-cost are. therefore. the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection. powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
Download or read book Electronic Materials Handbook written by and published by ASM International. This book was released on 1989-11-01 with total page 1234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Download or read book Handbook of Electrostatic Processes written by Jen-Shih Chang and published by CRC Press. This book was released on 2018-12-14 with total page 780 pages. Available in PDF, EPUB and Kindle. Book excerpt: "Provides detailed, comprehensive descriptions of electrostatic processes as well as their applications in areas such as rheology, atomization and spraying, industrial dust particle precipitation and filtering, biomedical engineering, gas treatments, atmospheric electricity, chemical reactors, and electronic devices. Summarizes electrostatic fundamentals and electrical phenomena in solids and fluids."
Download or read book Failure Analysis of Integrated Circuits written by Lawrence C. Wagner and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 256 pages. Available in PDF, EPUB and Kindle. Book excerpt: This "must have" reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.
Download or read book Microelectronics Fialure Analysis Desk Reference Seventh Edition written by Tejinder Gandhi and published by ASM International. This book was released on 2019-11-01 with total page 719 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.
Download or read book Electrostatic Discharge Control Handbook for Protection of Electrical and Electronic Parts Assemblies and Equipment excluding Electrically Initiated Explosive Devices metric written by United States. Department of Defense and published by . This book was released on 1991 with total page 168 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microelectronic Failure Analysis written by and published by ASM International. This book was released on 2002-01-01 with total page 160 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides new or expanded coverage on the latest techniques for microelectronic failure analysis. The CD-ROM includes the complete content of the book in fully searchable Adobe Acrobat format. Developed by the Electronic Device Failure Analysis Society (EDFAS) Publications Committee
Download or read book Microelectronics Manufacturing Diagnostics Handbook written by Abraham Landzberg and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 663 pages. Available in PDF, EPUB and Kindle. Book excerpt: The world of microelectronics is filled with cusses measurement systems, manufacturing many success stories. From the use of semi control techniques, test, diagnostics, and fail ure analysis. It discusses methods for modeling conductors for powerful desktop computers to their use in maintaining optimum engine per and reducing defects, and for preventing de formance in modem automobiles, they have fects in the first place. The approach described, clearly improved our daily lives. The broad while geared to the microelectronics world, has useability of the technology is enabled, how applicability to any manufacturing process of similar complexity. The authors comprise some ever, only by the progress made in reducing their cost and improving their reliability. De of the best scientific minds in the world, and fect reduction receives a significant focus in our are practitioners of the art. The information modem manufacturing world, and high-quality captured here is world class. I know you will diagnostics is the key step in that process. find the material to be an excellent reference in of product failures enables step func Analysis your application. tion improvements in yield and reliability. which works to reduce cost and open up new Dr. Paul R. Low applications and technologies. IBM Vice President and This book describes the process ofdefect re of Technology Products General Manager duction in the microelectronics world.
Download or read book Japanese Science and Technology 1983 1984 written by United States. National Aeronautics and Space Administration. Scientific and Technical Information Branch and published by . This book was released on 1985 with total page 1080 pages. Available in PDF, EPUB and Kindle. Book excerpt: