Download or read book Fifteenth IEEE CHMT International Electronics Manufacturing Technology Symposium written by Albert Blodgett and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1993 with total page 504 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Electronic Enclosures Housings and Packages written by Frank Suli and published by Woodhead Publishing. This book was released on 2018-11-01 with total page 490 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and potential future directions.

Download or read book Advances in Internet Data and Web Technologies written by Leonard Barolli and published by Springer Nature. This book was released on 2021-03-22 with total page 380 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents original contributions to the theories and practices of emerging Internet, data and web technologies and their applicability in businesses, engineering and academia. The Internet has become the most proliferative platform for emerging large-scale computing paradigms. Among these, data and web technologies are two most prominent paradigms, in a variety of forms such as data centers, cloud computing, mobile cloud, mobile web services and so on. These technologies altogether create a digital ecosystem whose cornerstone is the data cycle, from capturing to processing, analysis and visualization. The investigation of various research and development issues in this digital ecosystem is boosted by the ever-increasing needs of real-life applications, which are based on storing and processing large amounts of data. As a key feature, this book addresses advances in the life cycle exploitation of data generated from the digital ecosystem data technologies that create value for the knowledge and businesses toward a collective intelligence approach. Researchers, software developers, practitioners and students interested in the field of data and web technologies will find this book useful and a reference for their activity.

Download or read book Powder Technology written by Alberto Adriano Cavalheiro and published by BoD – Books on Demand. This book was released on 2018-09-26 with total page 162 pages. Available in PDF, EPUB and Kindle. Book excerpt: Powder Technology comprehends several particulate solid systems, which must be controlled, from the nucleation stages to the final application of derivative materials. Powder characteristics depend on the synthesis method, which can be a simple solid-state reaction followed by attrition milling, mechanosynthesis, or chemical methods, such as the sol-gel method. Powder technology is an important interdisciplinary area, which can provide solutions to several application fields. The book Powder Technology contains several peer-reviewed chapters organized in two sections. Section 1 is focused on metal and composites powders and Section 2 contains chapters on non-metallic powders. I sincerely hope that the contents of this book will help in the dissemination of knowledge to researchers and students working with powder technology.

Download or read book 1993 Japan IEMT Symposium written by IEEE Components, Hybrids, and Manufacturing Technology Society and published by . This book was released on 1993 with total page 426 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Interconnect Reliability in Advanced Memory Device Packaging written by Chong Leong, Gan and published by Springer Nature. This book was released on 2023-05-30 with total page 223 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects. This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.

Download or read book Science Abstracts written by and published by . This book was released on 1993 with total page 2332 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Seventeenth IEEE CPMT International Electronics Manufacturing Technology Symposium October 2 4 1995 Austin TX USA written by Walt Trybula and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1995 with total page 536 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book IEEE CPMT International Electronics Manufacturing Technology Symposium written by and published by . This book was released on 1994 with total page 420 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Photosensitive Polyimides written by Takashi Yamashita and published by Routledge. This book was released on 2017-10-19 with total page 341 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is the first book to provide an in-depth presentation of photosensitive polyimides for electronic and photonic applications. The authors are leading specialists in this field from Japan, Europe and the U.S. From the Preface Aromatic polyimides were developed originally as thermostable flexible polymer films for space applications. Now polyimides have found widespread use in the manufacture of electronic devices and have been employed in increasingly diverse areas of electronics and information technology. In addition to their excellent thermal stability and high processability, a wide range of chemical and physical properties provided by molecular engineering makes polyimides highly versatile in the electronics and information industries. Lithography of polyimides is an inevitable process in using polyimides for microelectronic fields, and hence increasing research has been devoted to developing photosensitive polyimides, which make it unnecessary to use photoresists for patterning polyimides and diminishing markedly the number of steps in fabrication of various electronic devices. In addition, the development of technology of photosensitive polyimides is expected to play a great role in manufacturing photonic devices in the near future, when the design and control of hyper fine structures . . . including higher thermal stability and better processability would be essential.

Download or read book Nineteenth IEEE CPMT International Electronics Manufacturing Technology Symposium written by and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1996 with total page 520 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Index to IEEE Publications written by Institute of Electrical and Electronics Engineers and published by . This book was released on 1990 with total page 594 pages. Available in PDF, EPUB and Kindle. Book excerpt: Issues for 1973- cover the entire IEEE technical literature.

Download or read book Microelectronics Packaging Handbook written by R.R. Tummala and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 1060 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

Download or read book written by 国立国会図書館 (Japan) and published by . This book was released on 1972 with total page 1528 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Electronic Materials Handbook written by and published by ASM International. This book was released on 1989-11-01 with total page 1234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.

Download or read book Index of Conference Proceedings written by British Library. Document Supply Centre and published by . This book was released on 1994 with total page 988 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Advanced Electronic Packaging written by Richard K. Ulrich and published by John Wiley & Sons. This book was released on 2006-02-24 with total page 852 pages. Available in PDF, EPUB and Kindle. Book excerpt: As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.