Download or read book Polymers for Integrated Optical Interconnects written by and published by . This book was released on 1996 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Polymer based Integrated Photonic Devices for Interconnects written by Zeyu Pan and published by . This book was released on 2018 with total page 186 pages. Available in PDF, EPUB and Kindle. Book excerpt: Integrated photonic devices based on optical waveguides have been extensively studied for various applications, especially the high-speed intra- and inter-chip interconnects. Usually, a waveguide contains a core with high refractive index and cladding with lower refractive index. Among various waveguides, silicon, polymer, and silicon-polymer hybrid devices are the most promising candidates for low cost, small size, light weight, and low power consumption (CSWaP) optical interconnect. Firstly, silicon-based optical devices can be fabricated using CMOS compatible nanofabrication technology, which is already widely used to manufacture integrated circuits. Silicon photonic devices can have very small footprint and enable high density photonic circuits, due to high refractive index contrast. However, one of the intrinsic obstacles is the absence of [chi](2)-nonlinearity in unstrained silicon due to its centrosymmetric crystal structure, making modulating photons on silicon platform a great challenge. Secondly, polymer-based devices have been found very attractive, owing to the advantages of high thermo-optic (TO) or electro-optic (EO) coefficient, high transparency in the telecommunication wavelength windows, and fabrication feasibility over large areas on printed circuit board (PCB) or other kinds of substrates. The roll-to-roll (R2R) compatible imprinting and ink-jet printing for developing polymer-based devices on flexible or rigid substrates enable large-area, light-weight, low-cost optical interconnects. However, due to the low refractive index contrast, the polymer photonic devices always require large footprint. Finally, the silicon-organic hybrid (SOH) platform enables the marriage of the best of these two materials and thus has been receiving substantial attention. In this dissertation, integrated photonic devices based on silicon, polymer, or hybrid platform will be presented. First, high-efficiency quasi-vertical tapers for polymer waveguide based inter-board optical interconnects will be demonstrated. A triangular-shape tapered structure is adopted above the waveguide core to transform a fiber mode into a single mode polymer rib waveguide mode as an optical mode transformer. A coupling loss of 1.79±0.30 dB and 2.23±0.31 dB per coupler for the quasi-TM and quasi-TE mode respectively have been experimentally demonstrated, across the C and L bands (1535 nm – 1610 nm). Then, a reconfigurable thermo-optic polymer switch based true-time-delay network will be analyzed and demonstrated. Thirdly, I will show a novel subwavelength-grating waveguide ring resonator based high-speed modulators, which is the largest bandwidth and the most compact footprint that has been demonstrated for the ring resonators on the silicon-organic hybrid (SOH) platform. Finally, the on-chip time-division multiplexing and de-multiplexing system will be designed and analyzed.
Download or read book Advanced Materials for Integrated Optical Waveguides written by Xingcun Colin Tong Ph.D and published by Springer Science & Business Media. This book was released on 2013-10-17 with total page 574 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a comprehensive introduction to integrated optical waveguides for information technology and data communications. Integrated coverage ranges from advanced materials, fabrication, and characterization techniques to guidelines for design and simulation. A concluding chapter offers perspectives on likely future trends and challenges. The dramatic scaling down of feature sizes has driven exponential improvements in semiconductor productivity and performance in the past several decades. However, with the potential of gigascale integration, size reduction is approaching a physical limitation due to the negative impact on resistance and inductance of metal interconnects with current copper-trace based technology. Integrated optics provides a potentially lower-cost, higher performance alternative to electronics in optical communication systems. Optical interconnects, in which light can be generated, guided, modulated, amplified, and detected, can provide greater bandwidth, lower power consumption, decreased interconnect delays, resistance to electromagnetic interference, and reduced crosstalk when integrated into standard electronic circuits. Integrated waveguide optics represents a truly multidisciplinary field of science and engineering, with continued growth requiring new developments in modeling, further advances in materials science, and innovations in integration platforms. In addition, the processing and fabrication of these new devices must be optimized in conjunction with the development of accurate and precise characterization and testing methods. Students and professionals in materials science and engineering will find Advanced Materials for Integrated Optical Waveguides to be an invaluable reference for meeting these research and development goals.
Download or read book Self Organized 3D Integrated Optical Interconnects written by Tetsuzo Yoshimura and published by CRC Press. This book was released on 2021-03-09 with total page 364 pages. Available in PDF, EPUB and Kindle. Book excerpt: Currently, light waves are ready to come into boxes of computers in high-performance computing systems like data centers and super computers to realize intra-box optical interconnects. For inter-box optical interconnects, light waves have successfully been introduced by OE modules, in which discrete bulk-chip OE/electronic devices are assembled using the flip-chip-bonding-based packaging technology. OE modules, however, are not applicable to intra-box optical interconnects, because intra-box interconnects involve “short line distances of the cm–mm order” and “large line counts of hundreds-thousands.” This causes optics excess, namely, excess components, materials, spaces, fabrication efforts for packaging, and design efforts. The optics excess raises sizes and costs of intra-box optical interconnects enormously when they are built using conventional OE modules. This book proposes the concept of self-organized 3D integrated optical interconnects and the strategy to reduce optics excess in intra-box optical interconnects.
Download or read book Optical Polymers in High Speed Board Level Optical Interconnects written by and published by Information Gatekeepers Inc. This book was released on with total page 26 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Polymer Based Integrated Photonic Devices for Highly Parallel Optical Interconnects written by and published by . This book was released on 1997 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: We have solved the crosslinker crystallization problem which has been a major bottleneck for several years. A new method of electrooptic measurenment is invented which has the advantage of being able to accurately measure r33 and r13 separately with a high accuracy. A theory of TE-TM mode conversion in tilted-poled NLO waveguides is developed. A new polarization-independent Mach-Zehnder modulator is designed and fabricated by using this theory. This device uses continuous modulation electrodes, thereby allowing the employment of traveling-wave modulation to achieve extremely high speed. Primary polarization-independent devices and directional-coupler devices have been fabricated. Further design and fabrication of new high performance electrooptic devices are under investigation.
Download or read book Integrated Optical Interconnect Architectures for Embedded Systems written by Ian O'Connor and published by Springer Science & Business Media. This book was released on 2012-11-07 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a broad overview of current research in optical interconnect technologies and architectures. Introductory chapters on high-performance computing and the associated issues in conventional interconnect architectures, and on the fundamental building blocks for integrated optical interconnect, provide the foundations for the bulk of the book which brings together leading experts in the field of optical interconnect architectures for data communication. Particular emphasis is given to the ways in which the photonic components are assembled into architectures to address the needs of data-intensive on-chip communication, and to the performance evaluation of such architectures for specific applications.
Download or read book Design and Fabrication of Optical Polymer Waveguide Devices for Optical Interconnects and Integrated Optical Coherence Tomography written by Guomin Jiang and published by . This book was released on 2015 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Optical interconnects is a promising technique to boost the speed of electronic systems through replacing high speed electrical data buses using optical ones. Optical coherence tomography is an attractive imaging technique that has been widely used in medical imaging applications with capability of high resolution subsurface cross sectional imaging in living tissues. Both the optical interconnects and the optical coherence tomography imaging may benefit from the use of integrated optics technology in particular polymer waveguides that can be designed and fabricated to improve the device capability, system compactness, and performance reliability. In this dissertation, we first present our innovative design and realization on the polymer waveguides with 45° integrated mirrors for optical interconnects using the vacuum assisted microfluidic (VAM) soft lithography. VAM is a new microfluidic based replication technique which can be utilized to improve the performance of imprinted devices by eliminating the residue planar layer and accomplish complex devices incorporating different materials in the same layer. A prism-assisted inclined UV lithography technique is introduced to increase the slanted angles of the side walls of the microstructures and to fabricate multidirectional slanted microstructures. It is also used to fabricate 45° integrated mirrors in polymer waveguides to support surface normal optical coupling for optical interconnects. A dynamic card-to-backplane optical interconnects system has also been demonstrated based on polymer waveguides with tunable optofluidic couplers. The operation of the tunable optofluidic coupler is accomplished by controlling the position of air bubbles and index matching liquid in the perpendicular microfluidic channel for refractive index modulation. The dynamic activation and deactivation of the backplane optofluidic couplers can save the optical signal power. 10 Gbps eye diagrams of the dynamic optical interconnect link have been demonstrated showing the needed high performance optical interconnection. The design and fabrication of planar concave grating (PCG) wavelength demultiplexer on SU-8 polymer waveguides is presented for wavelength division multiplexing system to further support optical interconnection applications. The PCG wavelength demultiplexers with a flattened spectral response are accomplished by innovative design of a multi-mode interference coupler as input to the PCG. The mode field distribution at the PCG planar input is controlled by adjusting the width of an input waveguide taper connected to multi-mode interference coupler. By extending the channel number and density, the PCG wavelength demultiplexer can become a compact optical spectrometer which could be used to realize a portable optical coherence tomography system. The design of a 200-channel and a 1024-channel PCG spectrometers with low crosstalk, small channel loss, good uniformity, and chip size of 3 cm x 3 cm and 8 cm x 8 cm, respectively, has been performed. An alternative quicker solution using cylindrical optics with a vertical beam size of about 3 mm in the diffraction plane is also demonstrated to achieve a compact optical spectrometer, which is capable of supporting optical coherence tomography subsurface imaging applications.
Download or read book Polymers for Electronic Photonic Application written by C. P. Wong and published by Elsevier. This book was released on 2013-10-22 with total page 676 pages. Available in PDF, EPUB and Kindle. Book excerpt: The most recent advances in the use of polymeric materials by the electronic industry can be found in Polymers for Electronic and Photonic Applications. This bookprovides in-depth coverage of photoresis for micro-lithography, microelectronic encapsulants and packaging, insulators, dielectrics for multichip packaging,electronic and photonic applications of polymeric materials, among many other topics. Intended for engineers and scientists who design, process, and manufacturemicroelectronic components, this book will also prove useful for hybrid and systems packaging managers who want to be informed of the very latest developments inthis field. * Presents most recent advances in the use of polymeric materials by the electronic industry* Contributions by foremost experts in the field
Download or read book Silicon Polymer Hybrid Integrated Microwave Photonic Devices for Optical Interconnects and Electromagnetic Wave Detection written by Xingyu Zhang and published by . This book was released on 2015 with total page 532 pages. Available in PDF, EPUB and Kindle. Book excerpt: The accelerating increase in information traffic demands the expansion of optical access network systems that require high-performance optical and photonic components. In short-range communication links, optical interconnects have been widely accepted as a viable approach to solve the problems that copper based electrical interconnects have encountered in keeping up with the surge in the data rate demand over the last decades. Low cost, ease of fabrication, and integration capabilities of low optical-loss polymers make them attractive for integrated photonic applications to support futuristic data communication networks. In addition to passive wave-guiding components, electro-optic (EO) polymers consisting of a polymeric matrix doped with organic nonlinear chromophores have enabled wide-RF-bandwidth and low-power active photonic devices. Beside board level passive and active optical components, on-chip micro- or nano-photonic devices have been made possible by the hybrid integration of EO polymers onto the silicon platform. In recent years, silicon photonics have attracted a significant amount of attentions, because it offers compact device size and the potential of complementary metal-oxide-semiconductor (CMOS) compatible photonic integrated circuits. The combination of silicon photonics and EO polymers can enable miniaturized and high-performance hybrid integrated photonic devices, such as electro-optic modulators, optical interconnects, and microwave photonic sensors. Silicon photonic crystal waveguides (PCWs) exhibit slow-light effects which are beneficial for device miniaturization. Especially, EO polymer filled silicon slotted PCWs further reduce the device size and enhance the device performance by combining the best of these two systems. The potential applications of these silicon-polymer hybrid integrated devices include not only optical interconnects, but also optical sensing and microwave photonics. In this dissertation, the design, fabrication, and characterization of several types of silicon-polymer hybrid photonic devices will be presented, including EO polymer filled silicon PCW modulators for on-chip optical interconnects, antenna-coupled optical modulators for electromagnetic wave detections, and low-loss strip-to-slot PCW mode converters. In addition, some polymer-based devices and silicon-based photonic devices will also be presented, such as traveling wave electro-optic polymer modulators based on domain-inversion directional couplers, and silicon thermo-optic switches based on coupled photonic crystal microcavities. Furthermore, some microwave (or RF) components such as integrated broadband bowtie antennas for microwave photonic applications will be covered. Some on-going work or suggested future work will also be introduced, including in-device pyroelectric poling for EO polymer filled silicon slot PCWs, millimeter- or Terahertz-wave sensors based on EO polymer filled plasmonic slot waveguide, low-loss silicon-polymer hybrid slot photonic crystal waveguides fabricated by CMOS foundry, logic devices based on EO polymer microring resonators, and so on.
Download or read book Integrated Optics written by Robert G. Hunsperger and published by Springer Science & Business Media. This book was released on 2009-04-29 with total page 525 pages. Available in PDF, EPUB and Kindle. Book excerpt: Integrated Optics explains the subject of optoelectronic devices and their use in integrated optics and fiber optic systems. The approach taken is to emphasize the physics of how devices work and how they can be (and have been) used in various applications as the field of optoelectronics has progressed from microphotonics to nanophotonics. Illustrations and references from technical journals have been used to demonstrate the relevance of the theory to currently important topics in industry. By reading this book, scientists, engineers, students and engineering managers can obtain an overall view of the theory and the most recent technology in Integrated Optics.
Download or read book Optical Interconnects written by Ray T. Chen and published by Morgan & Claypool Publishers. This book was released on 2007 with total page 105 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes fully embedded board level optical interconnect in detail including the fabrication of the thin-film VCSEL array, its characterization, thermal management, the fabrication of optical interconnection layer, and the integration of devices on a flexible waveguide film. All the optical components are buried within electrical PCB layers in a fully embedded board level optical interconnect. Therefore, we can save foot prints on the top real estate of the PCB and relieve packaging difficulty reduced by separating fabrication processes. To realize fully embedded board level optical interconnects, many stumbling blocks need to be addressed such as thin-film transmitter and detector, thermal management, process compatibility, reliability, cost effective fabrication process, and easy integration. The material presented eventually will relieve such concerns and make the integration of optical interconnection highly feasible. The hybrid integration of the optical interconnection layer and electrical layers is ongoing.
Download or read book Optical Fiber Telecommunications Volume VIA written by Ivan Kaminow and published by Academic Press. This book was released on 2013-05-03 with total page 795 pages. Available in PDF, EPUB and Kindle. Book excerpt: Optical Fiber Telecommunications VI (A&B) is the sixth in a series that has chronicled the progress in the R&D of lightwave communications since the early 1970s. Written by active authorities from academia and industry, this edition brings a fresh look to many essential topics, including devices, subsystems, systems and networks. A central theme is the enabling of high-bandwidth communications in a cost-effective manner for the development of customer applications. These volumes are an ideal reference for R&D engineers and managers, optical systems implementers, university researchers and students, network operators, and investors. Volume A is devoted to components and subsystems, including photonic integrated circuits, multicore and few-mode fibers, photonic crystals, silicon photonics, signal processing, and optical interconnections.
Download or read book Electrical and Optical Polymer Systems written by Donald L. Wise and published by CRC Press. This book was released on 1998-03-27 with total page 1256 pages. Available in PDF, EPUB and Kindle. Book excerpt: "Offers background information, methods of characterization, and applications for electrical and optical polymers, including biopolymers, and tutorial sections that explain how to use the techniques."
Download or read book Optical Fiber Telecommunications VIA written by Nikos Bamiedakis and published by Elsevier Inc. Chapters. This book was released on 2013-05-03 with total page 65 pages. Available in PDF, EPUB and Kindle. Book excerpt: Optical interconnection technologies are increasingly deployed in high-performance electronic systems to address challenges in connectivity, size, bandwidth, latency, and cost. Projected performance requirements are leading to formidable cost and energy efficiency challenges. Hybrid and integrated photonic technologies are currently being developed to reduce assembly complexity and to reduce the numbers of individually packaged parts. This chapter provides an overview of the important challenges that photonics currently face, identifies the various optical technologies that are being considered for use at the different interconnection levels, and presents examples of demonstrated state-of-the-art optical interconnection systems. Finally, the prospects and potential of these technologies in the near future are discussed.
Download or read book Heterogeneous Integrations written by John H. Lau and published by Springer. This book was released on 2019-04-03 with total page 368 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.
Download or read book VLSI Micro and Nanophotonics written by El-Hang Lee and published by CRC Press. This book was released on 2018-09-03 with total page 632 pages. Available in PDF, EPUB and Kindle. Book excerpt: Addressing the growing demand for larger capacity in information technology, VLSI Micro- and Nanophotonics: Science, Technology, and Applications explores issues of science and technology of micro/nano-scale photonics and integration for broad-scale and chip-scale Very Large Scale Integration photonics. This book is a game-changer in the sense that it is quite possibly the first to focus on "VLSI Photonics". Very little effort has been made to develop integration technologies for micro/nanoscale photonic devices and applications, so this reference is an important and necessary early-stage perspective on this field. New demand for VLSI photonics brings into play various technological and scientific issues, as well as evolutionary and revolutionary challenges—all of which are discussed in this book. These include topics such as miniaturization, interconnection, and integration of photonic devices at micron, submicron, and nanometer scales. With its "disruptive creativity" and unparalleled coverage of the photonics revolution in information technology, this book should greatly impact the future of micro/nano-photonics and IT as a whole. It offers a comprehensive overview of the science and engineering of micro/nanophotonics and photonic integration. Many books on micro/nanophotonics focus on understanding the properties of individual devices and their related characteristics. However, this book offers a full perspective from the point of view of integration, covering all aspects of benefits and advantages of VLSI-scale photonic integration—the key technical concept in developing a platform to make individual devices and components useful and practical for various applications.
