Download or read book Polymer Based Integrated Photonic Devices for Highly Parallel Optical Interconnects written by and published by . This book was released on 1997 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: We have solved the crosslinker crystallization problem which has been a major bottleneck for several years. A new method of electrooptic measurenment is invented which has the advantage of being able to accurately measure r33 and r13 separately with a high accuracy. A theory of TE-TM mode conversion in tilted-poled NLO waveguides is developed. A new polarization-independent Mach-Zehnder modulator is designed and fabricated by using this theory. This device uses continuous modulation electrodes, thereby allowing the employment of traveling-wave modulation to achieve extremely high speed. Primary polarization-independent devices and directional-coupler devices have been fabricated. Further design and fabrication of new high performance electrooptic devices are under investigation.

Download or read book Polymer based Integrated Photonic Devices for Interconnects written by Zeyu Pan and published by . This book was released on 2018 with total page 186 pages. Available in PDF, EPUB and Kindle. Book excerpt: Integrated photonic devices based on optical waveguides have been extensively studied for various applications, especially the high-speed intra- and inter-chip interconnects. Usually, a waveguide contains a core with high refractive index and cladding with lower refractive index. Among various waveguides, silicon, polymer, and silicon-polymer hybrid devices are the most promising candidates for low cost, small size, light weight, and low power consumption (CSWaP) optical interconnect. Firstly, silicon-based optical devices can be fabricated using CMOS compatible nanofabrication technology, which is already widely used to manufacture integrated circuits. Silicon photonic devices can have very small footprint and enable high density photonic circuits, due to high refractive index contrast. However, one of the intrinsic obstacles is the absence of [chi](2)-nonlinearity in unstrained silicon due to its centrosymmetric crystal structure, making modulating photons on silicon platform a great challenge. Secondly, polymer-based devices have been found very attractive, owing to the advantages of high thermo-optic (TO) or electro-optic (EO) coefficient, high transparency in the telecommunication wavelength windows, and fabrication feasibility over large areas on printed circuit board (PCB) or other kinds of substrates. The roll-to-roll (R2R) compatible imprinting and ink-jet printing for developing polymer-based devices on flexible or rigid substrates enable large-area, light-weight, low-cost optical interconnects. However, due to the low refractive index contrast, the polymer photonic devices always require large footprint. Finally, the silicon-organic hybrid (SOH) platform enables the marriage of the best of these two materials and thus has been receiving substantial attention. In this dissertation, integrated photonic devices based on silicon, polymer, or hybrid platform will be presented. First, high-efficiency quasi-vertical tapers for polymer waveguide based inter-board optical interconnects will be demonstrated. A triangular-shape tapered structure is adopted above the waveguide core to transform a fiber mode into a single mode polymer rib waveguide mode as an optical mode transformer. A coupling loss of 1.79±0.30 dB and 2.23±0.31 dB per coupler for the quasi-TM and quasi-TE mode respectively have been experimentally demonstrated, across the C and L bands (1535 nm – 1610 nm). Then, a reconfigurable thermo-optic polymer switch based true-time-delay network will be analyzed and demonstrated. Thirdly, I will show a novel subwavelength-grating waveguide ring resonator based high-speed modulators, which is the largest bandwidth and the most compact footprint that has been demonstrated for the ring resonators on the silicon-organic hybrid (SOH) platform. Finally, the on-chip time-division multiplexing and de-multiplexing system will be designed and analyzed.

Download or read book Polymers for Integrated Optical Interconnects written by and published by . This book was released on 1996 with total page 10 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is the final report of a three-year, Laboratory-Directed Research and Development (LDRD) project at the Los Alamos National Laboratory (LANL). The recent discovery of electroluminescent polymers opens up, for the first time, the possibility of using optical interconnects for conventional silicon integrated circuits (ICs). If this capability can be realized, it will have a tremendous impact on the architecture and performance of complex computing and communication systems. The primary objective of this project was to understand the light-emission mechanism of electroluminescent polymers and to use this knowledge to make efficient light-emitting-polymer diodes (LEPDs). These devices are the critical missing element for a polymer-based integrated-optical interconnect technology. The authors studied and obtained experimental results in several areas including the energetic position of fundamental excitation, the degradation of the polymer caused by oxygen, and the luminescence efficiency of polymer and oligomers. Parallel to the experimental effort, theoretical calculations were performed on the microscopic scale and on the device scale.

Download or read book Sol gel and Polymer Photonic Devices written by Mark P. Andrews and published by SPIE-International Society for Optical Engineering. This book was released on 1997 with total page 466 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.

Download or read book Polymers for Photonics Applications I written by K.-S. Lee and published by Springer Science & Business Media. This book was released on 2002-01-11 with total page 273 pages. Available in PDF, EPUB and Kindle. Book excerpt: The two special volumes of Advances in Polymer Science entitled "Polymers for Photonics Applications" provide authoritative and critical reviews of up-to-date research and advances in various fields of photonic polymers as well as their promising applications. Eight articles contributed by internationally recognized scientists are concerned with polymers for second- and third-order nonlinear optics, quadratic parametric interactions in polymer waveguides, electroluminescent polymers for light sources, photoreflective polymers for holographic information storage, and highly efficient two-photon absorbing organics and polymers, including their applications. This review should provide individuals working in the field of photonic polymers with invaluable scientific knowledge on the state of the art while giving directions for future research to those deeply interested.

Download or read book High Speed Photonic Devices written by Nadir Dagli and published by CRC Press. This book was released on 2006-09-29 with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt: With the ongoing, worldwide installation of 40 Gbit/s fiber optic transmission systems, there is an urgency to learn more about the photonic devices supporting this technology. Focusing on the components used to generate, modulate, and receive optical signals, High-Speed Photonic Devices presents the state-of- the-art enabling technologies behind h

Download or read book Proceedings of the Fourth International Conference Massively Parallel Processing Using Optical Interconnections written by Joseph W. Goodman and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1997 with total page 232 pages. Available in PDF, EPUB and Kindle. Book excerpt: This text covers the subjects of computer architecture and parallel and high-performance computing.

Download or read book Optical Engineering written by and published by . This book was released on 2000 with total page 870 pages. Available in PDF, EPUB and Kindle. Book excerpt: Publishes papers reporting on research and development in optical science and engineering and the practical applications of known optical science, engineering, and technology.

Download or read book Optical Fiber Telecommunications Volume VIA written by Ivan Kaminow and published by Academic Press. This book was released on 2013-05-03 with total page 795 pages. Available in PDF, EPUB and Kindle. Book excerpt: Optical Fiber Telecommunications VI (A&B) is the sixth in a series that has chronicled the progress in the R&D of lightwave communications since the early 1970s. Written by active authorities from academia and industry, this edition brings a fresh look to many essential topics, including devices, subsystems, systems and networks. A central theme is the enabling of high-bandwidth communications in a cost-effective manner for the development of customer applications. These volumes are an ideal reference for R&D engineers and managers, optical systems implementers, university researchers and students, network operators, and investors. Volume A is devoted to components and subsystems, including photonic integrated circuits, multicore and few-mode fibers, photonic crystals, silicon photonics, signal processing, and optical interconnections.

Download or read book Optoelectronic Interconnects written by and published by . This book was released on 1999 with total page 406 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Highly Integrated Polymer Photonic Switching and Interconnects written by Xiaolong Wang and published by . This book was released on 2006 with total page 122 pages. Available in PDF, EPUB and Kindle. Book excerpt: As we move from long-distance network to short distance reach, optics encounters increasing difficulties in terms of packaging, reliability and system cost. However, with the rapid increasing speed and complexity of VLSI technology, electrical interconnects will fail to provide sufficient bandwidth beyond 10GHz after 2012. There does exist an opportunity for the continuing exploration of optics to complement or even replace the conventional board level electrical interconnects. An innovative approach with a fully embedded structure is anticipated to overcome the technical and cost barriers that prohibit the realization of optical interconnects in board levels. In the second half of this dissertation, technology efforts projected to relieve the concerns of low cost, high performance optical layers, as well as the system integration issues were carried out. The research accomplishments include a 51cm long molded waveguide array with 150GHz optical bandwidth, 85% coupling efficiency surface normal micro-mirror and system integration with laser diodes and photo detectors.

Download or read book Proceedings of SPIE the International Society for Optical Engineering written by and published by . This book was released on 1999 with total page 406 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book CAS Proceedings written by and published by . This book was released on 1999 with total page 158 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Photopolymers and Applications in Holography Optical Data Storage Optical Sensors and Interconnects written by Roger A. Lessard and published by SPIE-International Society for Optical Engineering. This book was released on 1994 with total page 552 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Perspectives for Parallel Optical Interconnects written by Philippe Lalanne and published by Springer Science & Business Media. This book was released on 2013-11-11 with total page 420 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume is a monograph on parallel optical interconnects. It presents not only the state of-the-art in this domain but also the necessary physical and chemical background. It also provides a discussion of the potential for future devices. Both experts and newcomers to the area will appreciate the authors' proficiency in providing the complete picture of this rapidly growing field. Optical interconnects are already established in telecommunications and should eventually find their way being applied to chip and even gate level connections in integrated systems. The inspiring environment of the Basic Research Working Group on Optical Information Technology WOIT (3199), together with the excellent and complementary skills of its participants, make this contribution highly worthwhile. G. Metakides Table of contents 1 Perspectives for parallel optical interconnects: introduction . . . . . . . . . . . . . . . . . . . . . . . . . l Pierre Chavel and Philippe lAlanne 1. 1 Optical Interconnects and ESPRIT BRA WOIT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1. 2 What are optical interconnects? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 1. 3 Optical interconnects: how ? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1. 3. 1 Passive devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1. 3. 2 Active devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1. 3. 3 Schemes for parallel optical interconnects . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 1. 3. 4 Limits of optical interconnects . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1. 4 Optical interconnects: why ? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Acknowledgetnents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 First Section: Components Part 1. 1 Passive interconnect components 2 Free space interconnects . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Philippe Lalanne and Pierre ChaveZ 2. 1 Introduction: 3D optical interconnects . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 2. 2 Optical free space channels and their implementations . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2. 2. 1 Diffraction and degrees of freedom . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2. 2. 2 Two Qasic interconnect setups . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Download or read book National Telesystems Conference Proceedings written by and published by . This book was released on 1992 with total page 378 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Optical Interconnects written by Ray T. Chen and published by Morgan & Claypool Publishers. This book was released on 2007 with total page 105 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes fully embedded board level optical interconnect in detail including the fabrication of the thin-film VCSEL array, its characterization, thermal management, the fabrication of optical interconnection layer, and the integration of devices on a flexible waveguide film. All the optical components are buried within electrical PCB layers in a fully embedded board level optical interconnect. Therefore, we can save foot prints on the top real estate of the PCB and relieve packaging difficulty reduced by separating fabrication processes. To realize fully embedded board level optical interconnects, many stumbling blocks need to be addressed such as thin-film transmitter and detector, thermal management, process compatibility, reliability, cost effective fabrication process, and easy integration. The material presented eventually will relieve such concerns and make the integration of optical interconnection highly feasible. The hybrid integration of the optical interconnection layer and electrical layers is ongoing.