Download or read book Numerical Simulation and Mechanical Properties of Free standing Silver Thin Films written by and published by . This book was released on 2006 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Mechanical Properties of Free standing Polycrystalline Metallic Thin Films and Multilayers written by Haibo Huang and published by . This book was released on 1998 with total page 348 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Atomistic Simulation of Mechanical Properties of Metallic glass Thin Films written by 吳俊毅 and published by . This book was released on 2014 with total page 161 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Thin Films stresses and Mechanical Properties X written by Sean G. Corcoran and published by . This book was released on 2004 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: This work contains experimental, theoretical, and modeling research papers from a December 2003 symposium on the mechanical behavior of thin films, touching on topics in stress evolution, modeling stresses and film instability, deformation and adhesion, film fracture and fatigue, processing and structure, indentation testing, mechanical properties, properties and performance, and multilayers and nanolaminates. Some specific topics include fracture patterns in thin films and multilayers, thin film herringbone buckling patterns, the effect of oxygen on adhesion of thin copper films to silicon nitride, and the effects of stress amplitude on the fatigue of polysilicon. Annotation : 2004 Book News, Inc., Portland, OR (booknews.com)
Download or read book Thin Films Stresses and Mechanical Properties IX written by Cengiz S. Ozkan and published by Cambridge University Press. This book was released on 2014-06-05 with total page 532 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book, the ninth in a popular series from the Materials Research Society, is strengthened by invited and contributed papers covering a wide range of subjects, from processing-microstructure-mechanical property relationships, strain effects and self-organization in thin films, nanoscale defects and thermomechanical behavior of materials, to novel nanscale materials testing. While the collection continues the series theme of materials science related modeling and characterization of mechanical properties of materials, special focus is given to: strain relaxation and strengthening mechanisms; defects formation; mechanical properties and nanoscale testing; adhesion and fracture; thin-film applications in MEMS; computational modeling and experiments; and film deposition, microstructure, evolution and intrinsic stress.
Download or read book Thin Films Stresses and Mechanical Properties VI written by Shefford P. Baker and published by Materials Research Society. This book was released on 1996-02-11 with total page 576 pages. Available in PDF, EPUB and Kindle. Book excerpt: Interest in the mechanical properties of thin films remains high throughout the world, as evidenced by the large international contingent represented in this book. With regard to stresses, techniques for sorting out residual stress and strain states are becoming more varied and sophisticated. Discussions include Raman scattering, nonlinear acoustic responses and back-scattered electron imaging microscopies, as well as the more standard wafer-bending and X-ray techniques. Spectroscopy, indenting and the burgeoning field of nanoprobe imaging for the characterization of mechanical properties of thin films are also highlighted. Topics include: mechanical properties of films and multilayers; fracture and adhesion; nanoindentation of films and surfaces; mechanical property methods and modelling; tribological properties of thin films; properties of polymer films; stress effects in thin films and interconnects; epitaxy and strain relief mechanisms, measurements.
Download or read book Thin Films Volume 875 written by Thomas E. Buchheit and published by Cambridge University Press. This book was released on 2005 with total page 480 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book has a long tradition of representing current topics in thin-film properties and how they are related to the performance and reliability of thin-film structures. Several emerging and well-developed technologies rely on understanding the behavior of these structures. This book provides a forum for an exchange of ideas among researchers who are interested in the mechanical behavior of thin films, broadly applied to their materials choice or methodology. The book focuses on stress-related phenomena in thin films for a wide range of materials. Of particular interest are studies that explore the frontiers of thin-film materials science with regard to materials selection or size scale. Topics include: elasticity in thin films; characterizing thin films by nanoindentation; mechanical behavior of nanostructured films; mechanical properties of thin; thin-film plasticity; thin-film plasticity; thin-film plasticity; novel testing techniques; in situ characterization techniques; adhesion and fracture of thin films; fatigue and stress in interconnect and metallization; deformation, growth and microstructure in thin films and thin-film processing.
Download or read book Thin Films Stresses and Mechanical Properties IX Volume 695 written by Materials Research Society. Meeting and published by . This book was released on 2002-04 with total page 544 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Download or read book Analysis of Effective Mechanical Properties of Thin Films Used in Microelectromechanical Systems written by Ajay Pasupuleti and published by . This book was released on 2007 with total page 290 pages. Available in PDF, EPUB and Kindle. Book excerpt: "This research aims at analyzing the effective mechanical properties of thin film materials that are used in MEMS. Using the effective mechanical properties, reliable simulations of new or slightly altered designs can be performed successfully. The main reason for investigating effective material properties of MEMS devices is that the existing techniques can not provide consistent prediction of the mechanical properties without timely and costly physical prototyping if the device or the fabrication recipe is slightly altered. To achieve this goal, two approaches were investigated: soft computing and analytical. In the soft computing approach, the effective material properties are empirically modeled and estimated based on experimental data and the relationships between the parameters affecting the mechanical properties of devices are discovered. In this approach, 2D-search, Micro Genetic Algorithms, neural networks, and Radial Basis Functions Networks were explored for the search of the effective material properties of the thin films with the help of a Finite Element Analysis (FEA) and modeling the mechanical behavior such that the effective material properties can be estimated for a new device. In the analytical approach, the physical behavior of the thin films is modeled analytically using standard elastic theories such as Stoney's formulae. As a case study, bilayer cantilevers of various dimensions were fabricated for extracting the effective Young's modulus of thin film materials: Aluminum, TetraEthylOrthoSilicate (TEOS) based SiO2, and Polyimide. In addition, a Matlab® graphical user interface (GUI), STEAM, is developed which interfaces with Ansys®. In STEAM, a fuzzy confidence factor is also developed which interfaces with Ansys®. In STEAM, a fuzzy confidence factor is also developed to validate the reliability of the estimates based on factors such as facility and recipe dependent variables. The results obtained from both approaches generated comparable effective material properties which are in accord with the experimental measurements. The results show that effective material properties of thin films can be estimated so that reliable MEMS devices can be designed without timely and costly physical prototyping"--Abstract.
Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1995 with total page 602 pages. Available in PDF, EPUB and Kindle. Book excerpt: Lists citations with abstracts for aerospace related reports obtained from world wide sources and announces documents that have recently been entered into the NASA Scientific and Technical Information Database.
Download or read book The Estimation of Mechanical Strengths of Thin Films Based on Material Properties written by Amanda J. Neufeld and published by . This book was released on 2013 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: It has been shown that the mechanical properties of thin films tend to differ from their bulk counterparts. Specifically, the bulge and microtensile testing of thin films used in MEMS have revealed that these films demonstrate an inverse relationship between thickness and strength. A film dimension is not a material property, but it evidently does affect the mechanical performance of materials at very small thicknesses. A hypothetical explanation for this phenomenon is that as the thickness dimension of the film decreases, it is statistically less likely that imperfections exist in the material. It would require a very small thickness (or volume) to limit imperfections in a material, which is why this phenomenon is seen in films with thicknesses on the order of 100 nm to a few microns. Another hypothesized explanation is that the surface tension that exists in bulk material also exists in thin films but has a greater impact at such a small scale. The goal of this research is to identify a theoretical prediction of the strength of thin films based on its microstructural properties such as grain size and film thickness. This would minimize the need for expensive and complicated tests such as the bulge and microtensile tests. In this research, data was collected from the bulge and microtensile testing of copper, aluminum, gold, and polysilicon free-standing thin films. Statistical testing of this data revealed a definitive inverse relationship between thickness and strength, as well as between grain size and strength, as expected. However, due to a lack of a standardized method for either test, there were significant variations in the data. This research compares and analyzes the methods used by other researchers to develop a suggested set of instructions for a standardized bulge test and standardized microtensile test. The most important parameters to be controlled in each test were found to be strain rate, temperature, film deposition method, film length, and strain measurement.
Download or read book Stress Analysis and Mechanical Characterization of Thin Films for Microelectronics and MEMS Applications written by Patrick Waters and published by . This book was released on 2008 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: ABSTRACT: Thin films are used for a variety of applications, which can include electronic devices, optical coatings and decorative parts. They are used for their physical, electrical, magnetic, optical and mechanical properties, and many times these properties are required simultaneously. Obtaining these desired properties starts with the deposition process and they are verified by a number of analysis techniques after deposition. A DC magnetron sputter system was used here to deposit tungsten films, with film thickness and residual stress uniformity being of primary interest. The film thickness was measured to vary by up to 45 % from the center to outer edge of a 4" wafer. Ar pressure was found to influence the thin film residual stress with lower Ar pressures leading to compressive residual stress ( -1.5 GPa) and higher Ar pressures leading to tensile residual stress (1 GPa). Residual stress measurements of the tungsten films were made using a wafer curvature technique and X-ray diffraction. The results of the two techniques were compared and found to be within 20 %. Nanoindentation was used to analyze the mechanical properties of several types of thin films that are commonly used in microelectronic devices. Thin film reduced modulus, hardness, interfacial toughness and fracture toughness were some of the mechanical properties measured. Difficulties with performing shallow indents (less than 100 nm) were addressed, with proper calibration procedures for the indentation equipment and tip area function detailed. Pile-up during the indentation of soft films will lead to errors in the indentation contact depth and area, leading to an overestimation of the films' reduced modulus and hardness. A method was developed to account for pile-up in determining the indentation contact depth and calculating a new contact area for improving the analysis of reduced modulus and hardness. Residual stresses in thin films are normally undesired because in extreme cases they may result in thru-film cracking or interfacial film delamination. With the use of lithography techniques to pattern wafers with areas of an adhesion reducing layer, thin film delamination was controlled. The patterned delamination microchannels may be used as an alternative method of creating microchannels for fluid transport in MEMS devices. Delamination morphology was influenced by the amount of residual stress in the film and the critical buckling stress, which was primarily controlled by the width of the adhesion reducing layers.
Download or read book Metals Abstracts written by and published by . This book was released on 1998 with total page 1076 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Computational Materials Chemistry and Biochemistry From Bold Initiatives to the Last Mile written by Sadasivan Shankar and published by Springer Nature. This book was released on 2021-01-25 with total page 1344 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a broad and nuanced overview of the achievements and legacy of Professor William (“Bill”) Goddard in the field of computational materials and molecular science. Leading researchers from around the globe discuss Goddard’s work and its lasting impacts, which can be seen in today’s cutting-edge chemistry, materials science, and biology techniques. Each section of the book closes with an outline of the prospects for future developments. In the course of a career spanning more than 50 years, Goddard’s seminal work has led to dramatic advances in a diverse range of science and engineering fields. Presenting scientific essays and reflections by students, postdoctoral associates, collaborators and colleagues, the book describes the contributions of one of the world’s greatest materials and molecular scientists in the context of theory, experimentation, and applications, and examines his legacy in each area, from conceptualization (the first mile) to developments and extensions aimed at applications, and lastly to de novo design (the last mile). Goddard’s passion for science, his insights, and his ability to actively engage with his collaborators in bold initiatives is a model for us all. As he enters his second half-century of scientific research and education, this book inspires future generations of students and researchers to employ and extend these powerful techniques and insights to tackle today’s critical problems in biology, chemistry, and materials. Examples highlighted in the book include new materials for photocatalysts to convert water and CO2 into fuels, novel catalysts for the highly selective and active catalysis of alkanes to valuable organics, simulating the chemistry in film growth to develop two-dimensional functional films, and predicting ligand–protein binding and activation to enable the design of targeted drugs with minimal side effects.
Download or read book U S Government Research Reports written by and published by . This book was released on 1962 with total page 216 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Publications written by United States. National Bureau of Standards and published by . This book was released on 1986 with total page 408 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Evolution of Thin Film Morphology written by Matthew Pelliccione and published by Springer Science & Business Media. This book was released on 2008-01-29 with total page 206 pages. Available in PDF, EPUB and Kindle. Book excerpt: The focus of this book is on modeling and simulations used in research on the morphological evolution during film growth. The authors emphasize the detailed mathematical formulation of the problem. The book will enable readers themselves to set up a computational program to investigate specific topics of interest in thin film deposition. It will benefit those working in any discipline that requires an understanding of thin film growth processes.
