Download or read book Microelectronic Device and Multilevel Interconnection Technology written by and published by . This book was released on 1996 with total page 414 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microelectronic Device and Multilevel Interconnection Technology written by and published by . This book was released on 1995 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microelectronic Device and Multilevel Interconnection Technology written by Ih-Chin Chen and published by Society of Photo Optical. This book was released on 1995 with total page 326 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microelectronic Device and Multilevel Interconnection Technology II written by Ih-Chin Chen and published by SPIE-International Society for Optical Engineering. This book was released on 1996-01-01 with total page 392 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microelectronic Device and Multilevel Interconnection Technology written by and published by . This book was released on 1995 with total page 342 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microelectronic Interconnections and Assembly written by G.G. Harman and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 295 pages. Available in PDF, EPUB and Kindle. Book excerpt: MICROELECTRONIC INTERCONNECTIONS AND MICROASSEMBL Y WORKSHOP 18-21 May 1996, Prague, Czech Republic Conference Organizers: George Harman, NIST (USA) and Pavel Mach (Czech Republic) Summary of the Technical Program Thirty two presentations were given in eight technical sessions at the Workshop. A list of these sessions and their chairpersons is attached below. The Workshop was devoted to the technical aspects of advanced interconnections and microassembly, but also included papers on the education issues required to prepare students to work in these areas. In addition to new technical developments, several papers presented overviews predicting the future directions of these technologies. The basic issue is that electronic systems will continue to be miniaturized and at the same time performance must continue to improve. Various industry roadmaps were discussed as well as new smaller packaging and interconnection concepts. The newest chip packages are often based on the selection of an appropriate interconnection method. An example is the chip-scale package, which has horizontal (x-y) dimensions,;; 20% larger than the actual silicon chip itself. The chip is often flip-chip connected to a micro ball-grid-array, but direct chip attach was described also. Several papers described advances in the manufacture of such packages.
Download or read book Interconnect Technology and Design for Gigascale Integration written by Jeffrey A. Davis and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 417 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is jointly authored by leading academic and industry researchers. The material is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in-depth exploration into interconnect-aware computer architectures.
Download or read book Microelectronic Device Technology written by and published by . This book was released on 1999 with total page 326 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book A One Semester Course in Modeling of VSLI Interconnections written by Ashok Goel and published by Momentum Press. This book was released on 2014-12-29 with total page 394 pages. Available in PDF, EPUB and Kindle. Book excerpt: Quantitative understanding of the parasitic capacitances and inductances, and the resultant propagation delays and crosstalk phenomena associated with the metallic interconnections on the very large scale integrated (VLSI) circuits has become extremely important for the optimum design of the state-of-the-art integrated circuits. More than 65 percent of the delays on the integrated circuit chip occur in the interconnections and not in the transistors on the chip. Mathematical techniques to model the parasitic capacitances, inductances, propagation delays, crosstalk noise, and electromigration-induced failure associated with the interconnections in the realistic high-density environment on a chip will be discussed. A One-Semester Course in Modeling of VLSI Interconnections also includes an overview of the future interconnection technologies for the nanotechnology circuits.
Download or read book Proceedings of the Symposia on Reliability of Semiconductor Devices interconnections and Dielectric Breakdown and Laser Process for Microelectronic Applications written by Electrochemical Society. Dielectric Science and Technology Division and published by The Electrochemical Society. This book was released on 1992 with total page 346 pages. Available in PDF, EPUB and Kindle. Book excerpt: Papers in this volume are from the 180th ECS Meeting, held in held in Phoenix, Arizona, Fall 1991. This symposium addresses all aspects of reliability of semiconductor devices, multilevel interconnection and dielectric breakdown in VLSI and ULSI technologies. The symposium establishes reliability from design through manufacturing. The second part of the symposium addresses laser ablation/etching, laser planarization laser/UV. CVD of metal end dielectric films, laser/UV enhanced etching and deposition processesing liquid phase, and photomodification of surfaces.
Download or read book Multilevel Interconnect Technology written by Gopal K. Rao and published by McGraw-Hill Companies. This book was released on 1993 with total page 250 pages. Available in PDF, EPUB and Kindle. Book excerpt: The first book on a key topic in IC technology. Table of Contents: Multilevel Interconnection Design; Multilevel Interconnect Processing; Manufacturing; Reliability; Index. 100 illustrations.
Download or read book Integrated Interconnect Technologies for 3D Nanoelectronic Systems written by Muhannad S. Bakir and published by Artech House. This book was released on 2008-11-30 with total page 551 pages. Available in PDF, EPUB and Kindle. Book excerpt: This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.
Download or read book Area Array Interconnection Handbook written by Karl J. Puttlitz and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 1250 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.
Download or read book Handbook of Semiconductor Interconnection Technology written by Geraldine Cogin Shwartz and published by CRC Press. This book was released on 1997-11-24 with total page 598 pages. Available in PDF, EPUB and Kindle. Book excerpt: Covering materials, processes, equipment, methodologies, characterization techniques, clean room practices, and ways to control contamination-related defects, this work offers up-to-date information on the application of interconnection technology to semiconductors. It offers an integration of technical, patent and industry literature.
Download or read book The Computer Engineering Handbook written by Vojin G. Oklobdzija and published by CRC Press. This book was released on 2001-12-26 with total page 1422 pages. Available in PDF, EPUB and Kindle. Book excerpt: There is arguably no field in greater need of a comprehensive handbook than computer engineering. The unparalleled rate of technological advancement, the explosion of computer applications, and the now-in-progress migration to a wireless world have made it difficult for engineers to keep up with all the developments in specialties outside their own. References published only a few years ago are now sorely out of date. The Computer Engineering Handbook changes all of that. Under the leadership of Vojin Oklobdzija and a stellar editorial board, some of the industry's foremost experts have joined forces to create what promises to be the definitive resource for computer design and engineering. Instead of focusing on basic, introductory material, it forms a comprehensive, state-of-the-art review of the field's most recent achievements, outstanding issues, and future directions. The world of computer engineering is vast and evolving so rapidly that what is cutting-edge today may be obsolete in a few months. While exploring the new developments, trends, and future directions of the field, The Computer Engineering Handbook captures what is fundamental and of lasting value.
Download or read book Methods and Materials in Microelectronic Technology written by Joachim Bargon and published by Springer. This book was released on 1984-11-30 with total page 384 pages. Available in PDF, EPUB and Kindle. Book excerpt: The papers collected in this volume were presented at the International Symposium on Methods and Materials in Microelectronic Technology. This symposium was sponsored by IBM Germany, and it was held September 29 - October 1, 1982, in Bad Neuenahr, West Germany. The progress of semiconductor and microelectronic technology has become so rapid and the field so sophisticated that it is imperative to exchange the latest insight gained as frequently as it can be accomplished. In addition, it is peculiar for this field that the bulk of the investigations are carried out at industrial research and development laboratories, which makes some of the results less readily accessible. Because of these circumstances, the academic community, which among other things, is supposed to communicate the prog ress in this field to students of different disciplines, finds it rather difficult to stay properly informed. It was the intent of this IBM sponsored symposium to bring together key scientists from academic institutions, primarily from Europe, with principal investigators of the industrial scene. Accordingly, this symposium exposed technologists to scientists and vice versa. Scientific advances often lead directly to technological innovations. In turn, new technologies are often arrived at empirically and, because of that, are initially poorly understood. Scientific inquiry then attempts to probe these processes and phenomena in order to achieve a better understanding. Thus science and technology are intricately interconnected, and it is important that technical exchange between technolo gists and scientists is facilitated, since the problems are typically interdiscipli nary in nature.
Download or read book Multilevel Interconnect Technology written by Mart Graef and published by . This book was released on 1997 with total page 132 pages. Available in PDF, EPUB and Kindle. Book excerpt:
