Download or read book Microelectronic Device and Multilevel Interconnection Technology written by and published by . This book was released on 1995 with total page 342 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microelectronic Device Technology written by and published by . This book was released on 1999 with total page 326 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Interlayer Dielectrics for Semiconductor Technologies written by Shyam P Muraka and published by Elsevier. This book was released on 2003-10-13 with total page 459 pages. Available in PDF, EPUB and Kindle. Book excerpt: Semiconductor technologies are moving at such a fast pace that new materials are needed in all types of application. Manipulating the materials and their properties at atomic dimensions has become a must. This book presents the case of interlayer dielectrics materials whilst considering these challenges. Interlayer Dielectrics for Semiconductor Technologies cover the science, properties and applications of dielectrics, their preparation, patterning, reliability and characterisation, followed by the discussion of different materials including those with high dielctric constants and those useful for waveguide applications in optical communications on the chip and the package.* Brings together for the FIRST time the science and technology of interlayer deilectrics materials, in one volume* written by renowned experts in the field* Provides an up-to-date starting point in this young research field.
Download or read book Handbook of Semiconductor Interconnection Technology written by Geraldine Cogin Shwartz and published by CRC Press. This book was released on 1997-11-24 with total page 598 pages. Available in PDF, EPUB and Kindle. Book excerpt: Covering materials, processes, equipment, methodologies, characterization techniques, clean room practices, and ways to control contamination-related defects, this work offers up-to-date information on the application of interconnection technology to semiconductors. It offers an integration of technical, patent and industry literature.
Download or read book The Computer Engineering Handbook written by Vojin G. Oklobdzija and published by CRC Press. This book was released on 2001-12-26 with total page 1409 pages. Available in PDF, EPUB and Kindle. Book excerpt: There is arguably no field in greater need of a comprehensive handbook than computer engineering. The unparalleled rate of technological advancement, the explosion of computer applications, and the now-in-progress migration to a wireless world have made it difficult for engineers to keep up with all the developments in specialties outside their own
Download or read book Digital Design and Fabrication written by Vojin G. Oklobdzija and published by CRC Press. This book was released on 2017-12-19 with total page 1231 pages. Available in PDF, EPUB and Kindle. Book excerpt: In response to tremendous growth and new technologies in the semiconductor industry, this volume is organized into five, information-rich sections. Digital Design and Fabrication surveys the latest advances in computer architecture and design as well as the technologies used to manufacture and test them. Featuring contributions from leading experts, the book also includes a new section on memory and storage in addition to a new chapter on nonvolatile memory technologies. Developing advanced concepts, this sharply focused book— Describes new technologies that have become driving factors for the electronic industry Includes new information on semiconductor memory circuits, whose development best illustrates the phenomenal progress encountered by the fabrication and technology sector Contains a section dedicated to issues related to system power consumption Describes reliability and testability of computer systems Pinpoints trends and state-of-the-art advances in fabrication and CMOS technologies Describes performance evaluation measures, which are the bottom line from the user’s point of view Discusses design techniques used to create modern computer systems, including high-speed computer arithmetic and high-frequency design, timing and clocking, and PLL and DLL design
Download or read book Electrical Electronics Abstracts written by and published by . This book was released on 1997 with total page 2304 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Area Array Interconnection Handbook written by Karl J. Puttlitz and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 1250 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.
Download or read book written by 国立国会図書館 (Japan) and published by . This book was released on 1997 with total page 1592 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings of the Symposium on Interconnect and Contact Metallization written by Harzara S. Rathore and published by The Electrochemical Society. This book was released on 1998 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Multilevel Interconnect Technology written by Gopal K. Rao and published by McGraw-Hill Companies. This book was released on 1993 with total page 250 pages. Available in PDF, EPUB and Kindle. Book excerpt: The first book on a key topic in IC technology. Table of Contents: Multilevel Interconnection Design; Multilevel Interconnect Processing; Manufacturing; Reliability; Index. 100 illustrations.
Download or read book Kokuritsu Kokkai Toshokan shoz kagaku gijutsu kankei bun kaigiroku mokuroku written by Kokuritsu Kokkai Toshokan (Japan) and published by . This book was released on 1997 with total page 1596 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Multilevel Interconnect Technology written by and published by . This book was released on 1999 with total page 206 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Wafer Fabrication Factory Performance and Analysis written by Linda F. Atherton and published by Springer Science & Business Media. This book was released on 1995-11-30 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is concerned with wafer fabrication and the factories that manufacture microprocessors and other integrated circuits. With the invention of the transistor in 1947, the world as we knew it changed. The transistor led to the microprocessor, and the microprocessor, the guts of the modern computer, has created an epoch of virtually unlimited information processing. The electronics and computer revolution has brought about, for better or worse, a new way of life. This revolution could not have occurred without wafer fabrication, and its associated processing technologies. A microprocessor is fabricated via a lengthy, highly-complex sequence of chemical processes. The success of modern chip manufacturing is a miracle of technology and a tribute to the hundreds of engineers who have contributed to its development. This book will delineate the magnitude of the accomplishment, and present methods to analyze and predict the performance of the factories that make the chips. The set of topics covered juxtaposes several disciplines of engineering. A primary subject is the chemical engineering aspects of the electronics industry, an industry typically thought to be strictly an electrical engineer's playground. The book also delves into issues of manufacturing, operations performance, economics, and the dynamics of material movement, topics often considered the domain of industrial engineering and operations research. Hopefully, we have provided in this work a comprehensive treatment of both the technology and the factories of wafer fabrication. Novel features of these factories include long process flows and a dominance of processing over operational issues.
Download or read book Multicomponent and Multilayered Thin Films for Advanced Microtechnologies Techniques Fundamentals and Devices written by O. Auciello and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 625 pages. Available in PDF, EPUB and Kindle. Book excerpt: The synthesis of multicomponent/multilayered superconducting, conducting, semiconducting and insulating thin films has become the subject of an intensive, worldwide, interdisciplinary research effort. The development of deposition-characterization techniques and the science and technology related to the synthesis of these films are critical for the successful evolution of this interdisciplinary field of research and the implementation of the new materials in a whole new generation of advanced microdevices. This book contains the lectures and contributed papers on various scientific and technological aspects of multicomponent and multilayered thin films presented at a NATO/ASI. Compared to other recent books on thin films, the distinctive character of this book is the interdisciplinary treatment of the various fields of research related to the different thin film materials mentioned above. The wide range of topics discussed in this book include vacuum-deposition techniques, synthesis-processing, characterization, and devices of multicomponent/multilayered oxide high temperature superconducting, ferroelectric, electro-optic, optical, metallic, silicide, and compound semiconductor thin films. The book presents an unusual intedisciplinary exchange of ideas between researchers with cross-disciplinary backgrounds and it will be useful to established investigators as well as postdoctoral and graduate students.
Download or read book PVD for Microelectronics Sputter Desposition to Semiconductor Manufacturing written by and published by Elsevier. This book was released on 1998-10-29 with total page 434 pages. Available in PDF, EPUB and Kindle. Book excerpt: Physics of Thin Films is one of the longest running continuing series in thin film science, consisting of 25 volumes since 1963. The series contains quality studies of the properties of various thin films materials and systems.In order to be able to reflect the development of today's science and to cover all modern aspects of thin films, the series, starting with Volume 20, has moved beyond the basic physics of thin films. It now addresses the most important aspects of both inorganic and organic thin films, in both their theoretical as well as technological aspects. Therefore, in order to reflect the modern technology-oriented problems, the title has been slightly modified from Physics of Thin Films to Thin Films.This volume, part of the Thin Films Series, has been wholly written by two authors instead of showcasing several edited manuscripts.
Download or read book Copper Interconnect Technology written by Tapan Gupta and published by Springer Science & Business Media. This book was released on 2010-01-22 with total page 433 pages. Available in PDF, EPUB and Kindle. Book excerpt: Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began to influence circuit performance and will be the primary factors in the evolution of nanoscale ULSI technology. Because metallic conductivity and resistance to electromigration of bulk copper (Cu) are better than aluminum, use of copper and low-k materials is now prevalent in the international microelectronics industry. As the feature size of the Cu-lines forming interconnects is scaled, resistivity of the lines increases. At the same time electromigration and stress-induced voids due to increased current density become significant reliability issues. Although copper/low-k technology has become fairly mature, there is no single book available on the promise and challenges of these next-generation technologies. In this book, a leader in the field describes advanced laser systems with lower radiation wavelengths, photolithography materials, and mathematical modeling approaches to address the challenges of Cu-interconnect technology.
