Download or read book VLSI Metallization written by Norman G. Einspruch and published by Academic Press. This book was released on 2014-12-01 with total page 491 pages. Available in PDF, EPUB and Kindle. Book excerpt: VLSI Electronics Microstructure Science, Volume 15: VLSI Metallization discusses the various issues and problems related to VLSI metallization. It details the available solutions and presents emerging trends. This volume is comprised of 10 chapters. The two introductory chapters, Chapter 1 and 2 serve as general references for the electrical and metallurgical properties of thin conducting films. Subsequent chapters review the various aspects of VLSI metallization. The order of presentation has been chosen to follow the common processing sequence. In Chapter 3, some relevant metal deposition techniques are discussed. Chapter 4 presents the methods of VLSI lithography and etching. Conducting films are first deposited at the gate definition step; therefore, the issues related to gate metallization are discussed next in Chapter 5.In Chapter 6, contact metallization is elaborated, and Chapter 7 is devoted to multilevel metallization schemes. Long-time reliability is the subject of Chapter 8, which discusses the issues of contact and interconnect electromigration. GaAs metallization is tackled in Chapter 9. The volume concludes with a general discussion of the functions of interconnect systems in VLSI. Materials scientists, processing and design engineers, and device physicists will find the book very useful.
Download or read book Metallization of Polymers 2 written by Edward Sacher and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 208 pages. Available in PDF, EPUB and Kindle. Book excerpt: As the demands put on the polymer/metal interface, particularly by the microelectronics industry, become more and more severe, the necessity for understanding this interface, its properties and its limitations, becomes more and more essential. This requires a broad knowledge of, and a familiarity with, the latest findings in this rapidly advancing field. At the very least, such familiarity requires an exchange of infonnation, particularly among those intimately involved in this field. Communications among many of us in this area have made one fact quite obvious: the facilities provided by existing organizations, scientific and otherwise, do not offer the forum necessary to accomplish this exchange of infonnation. It was for this reason that Jean-Jacques Pireaux, Steven Kowalczyk and I organized the first Metallization of Polymers, a symposium sponsored by the American Chemical Society, which took place in Montreal, September 25-28, 1989; the Proceedings from that symposium were published as ACS Symposium Series 440, (1990). It is this same per ceived lack of a proper forum, and the encouragement of my colleagues, that prompted me to organize this meeting, so as to bring to the attention of the participants new instruments, materials, methods, advances, and, particularly, thoughts in the field of polymer metalliza tion. The meeting was designed as a workshop, with time being made available throughout for discussion and for the consideration of new findings.
Download or read book Effect of Preheating Upon Metallization of Iron Ore Pellets written by Robert B. Schluter and published by . This book was released on 1972 with total page 32 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Metallization Systems for Integrated Circuits written by Rosemary P. Beatty and published by . This book was released on 1970 with total page 34 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Metallization and Metal Semiconductor Interfaces written by Inder P. Batra and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 501 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book represents the work presented at a NATO Advanced Research Workshop on "Metallization and Metal-Semiconductor Interfaces", held at the Technical University of Munich, Garching, W. Germany from 22-26 August 1988. The major focus of the workshop was to evaluate critically the progress made in the area of metal-semiconductor interfaces. The underlying theme was the mechanism of Schottky barrier formation and a serious as sessment of the various models. A significant fraction of the workshop time was also spent in discussing the interaction of alkali metals with semiconductors. Alkali metals on semi conductors form ordered overlayers and the resulting system often exhibits one-dimensional metallic properties. The nature of their interaction has introduced new and exciting com plexities and this was pursued at length during the lively discussions at the workshop. A half a day was devoted to Scanning Tunneling Microscopy, the emphasis being on its utility in providing structural and electronic character of low-coverage regime. The book should pro vide readers with the most current status of the research activity in the general area of metal-semiconductor interfaces at an international level. It should also serve as an excellent introduction to the field, since sufficient review type of material has also been included The workshop organizers, Dr. I. P. Batra (Director), mM Almaden Research Center, San Jose, Prof. S. Ciraci, Bilkent University, Ankara, Prof. C. Y. Pong, University of California, Davis, Prof. Dr. F. Koch (Local Chairman), Technical University Munich, Garching, Dr. H.
Download or read book Metallization of Pelletized Domestic Iron Oxide Superconcentrates with Lignite and Coal in a Rotary Kiln written by Roy Ernest Peterson and published by . This book was released on 1976 with total page 28 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Metallization of Iron Ores with Solid Reductants written by M. M. Fine and published by . This book was released on 1969 with total page 28 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electrochemical Processes for Metallization of Novel Silicon Solar Cells written by Mathias Kamp and published by BoD – Books on Demand. This book was released on 2016-10-05 with total page 195 pages. Available in PDF, EPUB and Kindle. Book excerpt: Within this work electrochemical processes for manufacturing of novel silicon solar cells are investigated. Direct plating of Ni and Al on n- and p- silicon is demonstrated by making use of solar cell characteristics. Homogenous Ni/Cu stacks are realized for bifacial and back contact solar cells, forming an excellent mechanical and electrical contact to silicon. For metallization of HIT solar cells, the plating behavior on ITO layers is studied. Additionally, plating processes on evaporated Al layers are developed and applied to back contact solar cells. By means of process optimization the plated metal stack on Al features sufficient adhesion and increases the lateral conductivity of the metal grid resulting in increased solar cell efficiency. An advanced metallization route for back contact solar cells which purposefully utilizes the different characteristics of the deposited metals (Al, Ni, Cu) is developed. The resulting metal stacks are characterized in detail using SEM, EDX and AES methods. Besides plating processes, local oxidizing processes for Al are established and combined with printing technologies to realize the metal contact separation for back contact solar cells.
Download or read book Proceedings of the Symposium on Multilevel Metallization Interconnection and Contact Technologies written by L. B. Rothman and published by . This book was released on 1987 with total page 288 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Metallized Plastics 2 written by K.L. Mittal and published by Springer Science & Business Media. This book was released on 1992-03-31 with total page 496 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume documents the proceedings of the Second Symposium on Metallized Plastics: Fundamental and Applied Aspects held under the aegis of the Dielectric Science and Technology Division of the Electrochemical Society in Montreal, Canada, May 7-10, 1990. The first symposium on this topic was held in Chicago, October 10-12, 1988 and the proceedings of l which have been chronicled in a hard-bound volume l As pointed out in the Preface to the proceedings of the first symposium the metallized plastics find scores of applications ranging from very mundane to very sophisticated. Even a cursory look at the literature will convince that this field has sprouted; and there is every reason to believe that with all the research and development activities taking place, new and exciting applications of metallized plastics will emerge. The program for the second symposium was very comprehensive as it included 46 papers covering many aspects of metallized plastics. This symposium was a testimonial to the brisk research activity and keen interest in the topic of metallized plastics. The success of this symposium reinforced our earlier belief that there was a definite need to hold symposia on this topic on a regular basis. Concomitantly, the third symposium in this vein was held in Phoenix, Arizona, October 13-18, 1991 and the fourth is planned for May 16-21, 1993 in Honolulu, Hawaii. As regards the present volume, it contains a total of 35 papers covering a variety of topics ranging from very fundamental to very applied.
Download or read book Metallized Plastics 7 Fundamental and Applied Aspects written by Kash L. Mittal and published by CRC Press. This book was released on 2020-04-12 with total page 277 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume documents the proceedings of the 7th Symposium on Metallized Plastics: Fundamental and Applied Aspects, held in Newark, New Jersey, December 2-3, 1999. This volume contains a total of 16 papers, which were all rigorously peer reviewed and suitably revised before inclusion. The book is divided into two parts: Metallization Techniques and Properties of Metal Deposits, and Interfacial and Adhesion Aspects. The topics covered include: various metallization techniques for a variety of plastics including some novel developments involving suitable plastic pretreatments; modification of polymers by plasma and ion-assisted reactions; metal doped plasma polymer films; metal-polyimide nanocomposite films; investigation of metal/polymer interactions by a variety of techniques; ways to improve adhesion of metal/polymer systems; modeling of metal/polymer interfaces; application of surface analytical techniques in the arena of metallized plastics; and ultrathin films on metal surfaces. This volume offers a wealth of information and represents current commentary on the R&D activity taking place in the technologically highly important field of metallized plastics and is of value and interest to anyone interested in the fundamental or applied aspects of metallized plastics.
Download or read book Metallization written by S. P. Murarka and published by Butterworth-Heinemann. This book was released on 1993 with total page 268 pages. Available in PDF, EPUB and Kindle. Book excerpt: This title covers fundemental concepts, properties and applicabilities of metals and alloys for use in various metallization schemes. Metallizations form the key components on electronic circuits - controlling device properties and providing power and device interconnections with the outside world or with other devices. The recent advent of submicron dimensions and increasingly faster devices in the semiconductor have challenged researchers to keep metallization schemes in line with new demanding requirements.
Download or read book VLSI Metallization written by Krishna Shenai and published by Artech House Publishers. This book was released on 1991 with total page 548 pages. Available in PDF, EPUB and Kindle. Book excerpt: This comprehensive collection of reprinted articles presents the most important developments on VLSI contact and interconnect technologies and applications. The book covers important developments in metallization of compound semiconductor technologies, and includes a section on metallization reliability and high speed testing.
Download or read book Stress Induced Phenomena in Metallization written by Shefford P. Baker and published by American Inst. of Physics. This book was released on 2002-04-09 with total page 268 pages. Available in PDF, EPUB and Kindle. Book excerpt: Tiny metal structures, less than a millionth of a meter across, are critical building blocks in a number of high-tech devices such as computer chips. These "metallizations" are subjected to extreme conditions of temperature, electric current density, and mechanical load, which may cause the device they are in to fail. This book contains research papers on these metallizations and on the reliability problems associated with them. The papers were peer reviewed for these proceedings.
Download or read book NBS Technical Note written by and published by . This book was released on 1972 with total page 146 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Compound Semiconductor Power Transistors II and written by R. F. Kopf and published by The Electrochemical Society. This book was released on 2000 with total page 368 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Handbook of Thin Film Deposition written by Krishna Seshan and published by William Andrew. This book was released on 2018-02-23 with total page 470 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Thin Film Deposition, Fourth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, materials for memory applications and methods for thin film optical processes. The book is broken up into three sections: scaling, equipment and processing, and applications. In this newly revised edition, the handbook will also explore the limits of thin film applications, most notably as they relate to applications in manufacturing, materials, design and reliability. Offers a practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance, applications and the limitations faced by those processes Covers core processes and applications in the semiconductor industry and new developments within the photovoltaic and optical thin film industries Features a new chapter discussing Gates Dielectrics
