Download or read book MEMS Silicon Oscillating Accelerometers and Readout Circuits written by Xu, Yong Ping and published by River Publishers. This book was released on 2019-02-12 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: Most MEMS accelerometers on the market today are capacitive accelerometers that are based on the displacement sensing mechanism. This book is intended to cover recent developments of MEMS silicon oscillating accelerometers (SOA), also referred to as MEMS resonant accelerometer. As contrast to the capacitive accelerometer, the MEMS SOA is based on the force sensing mechanism, where the input acceleration is converted to a frequency output. MEMS Silicon Oscillating Accelerometers and Readout Circuits consists of six chapters and covers both MEMS sensor and readout circuit, and provides an in-depth coverage on the design and modelling of the MEMS SOA with several recently reported prototypes. The book is not only useful to researchers and engineers who are familiar with the topic, but also appeals to those who have general interests in MEMS inertial sensors. The book includes extensive references that provide further information on this topic.

Download or read book MEMS Silicon Oscillating Accelerometers and Readout Circuits written by Yong Ping Xu and published by CRC Press. This book was released on 2022-09-01 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: Most MEMS accelerometers on the market today are capacitive accelerometers that are based on the displacement sensing mechanism. This book is intended to cover recent developments of MEMS silicon oscillating accelerometers (SOA), also referred to as MEMS resonant accelerometer. As contrast to the capacitive accelerometer, the MEMS SOA is based on the force sensing mechanism, where the input acceleration is converted to a frequency output. MEMS Silicon Oscillating Accelerometers and Readout Circuits consists of six chapters and covers both MEMS sensor and readout circuit, and provides an in-depth coverage on the design and modelling of the MEMS SOA with several recently reported prototypes. The book is not only useful to researchers and engineers who are familiar with the topic, but also appeals to those who have general interests in MEMS inertial sensors. The book includes extensive references that provide further information on this topic.

Download or read book Low Noise Readout Circuit for Automotive MEMS Accelerometers written by Alice Lanniel and published by . This book was released on 2023 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book MEMS Accelerometers written by Mahmoud Rasras and published by MDPI. This book was released on 2019-05-27 with total page 252 pages. Available in PDF, EPUB and Kindle. Book excerpt: Micro-electro-mechanical system (MEMS) devices are widely used for inertia, pressure, and ultrasound sensing applications. Research on integrated MEMS technology has undergone extensive development driven by the requirements of a compact footprint, low cost, and increased functionality. Accelerometers are among the most widely used sensors implemented in MEMS technology. MEMS accelerometers are showing a growing presence in almost all industries ranging from automotive to medical. A traditional MEMS accelerometer employs a proof mass suspended to springs, which displaces in response to an external acceleration. A single proof mass can be used for one- or multi-axis sensing. A variety of transduction mechanisms have been used to detect the displacement. They include capacitive, piezoelectric, thermal, tunneling, and optical mechanisms. Capacitive accelerometers are widely used due to their DC measurement interface, thermal stability, reliability, and low cost. However, they are sensitive to electromagnetic field interferences and have poor performance for high-end applications (e.g., precise attitude control for the satellite). Over the past three decades, steady progress has been made in the area of optical accelerometers for high-performance and high-sensitivity applications but several challenges are still to be tackled by researchers and engineers to fully realize opto-mechanical accelerometers, such as chip-scale integration, scaling, low bandwidth, etc. This Special Issue on "MEMS Accelerometers" seeks to highlight research papers, short communications, and review articles that focus on: Novel designs, fabrication platforms, characterization, optimization, and modeling of MEMS accelerometers. Alternative transduction techniques with special emphasis on opto-mechanical sensing. Novel applications employing MEMS accelerometers for consumer electronics, industries, medicine, entertainment, navigation, etc. Multi-physics design tools and methodologies, including MEMS-electronics co-design. Novel accelerometer technologies and 9DoF IMU integration. Multi-accelerometer platforms and their data fusion.

Download or read book The Silicon Oscillating Accelerometer A MEMS Inertial Instrument for Strategic Missile Guidance written by and published by . This book was released on 1998 with total page 13 pages. Available in PDF, EPUB and Kindle. Book excerpt: The intercontinental ballistic missile (ICBM) and submarine-launched ballistic missiles (SLBM) developed over the past 50 years have employed successive generations of increasingly accurate inertial guidance systems. The comparatively short time of guided flight and high acceleration levels characteristic of the ballistic missile application place a premium on accelerometer performance to achieve desired weapon system accuracy. To date, the accelerometer design of choice for strategic missiles has been the Pendulous Integrating Gyroscopic Accelerometer (PIGA) instrument, an accelerometer whose origins trace back to the German V2 rocket, and has been refined through several generations of development to achieve unsurpassed performance. The specialized technologies of PIGA accelerometers, such as gas bearing wheels, ultra-stable ball bearings, precision electromagnetic components, and "designer chemical" flotation fluids require a costly support infrastructure for production and system life-cycle maintenance. The Draper Laboratory is currently in the process of developing the Silicon Oscillating Accelerometer (SOA) a MEMS-based sensor that has the potential to achieve the ppm/ug performance stability required of the strategic missile application. The Microelectromechanical System (MEMS) technology is inherently low cost and offers a rapidly expanding commercial business base to leverage and sustain accelerometer production and deployment in next generation guidance systems.

Download or read book Design Manufacturing And Mechatronics Proceedings Of The International Conference On Design Manufacturing And Mechatronics Icdmm2016 written by A Mehran Shahhosseini and published by World Scientific. This book was released on 2016-12-29 with total page 758 pages. Available in PDF, EPUB and Kindle. Book excerpt: The 3rd Annual International Conference on Design, Manufacturing and Mechatronics (ICDMM2016) was successfully held in Wuhan, China in 2016.The ICDMM2016 covers a wide range of fundamental studies, technical innovations and industrial applications in industry design, manufacturing and mechatronics. The ICDMM2016 program consists of 4 keynote speeches, 96 oral and poster presentations. We were pleased to have more than 80 participants from China, South Korea, Taiwan, Japan, Malaysia, and Saudi Arabia. However, finally, only 83 articles were selected after peer review to be included in this proceedings.

Download or read book Sensing and Control of MEMS Accelerometers Using Kalman Filter written by Kai Zhang and published by . This book was released on 2010 with total page 77 pages. Available in PDF, EPUB and Kindle. Book excerpt: Surface micromachined low-capacitance MEMS capacitive accelerometers which integrated CMOS readout circuit generally have a noise above 0.02g. Force-to-rebalance feedback control that is commonly used in MEMS accelerometers can improve the performances of accelerometers such as increasing their stability, bandwidth and dynamic range. However, the controller also increases the noise floor. There are two major sources of the noise in MEMS accelerometer. They are electronic noise from the CMOS readout circuit and thermal-mechanical Brownian noise caused by damping. Kalman filter is an effective solution to the problem of reducing the effects of the noises through estimating and canceling the states contaminated by noise. The design and implementation of a Kalman filter for a MEMS capacitive accelerometer is presented in the thesis in order to filter out the noise mentioned above while keeping its good performance under feedback control. The dynamic modeling of the MEMS accelerometer system and the controller design based on the model are elaborated in the thesis. Simulation results show the Kalman filter gives an excellent noise reduction, increases the dynamic range of the accelerometer, and reduces the displacement of the mass under a closed-loop structure.

Download or read book Micro g Silicon Accelerometers with High Performance CMOS Interface Circuitry written by Navid Yazdi and published by . This book was released on 1999 with total page 320 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Modeling and simulation of the capacitive accelerometer written by Tan Tran Duc and published by GRIN Verlag. This book was released on 2009-01-19 with total page 83 pages. Available in PDF, EPUB and Kindle. Book excerpt: Diploma Thesis from the year 2005 in the subject Electrotechnology, grade: Master 9.8/10, , language: English, abstract: Microelectromechanical systems (MEMS) are collection of microsensors and actuators that have the ability to sense its environment and react to changes in that environment with the use of a microcircuit control. They also include the conventional microelectronics packaging, integrating antenna structures for command signals into microelectromechanical structures for desired sensing and actuating functions. The system may also need micropower supply, microrelay, and microsignal processing units. Microcomponents make the system faster, more reliable, cheaper, and capable of incorporating more complex functions. In the beginning of 1990s, MEMS appeared with the aid of the development of integrated circuit fabrication processes, in which sensors, actuators, and control functions are co-fabricated in silicon [1]. Since then, remarkable research progresses have been achieved in MEMS under the strong promotions from both government and industries. In addition to the commercialization of some less integrated MEMS devices, such as microaccelerometers, inkjet printer head, micromirrors for projection, etc., the concepts and feasibility of more complex MEMS devices have been proposed and demonstrated for the applications in such varied fields as microfluidics, aerospace, biomedical, chemical analysis, wireless communications, data storage, display, optics, etc. Some branches of MEMS, appearing as microoptoelectromechanical systems (MOEMS), micro total analysis systems, etc., have attracted a great research since their potential applications’ market.

Download or read book Readout Circuit and Chip Design for a Piezoelectric MEMS Accelerometer written by 翁睿佟 and published by . This book was released on 2020 with total page 102 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Mems Accelerometer Modelling and Noise Analysis written by Biter Boga Inaltekin and published by LAP Lambert Academic Publishing. This book was released on 2011-09 with total page 132 pages. Available in PDF, EPUB and Kindle. Book excerpt: Micro Electro Mechanical Systems (MEMS) have an extensive use in different areas of technology. Inertial sensors (accelerometers and gyroscopes) are one of the most widely used devices fabricated using MEMS technology. MEMS accelerometers play an important role in different application areas such as automotive, inertial navigation, guidance, industry, space applications etc. because of low cost, small size, low power, and high reliability. This book presents a detailed SIMULINK model for a conventional capacitive sigma-delta accelerometer system consisting of a MEMS accelerometer, closed-loop readout electronics, and signal processing units (e.g. decimation filters). By using this model, it is possible to estimate the performance of the full accelerometer system including individual noise components, operation range, open loop sensitivity, scale factor, etc. The developed model has been verified through test results using a capacitive MEMS accelerometer, full-custom designed readout electronics, and signal processing unit implemented on a FPGA.

Download or read book MEMS Accelerometers written by Ibrahim (Abe) M. Elfadel and published by . This book was released on 2019 with total page 1 pages. Available in PDF, EPUB and Kindle. Book excerpt: Micro-electro-mechanical system (MEMS) devices are widely used for inertia, pressure, and ultrasound sensing applications. Research on integrated MEMS technology has undergone extensive development driven by the requirements of a compact footprint, low cost, and increased functionality. Accelerometers are among the most widely used sensors implemented in MEMS technology. MEMS accelerometers are showing a growing presence in almost all industries ranging from automotive to medical. A traditional MEMS accelerometer employs a proof mass suspended to springs, which displaces in response to an external acceleration. A single proof mass can be used for one- or multi-axis sensing. A variety of transduction mechanisms have been used to detect the displacement. They include capacitive, piezoelectric, thermal, tunneling, and optical mechanisms. Capacitive accelerometers are widely used due to their DC measurement interface, thermal stability, reliability, and low cost. However, they are sensitive to electromagnetic field interferences and have poor performance for high-end applications (e.g., precise attitude control for the satellite). Over the past three decades, steady progress has been made in the area of optical accelerometers for high-performance and high-sensitivity applications but several challenges are still to be tackled by researchers and engineers to fully realize opto-mechanical accelerometers, such as chip-scale integration, scaling, low bandwidth, etc. This Special Issue on "MEMS Accelerometers" seeks to highlight research papers, short communications, and review articles that focus on: Novel designs, fabrication platforms, characterization, optimization, and modeling of MEMS accelerometers. Alternative transduction techniques with special emphasis on opto-mechanical sensing. Novel applications employing MEMS accelerometers for consumer electronics, industries, medicine, entertainment, navigation, etc. Multi-physics design tools and methodologies, including MEMS-electronics co-design. Novel accelerometer technologies and 9DoF IMU integration. Multi-accelerometer platforms and their data fusion.

Download or read book High sensitivity Low noise Multi axis Capacitive Micro accelerometers written by Junseok Chae and published by . This book was released on 2003 with total page 356 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book An Electrical stimulus only BIST IC for Capacitive MEMS Accelerometer Sensitivity Characterization written by Muhlis Kenan Ozel and published by . This book was released on 2017 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Testing and calibration constitute a significant part of the overall manufacturing cost of microelectromechanical system (MEMS) devices. Developing a low-cost testing and calibration scheme applicable at the user side that ensures the continuous reliability and accuracy is a crucial need. The main purpose of testing is to eliminate defective devices and to verify the qualifications of a product is met. The calibration process for capacitive MEMS devices, for the most part, entails the determination of the mechanical sensitivity. In this work, a physical-stimulus-free built-in-self-test (BIST) integrated circuit (IC) design characterizing the sensitivity of capacitive MEMS accelerometers is presented. The BIST circuity can extract the amplitude and phase response of the acceleration sensor's mechanics under electrical excitation within 0.55% of error with respect to its mechanical sensitivity under the physical stimulus. Sensitivity characterization is performed using a low computation complexity multivariate linear regression model. The BIST circuitry maximizes the use of existing analog and mixed-signal readout signal chain and the host processor core, without the need for computationally expensive Fast Fourier Transform (FFT)-based approaches. The BIST IC is designed and fabricated using the 0.18-μm CMOS technology. The sensor analog front-end and BIST circuitry are integrated with a three-axis, low-g capacitive MEMS accelerometer in a single hermetically sealed package. The BIST circuitry occupies 0.3 mm2 with a total readout IC area of 1.0 mm2 and consumes 8.9 mW during self-test operation.

Download or read book A Low Power Readout Circuit for a Tri axial Piezoelectric MEMS Accelerometer written by and published by . This book was released on 2022 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Design and Fabrication of Self packaged Flexible MEMs Accelerometer and Aluminum Nitride Tactile Sensors written by Md Sohel Mahmood and published by . This book was released on 2019 with total page 156 pages. Available in PDF, EPUB and Kindle. Book excerpt: The work presented in this dissertation describes the design, fabrication and characterization of a Micro Electro Mechanical System (MEMS) capacitive accelerometer on a flexible substrate. To facilitate the bending of the accelerometers and make them mountable on a curved surface, polyimide was used as a flexible substrate. Considering its high glass transition temperature and low thermal expansion coefficient, PI5878G was chosen as the underlying flexible substrate. Three different sizes of accelerometers were designed in CoventorWare® software which utilizes Finite Element Method (FEM) to numerically perform various analyses. Capacitance simulation under acceleration, modal analysis, stress and pull-in study were performed in CoventorWare®. A double layer UV-LIGA technique was deployed to electroplate the proof mass for increased sensitivity. The proof mass of the accelerometers was perforated to lower the damping force as well as to facilitate the ashing process of the underlying sacrificial layer. Three different sizes of accelerometers were fabricated and subsequently characterized. The largest accelerometer demonstrated a sensitivity of 187 fF/g at its resonant frequency of 800 Hz. It also showed excellent noise performance with a signal to noise ratio (SNR) of 100:1. The accelerometers were also placed on curved surfaces having radii of 3.8 cm, 2.5 cm and 2.0 cm for flexibility analysis. The sensitivity of the largest device was obtained to be 168 fF/g on a curved surface of 2.0 cm radius. The radii of robotic index and thumb fingertips are 1.0 cm and 3.5 cm, respectively. Therefore, these accelerometers are fully compatible with robotics as well as prosthetics. The accelerometers were later encapsulated by Kapton® superstrate in vacuum environment. Kapton® is a polyimide film which possesses similar glass transition temperature and thermal expansion coefficient to that of the underlying substrate PI5878G. The thickness of the superstrate was optimized to place the intermediate accelerometer on a plane of zero stress. The Kapton® films were pre-etched before bonding to the device wafer, thus avoiding spin-coating a photoresist layer at high rpm and possibly damaging the already released micro-accelerometers in the device wafer. The packaged accelerometers were characterized in the same way the open accelerometers were characterized on both flat and curved surfaces. After encapsulation, the sensitivity of the largest accelerometer on a flat and a curved surface with 2.0 cm radius were obtained to be 195 fF/g and 174 fF/f, respectively. All three accelerometers demonstrated outstanding noise performance after vacuum packaging with an SNR of 100:1. Further analysis showed that the contribution from the readout circuitry is the most dominant noise component followed by the Brownian noise of the accelerometers. The developed stresses in different layers of the accelerometers upon bending the substrates were analyzed. The stresses in all cases were below the yield strength of the respective layer materials. AlN cantilevers as tactile sensors were also fabricated and characterized on a flexible substrate. Ti was utilized as the bottom and the top electrode for its smaller lattice mismatch to AlN compared to Pt and Al. The piezoelectric layer of AlN was annealed after sputtering which resulted in excellent crystalline orientation. The XRD peak corresponding to AlN (002) plane was obtained at 36.54o. The fabricated AlN cantilevers were capable of sensing pressures from 100 kPa to 850 kPa which includes soft touching of human index finger and grasping of an object. The sensitivities of the cantilevers were between 1.90 × 10-4 V/kPa and 2.04 × 10-4 V/kPa. The stresses inside the AlN and Ti layer, developed upon full bending, were below the yield strength of the respective layer materials.

Download or read book Calibration of MEMS Capacitive Accelerometers Using Electrical Stimulus BIST written by Naveen Sai Jangala Naga and published by . This book was released on 2014 with total page 77 pages. Available in PDF, EPUB and Kindle. Book excerpt: The applications which use MEMS accelerometer have been on rise and many new fields which are using the MEMS devices have been on rise. The industry is trying to reduce the cost of production of these MEMS devices. These devices are manufactured using micromachining and the interface circuitry is manufactured using CMOS and the final product is integrated on to a single chip. Amount spent on testing of the MEMS devices make up a considerable share of the total final cost of the device. In order to save the cost and time spent on testing, researchers have been trying to develop different methodologies. At present, MEMS devices are tested using mechanical stimuli to measure the device parameters and for calibration the device. This testing is necessary since the MEMS process is not a very well controlled process unlike CMOS. This is done using an ATE and the cost of using ATE (automatic testing equipment) contribute to 30-40% of the devices final cost. This thesis proposes an architecture which can use an Electrical Signal to stimulate the MEMS device and use the data from the MEMS response in approximating the calibration coefficients efficiently. As a proof of concept, we have designed a BIST (Built-in self-test) circuit for MEMS accelerometer. The BIST has an electrical stimulus generator, Capacitance-to-voltage converter, ∑ ∆ ADC. This thesis explains in detail the design of the Electrical stimulus generator. We have also designed a technique to correlate the parameters obtained from electrical stimuli to those obtained by mechanical stimuli. This method is cost effective since the additional circuitry needed to implement BIST is less since the technique utilizes most of the existing standard readout circuitry already present.