Download or read book Low K Dielectric Materials Technology written by Low K Dielectric Materials Technology Conference and published by . This book was released on 2000 with total page 50 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Low Dielectric Constant Materials for IC Applications written by Paul S. Ho and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 323 pages. Available in PDF, EPUB and Kindle. Book excerpt: Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for
Download or read book Interlayer Dielectrics for Semiconductor Technologies written by Shyam P Muraka and published by Elsevier. This book was released on 2003-10-13 with total page 459 pages. Available in PDF, EPUB and Kindle. Book excerpt: Semiconductor technologies are moving at such a fast pace that new materials are needed in all types of application. Manipulating the materials and their properties at atomic dimensions has become a must. This book presents the case of interlayer dielectrics materials whilst considering these challenges. Interlayer Dielectrics for Semiconductor Technologies cover the science, properties and applications of dielectrics, their preparation, patterning, reliability and characterisation, followed by the discussion of different materials including those with high dielctric constants and those useful for waveguide applications in optical communications on the chip and the package.* Brings together for the FIRST time the science and technology of interlayer deilectrics materials, in one volume* written by renowned experts in the field* Provides an up-to-date starting point in this young research field.
Download or read book Materials Technology and Reliability for Advanced Interconnects and Low k Dielectrics written by and published by . This book was released on 2004 with total page 440 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Low and High Dielectric Constant Materials written by Mark J. Lododa and published by The Electrochemical Society. This book was released on 2000 with total page 262 pages. Available in PDF, EPUB and Kindle. Book excerpt: Contains papers from a May 2000 symposium, representing the state of the art in areas of dielectric materials science and process integration. Papers are arranged in sections on low and high dielectric constant materials, covering topics such as ammonia plasma passivation effects on properties of post-CMP low-k HSQ, characterization of ashing effects on low-k dielectric films, and electron beam curing of thin film polymer dielectrics. Other subjects include characterization of high-k dielectrics using the non-contact surface charge profiler method, and processing effects and electrical evaluation of ZrO2 formed by RTP oxidation of Zr. Loboda is affiliated with Dow Corning Corporation. c. Book News Inc.
Download or read book Materials for Information Technology written by Ehrenfried Zschech and published by Springer Science & Business Media. This book was released on 2006-07-02 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides an up to date survey of the state of the art of research into the materials used in information technology, and will be bought by researchers in universities, institutions as well as research workers in the semiconductor and IT industries.
Download or read book Materials Technology and Reliability of Low k Dielectrics and Copper Interconnects written by Ting Y. Tsui and published by . This book was released on 2006 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Materials Technology and Reliability for Advanced Interconnects and Low k Dielectrics written by and published by . This book was released on 2001 with total page 624 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Materials Technology and Reliability for Advanced Interconnects and Low K Dielectrics 2004 written by R. J. Carter and published by . This book was released on 2004-09 with total page 432 pages. Available in PDF, EPUB and Kindle. Book excerpt: The scaling of device dimensions with a simultaneous increase in functional density has imposed tremendous challenges for materials, technology, integration and reliability of interconnects. To meet requirements of the ITRS roadmap, new materials are being introduced at a faster pace in all functions of multilevel interconnects. The issues addressed in this book cannot be dispelled as simply selecting a low-k material and integrating it into a copper damascene process. The intricacies of the back end for sub-100nm technology include novel processing of low-k materials, employing pore-sealing techniques and capping layers, introducing advanced dielectric and diffusion barriers, and developing novel integration schemes. This is in addition to concerns of performance, yield, and reliability appropriate to nanoscaled interconnects. Although many challenges continue to impede progress along the ITRS roadmap, the contributions in this book confront them head-on. It provides a scientific understanding of the issues and stimulate new approaches to advanced multilevel interconnects.
Download or read book Plasma Science and Technology written by Haikel Jelassi and published by BoD – Books on Demand. This book was released on 2019-02-27 with total page 330 pages. Available in PDF, EPUB and Kindle. Book excerpt: Usually called the "fourth state of matter," plasmas make up more than 99% of known material. In usual terminology, this term generally refers to partially or totally ionized gas and covers a large number of topics with very different characteristics and behaviors. Over the last few decades, the physics and engineering of plasmas was experiencing a renewed interest, essentially born of a series of important applications such as thin-layer deposition, surface treatment, isotopic separation, integrated circuit etchings, medicine, etc. Plasma Science
Download or read book Materials Technology and Reliability for Advanced Interconnects and Low K Dielectrics Volume 612 written by G. S. Oehrlein and published by Cambridge University Press. This book was released on 2001-04-05 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book highlights important achievements and challenges in advanced interconnects and low-k dielectrics as employed in the microelectronics industry. The replacement of Al alloys with Cu along with the introduction of new barrier materials to protect Cu from chemical attack, and the utilization of new dielectric materials with a lower relative dielectric constant k than SiO2 in multilevel metallization structures of increasing complexity, are the major themes of evolution in this field. Invited reviews illustrate the significant progress that has been achieved as well as the challenges that remain. Contributed papers presented by researchers from different countries demonstrate progress on current topics using a truly multidisciplinary approach.
Download or read book Metallization of Polymers 2 written by Edward Sacher and published by Springer Science & Business Media. This book was released on 2002-09-30 with total page 224 pages. Available in PDF, EPUB and Kindle. Book excerpt: As the demands put on the polymer/metal interface, particularly by the microelectronics industry, become more and more severe, the necessity for understanding this interface, its properties and its limitations, becomes more and more essential. This requires a broad knowledge of, and a familiarity with, the latest findings in this rapidly advancing field. At the very least, such familiarity requires an exchange of infonnation, particularly among those intimately involved in this field. Communications among many of us in this area have made one fact quite obvious: the facilities provided by existing organizations, scientific and otherwise, do not offer the forum necessary to accomplish this exchange of infonnation. It was for this reason that Jean-Jacques Pireaux, Steven Kowalczyk and I organized the first Metallization of Polymers, a symposium sponsored by the American Chemical Society, which took place in Montreal, September 25-28, 1989; the Proceedings from that symposium were published as ACS Symposium Series 440, (1990). It is this same per ceived lack of a proper forum, and the encouragement of my colleagues, that prompted me to organize this meeting, so as to bring to the attention of the participants new instruments, materials, methods, advances, and, particularly, thoughts in the field of polymer metalliza tion. The meeting was designed as a workshop, with time being made available throughout for discussion and for the consideration of new findings.
Download or read book Dielectric Films for Advanced Microelectronics written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2007-04-04 with total page 508 pages. Available in PDF, EPUB and Kindle. Book excerpt: The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced, high-performance computers, high-definition TV, broadband imaging systems, flat-panel displays, robotic systems, and medical electronics and diagnostics are a few examples of the miniaturized device technologies that depend on the utilization of thin film materials. This book presents an in-depth overview of the novel developments made by the scientific leaders in the area of modern dielectric films for advanced microelectronic applications. It contains clear, concise explanations of material science of dielectric films and their problem for device operation, including high-k, low-k, medium-k dielectric films and also specific features and requirements for dielectric films used in the packaging technology. A broad range of related topics are covered, from physical principles to design, fabrication, characterization, and applications of novel dielectric films.
Download or read book High k Gate Dielectrics for CMOS Technology written by Gang He and published by John Wiley & Sons. This book was released on 2012-08-10 with total page 560 pages. Available in PDF, EPUB and Kindle. Book excerpt: A state-of-the-art overview of high-k dielectric materials for advanced field-effect transistors, from both a fundamental and a technological viewpoint, summarizing the latest research results and development solutions. As such, the book clearly discusses the advantages of these materials over conventional materials and also addresses the issues that accompany their integration into existing production technologies. Aimed at academia and industry alike, this monograph combines introductory parts for newcomers to the field as well as advanced sections with directly applicable solutions for experienced researchers and developers in materials science, physics and electrical engineering.
Download or read book Low and High Dielectric Constant Materials written by Rajendra Singh and published by The Electrochemical Society. This book was released on 2000 with total page 242 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Dielectric Materials and Applications written by P. K. Choudhury and published by Nova Science Publishers. This book was released on 2019 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: "The book Dielectric Materials and Applications focuses on the recent research advancements in the area of dielectrics that can be utilized in a variety of technology-oriented applications. The topics covered in this book include the investigations of materials having low dielectric constants for Cu interconnects, a two-layer metallic waveguide as a tool to determine the complex permittivity of liquids and/or clinical diagnostics, microwave dielectric materials for the miniaturization of portable electronic devices, microwave assisted heating of dielectric and composite materials, and the dielectric properties of certain 3D nanocomposites. The other areas of discussion encapsulate the modeling of supershaped dielectric lens antennas, the roles of dielectric mediums in metamaterials to realize photonic devices ranging from absorbers, sensors and communication systems. Some of the chapters are purely experimental, whereas some others are based on modeling and simulation. Reading this volume truly remains key to understanding novel applications of dielectric materials in different areas of technological interest"--
Download or read book Advanced Interconnects for ULSI Technology written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2012-02-17 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.
