Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2016-11-18 with total page 974 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Download or read book Advanced Packaging Technologies For Fruits and Vegetables written by Roby Jose Ciiju and published by AGRIHORTICO. This book was released on 2021-03-18 with total page 63 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book begins with a short narration of current packaging practices followed by present day horticulture industry. After pointing out the disadvantages of some of the current practices, the author categorically states that we do not need to religiously follow traditional packaging practices if we are serious about curtailing the supply chain loss of fruits and vegetables. The author goes on listing out various types of packaging materials that are available today before addressing the major theme of the book, i.e. ‘Modern Innovations in Packaging Materials and Packaging Technologies’. MAP films, MIP films and active and intelligent packing materials are described in detail under this topic. Manufacturing process of polymer-based packing materials is also described for the better understanding of the reader. The author then elaborates on how to select a suitable packing material for your horticultural produce. Major two parameters that are to be considered are packing material properties and product-specific properties. The author makes a reference of various packaging designs and packaging standards also for those who are interested in these topics. According to the author advanced packaging technologies such as modified atmosphere packaging, modified interactive packaging, active and intelligent packaging, TBG technology and packaging technology for microwaveable containers are going to make a big difference in the way how highly perishable fruits and vegetables are packed and consumed. Finally, the author gives a short narration of various types of packaging machines that are available today and also lists out major global suppliers of packaging solutions for horticulture industry.
Download or read book Semiconductor Advanced Packaging written by John H. Lau and published by Springer Nature. This book was released on 2021-05-17 with total page 513 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Download or read book Bio based Materials for Food Packaging written by Shakeel Ahmed and published by Springer. This book was released on 2018-11-05 with total page 303 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides an overview of the lastest developments in biobased materials and their applications in food packaging. Written by experts in their respective research domain, its thirteen chapters discuss in detail fundamental knowledge on bio based materials. It is intended as a reference book for researchers, students, research scholars, academicians and scientists seeking biobased materials for food packaging applications.
Download or read book Advanced Materials for Thermal Management of Electronic Packaging written by Xingcun Colin Tong and published by Springer Science & Business Media. This book was released on 2011-01-05 with total page 633 pages. Available in PDF, EPUB and Kindle. Book excerpt: The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
Download or read book Semiconductor Packaging written by Andrea Chen and published by CRC Press. This book was released on 2016-04-19 with total page 216 pages. Available in PDF, EPUB and Kindle. Book excerpt: In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
Download or read book Advanced Flip Chip Packaging written by Ho-Ming Tong and published by Springer Science & Business Media. This book was released on 2013-03-20 with total page 562 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Download or read book Food Packaging written by Sanjay Mavinkere Rangappa and published by CRC Press. This book was released on 2020-10-20 with total page 413 pages. Available in PDF, EPUB and Kindle. Book excerpt: Food Packaging: Advanced Materials, Technologies, and Innovations is a one-stop reference for packaging materials researchers working across various industries. With chapters written by leading international researchers from industry, academia, government, and private research institutions, this book offers a broad view of important developments in food packaging. Presents an extensive survey of food packaging materials and modern technologies Demonstrates the potential of various materials for use in demanding applications Discusses the use of polymers, composites, nanotechnology, hybrid materials, coatings, wood-based, and other materials in packaging Describes biodegradable packaging, antimicrobial studies, and environmental issues related to packaging materials Offers current status, trends, opportunities, and future directions Aimed at advanced students, research scholars, and professionals in food packaging development, this application-oriented book will help expand the reader’s knowledge of advanced materials and their use of innovation in food packaging.
Download or read book Advanced Packaging Materials International Symposium on written by and published by . This book was released on with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Development of Packaging and Products for Use in Microwave Ovens written by Peter Pesheck and published by Elsevier. This book was released on 2009-07-30 with total page 406 pages. Available in PDF, EPUB and Kindle. Book excerpt: The efficient design of microwave food products and associated packaging materials for optimum food quality and safety requires knowledge of product dielectric properties and associated heating mechanisms, careful consideration of product geometry, knowledge of modern packaging and ingredient technologies, and application of computer simulation, statistics and experimental design. Integrated knowledge and efficient application of these tools is essential for those developing food products in this demanding field. Development of packaging and products for use in microwave ovens provides a focused and comprehensive review for developers. Part one discusses the principles of microwave heating and ovens, with an emphasis on the effect of food dielectric properties and geometry on heating uniformity and optimising the flavours and colours of microwave foods. Microwave packaging materials and design are discussed in Part two; chapters cover rigid packaging, susceptors and shielding. Product development, food, packaging and oven safety is the topic of Part three. Computer modelling of microwave products and active packaging is discussed in Part four. Written by a distinguished team of international contributors, Development of packaging and products for use in microwave ovens is a valuable resource for those in the food and packaging industries. Comprehensively reviews the principles of microwave heating and ovens assessing the effect of food dielectric properties on heating uniformity Thoroughly reviews microwave packaging materials and design including testing and regulatory issues Features a seven page section of colour diagrams to show heat distributions
Download or read book The Wiley Encyclopedia of Packaging Technology written by Kit L. Yam and published by John Wiley & Sons. This book was released on 2010-01-05 with total page 1368 pages. Available in PDF, EPUB and Kindle. Book excerpt: The complete and authoritative guide to modern packaging technologies —updated and expanded From A to Z, The Wiley Encyclopedia of Packaging Technology, Third Edition covers all aspects of packaging technologies essential to the food and pharmaceutical industries, among others. This edition has been thoroughly updated and expanded to include important innovations and changes in materials, processes, and technologies that have occurred over the past decade. It is an invaluable resource for packaging technologists, scientists and engineers, students and educators, packaging material suppliers, packaging converters, packaging machinery manufacturers, processors, retailers, and regulatory agencies. In addition to updating and improving articles from the previous edition, new articles are also added to cover the recent advances and developments in packaging. Content new to this edition includes: Advanced packaging materials such as antimicrobial materials, biobased materials, nanocomposite materials, ceramic-coated films, and perforated films Advanced packaging technologies such as active and intelligent packaging, radio frequency identification (RFID), controlled release packaging, smart blending, nanotechnology, biosensor technology, and package integrity inspection Various aspects important to packaging such as sustainable packaging, migration, lipid oxidation, light protection, and intellectual property Contributions from experts in all-important aspects of packaging Extensive cross-referencing and easy-to-access information on all subjects Large, double-column format for easy reference
Download or read book Advances in Embedded and Fan Out Wafer Level Packaging Technologies written by Beth Keser and published by John Wiley & Sons. This book was released on 2019-02-12 with total page 576 pages. Available in PDF, EPUB and Kindle. Book excerpt: Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.
Download or read book Packaging Technology and Engineering written by Dipak Kumar Sarkar and published by John Wiley & Sons. This book was released on 2020-09-08 with total page 539 pages. Available in PDF, EPUB and Kindle. Book excerpt: Covers chemistry, physics, engineering, and therapeutic aspects of packaging—universal to pharmaceutical, medical, and food applications This book covers the chemistry, physics, materials science, engineering, and therapeutic aspects of many different types of packaging materials, emphasizing throughout the applicability of various aspects of packaging science and technology. It also provides a simultaneous discussion of interrelated fields, and addresses the universal issues within these fields’ application areas. Intended as a technical reference and as a study aid, it is relevant to anyone who studies or uses packaging or packaging materials. Packaging Technology and Engineering: Pharmaceutical, Medical and Food Applications begins with an overview of the history of the topic. It then offers chapters on the methods of obtaining raw materials, the chemistry of polymeric and non-polymeric packaging materials, physico-chemical quality parameters, and the manufacturing of packaging. Other topics look at: additives, use, suppliers, safety and environmental concerns, regulation, anti-fraud activities, new trends, and the future of packaging technology. The book also features numerous problems and worked solutions to aid student comprehension. Covers packaging and packaging materials, their properties and technologies Addresses the chemical engineering, physics, and chemistry of packaging materials, and the individual requirements for food, pharmaceutical, and medical device packaging Includes current issues such as environmental concerns and sustainability, recycling and after-use, anti-counterfeiting technology, and packaging regulations and guidelines Packaging Technology and Engineering: Pharmaceutical, Medical and Food Applications will appeal to all packaging technologists, scientists, and engineers in industry, and in regulatory agencies. It is also an excellent book for advanced students studying packaging courses, within pharmacy, pharmaceutical sciences, chemical sciences, biomedical sciences, medical sciences, engineering, product design and technology, and food science/technology.
Download or read book 2007 12th International Symposium on Advanced Packaging Materials Processes Properties and Interfaces San Jose CA 3 5 October 2007 written by International Symposium on Advanced Packaging Materials and published by . This book was released on 2007 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Bio Based Packaging written by Salit Mohd Sapuan and published by John Wiley & Sons. This book was released on 2021-03-29 with total page 548 pages. Available in PDF, EPUB and Kindle. Book excerpt: Bio-Based Packaging Bio-Based Packaging An authoritative and up-to-date review of sustainable packaging development and applications Bio-Based Packaging explores using renewable and biodegradable materials as sustainable alternatives to non-renewable, petroleum-based packaging. This comprehensive volume surveys the properties of biopolymers, the environmental and economic impact of bio-based packaging, and new and emerging technologies that are increasing the number of potential applications of green materials in the packaging industry. Contributions address the advantages and challenges of bio-based packaging, discuss new materials to be used for food packaging, and highlight cutting-edge research on polymers such as starch, protein, polylactic acid (PLA), pectin, nanocellulose, and their nanocomposites. In-depth yet accessible chapters provide balanced coverage of a broad range of practical topics, including life cycle assessment (LCA) of bio-based packaging products, consumer perceptions and preferences, supply chains, business strategies and markets in biodegradable food packaging, manufacturing of bio-based packaging materials, and regulations for food packaging materials. Detailed discussions provide valuable insight into the opportunities for biopolymers in end-use sectors, the barriers to biopolymer-based concepts in the packaging market, recent advances made in the field of biopolymeric composite materials, the future of bio-plastics in commercial food packaging, and more. This book: Provides deep coverage of the bio-based packaging development, characterization, regulations and environmental and socio-economic impact Contains real-world case studies of bio-based packaging applications Includes an overview of recent advances and emerging aspects of nanotechnology for development of sustainable composites for packaging Discusses renewable sources for packaging material and the reuse and recycling of bio-based packaging products Bio-Based Packaging is essential reading for academics, researchers, and industry professionals working in packaging materials, renewable resources, sustainability, polymerization technology, food technology, material engineering, and related fields. For more information on the Wiley Series in Renewable Resources, visit www.wiley.com/go/rrs
Download or read book Microelectromechanical Systems written by Committee on Advanced Materials and Fabrication Methods for Microelectromechanical Systems and published by National Academies Press. This book was released on 1997-12-15 with total page 76 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectromenchanical systems (MEMS) is a revolutionary field that adapts for new uses a technology already optimized to accomplish a specific set of objectives. The silicon-based integrated circuits process is so highly refined it can produce millions of electrical elements on a single chip and define their critical dimensions to tolerances of 100-billionths of a meter. The MEMS revolution harnesses the integrated circuitry know-how to build working microsystems from micromechanical and microelectronic elements. MEMS is a multidisciplinary field involving challenges and opportunites for electrical, mechanical, chemical, and biomedical engineering as well as physics, biology, and chemistry. As MEMS begin to permeate more and more industrial procedures, society as a whole will be strongly affected because MEMS provide a new design technology that could rival--perhaps surpass--the societal impact of integrated circuits.
Download or read book International Symposium on Advanced Packaging Materials written by and published by . This book was released on 2000 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
