Download or read book 2018 IEEE 38th International Electronics Manufacturing Technology Conference IEMT written by and published by . This book was released on 2018 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2018 IEEE 38th International Electronics Manufacturing Technology Conference IEMT written by IEEE Staff and published by . This book was released on 2018-09-04 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: It aims to provide good coverage of technological developments in all areas of electronics packaging, from design to manufacturing and operation It is a major forum, providing opportunities to network and meet leading experts, in addition to exchange of up to date knowledge in the field Theme Packaging for the SMART world The selection is based on simplicity & catchy of the tag line, but focus on the new trends in our technological work world on the SMART devices The convergence to the SMART World unlocks the potential of packaging inside that builds smart things everywhere, from I4 0 (smart Industry & manufacture) to ADAS HEV (smart vehicle) to everything that s intelligent (smart city, smart devices, IoT, )
Download or read book Data Intelligence and Cognitive Informatics written by I. Jeena Jacob and published by Springer Nature. This book was released on 2021-01-08 with total page 916 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses new cognitive informatics tools, algorithms and methods that mimic the mechanisms of the human brain which lead to an impending revolution in understating a large amount of data generated by various smart applications. The book is a collection of peer-reviewed best selected research papers presented at the International Conference on Data Intelligence and Cognitive Informatics (ICDICI 2020), organized by SCAD College of Engineering and Technology, Tirunelveli, India, during 8–9 July 2020. The book includes novel work in data intelligence domain which combines with the increasing efforts of artificial intelligence, machine learning, deep learning and cognitive science to study and develop a deeper understanding of the information processing systems.
Download or read book Electronics Manufacturing Technology iemt 2000 Ieee cpmt 26th written by Iemt and published by . This book was released on 1996 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 1998 IEEE CPMT 22nd International Electronics Manufacturing Technology Symposium written by and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1998 with total page 165 pages. Available in PDF, EPUB and Kindle. Book excerpt: This text on electronics manufacturing technology covers such topics as: new materials, including substrates, metallization, encapsulants and fatigue-resistant solder; test and reliability; thermal management; mechantronics; MCMs; sensors; and flip chip in automotive use.
Download or read book Electronic Manufacturing Technology written by Japan) I. E. E. E./C. H. M. T. International Electronic Manufacturing Technology (IEMT) symposium (14th : 1993 : Kanazawa and published by . This book was released on 1993 with total page 396 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electronic Manufacturing Technology written by and published by . This book was released on 1989 with total page 366 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Moisture Sensitivity of Plastic Packages of IC Devices written by X.J. Fan and published by Springer Science & Business Media. This book was released on 2010-07-23 with total page 573 pages. Available in PDF, EPUB and Kindle. Book excerpt: Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.
Download or read book Copper Wire Bonding written by Preeti S Chauhan and published by Springer Science & Business Media. This book was released on 2013-09-20 with total page 254 pages. Available in PDF, EPUB and Kindle. Book excerpt: This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process and reliability concerns due to its material properties. Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation. In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed. The book also discusses best practices and recommendations on the bond process, bond–pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components. In summary, this book: Introduces copper wire bonding technologies Presents copper wire bonding processes Discusses copper wire bonding metallurgies Covers recent advancements in copper wire bonding including the bonding process, equipment changes, bond–pad materials and surface finishes Covers the reliability tests and concerns Covers the current implementation of copper wire bonding in the electronics industry Features 120 figures and tables Copper Wire Bonding is an essential reference for industry professionals seeking detailed information on all facets of copper wire bonding technology.
Download or read book Introduction to Microsystem Packaging Technology written by Yufeng Jin and published by CRC Press. This book was released on 2017-12-19 with total page 232 pages. Available in PDF, EPUB and Kindle. Book excerpt: The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.
Download or read book The IBIS Handbook of Nanoindentation written by Anthony C. Fischer-Cripps and published by . This book was released on 2005 with total page 60 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Lead free Electronics written by Sanka Ganesan and published by John Wiley & Sons. This book was released on 2006-02-17 with total page 804 pages. Available in PDF, EPUB and Kindle. Book excerpt: Lead-free Electronics provides guidance on the design and use of lead-free electronics as well as technical and legislative perspectives. All the complex challenges confronting the elec-tronics industry are skillfully addressed: * Complying with state legislation * Implementing the transition to lead-free electronics, including anticipating associated costs and potential supply chain issues * Understanding intellectual property issues in lead-free alloys and their applications, including licensing and infringement * Implementing cost effective manufacturing and testing * Reducing risks due to tin whiskers * Finding lead-free solutions in harsh environments such as in the automotive and telecommunications industries * Understanding the capabilities and limitations of conductive adhesives in lead-free interconnects * Devising solutions for lead-free, flip-chip interconnects in high-performance integrated circuit products Each chapter is written by leading experts in the field and carefully edited to ensure a consistent approach. Readers will find all the latest information, including the most recent data on cyclic thermomechanical deformation properties of lead-free SnAgCu alloys and a comparison of the properties of standard Sn-Pb versus lead-free alloys, using the energy partitioning approach. With legislative and market pressure to eliminate the use of lead in electronics manufacturing, this timely publication is essential reading for all engineers and professionals in the electronics industry.
Download or read book Through life Engineering Services written by Louis Redding and published by Springer. This book was released on 2014-12-26 with total page 459 pages. Available in PDF, EPUB and Kindle. Book excerpt: Demonstrating the latest research and analysis in the area of through-life engineering services (TES), this book utilizes case studies and expert analysis from an international array of practitioners and researchers – who together represent multiple manufacturing sectors: aerospace, railway and automotive – to maximize reader insights into the field of through-life engineering services. As part of the EPSRC Centre in Through-life Engineering Services program to support the academic and industrial community, this book presents an overview of non-destructive testing techniques and applications and provides the reader with the information needed to assess degradation and possible automation of through-life engineering service activities . The latest developments in maintenance-repair-overhaul (MRO) are presented with emphasis on cleaning technologies, repair and overhaul approaches and planning and digital assistance. The impact of these technologies on sustainable enterprises is also analyzed. This book will help to support the existing TES community and will provide future studies with a strong base from which to analyze and apply techn9olgical trends to real world examples.
Download or read book Influence of Temperature on Microelectronics and System Reliability written by Pradeep Lall and published by CRC Press. This book was released on 2020-07-09 with total page 332 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The
Download or read book Reliability of MEMS written by Osamu Tabata and published by John Wiley & Sons. This book was released on 2008-02-04 with total page 328 pages. Available in PDF, EPUB and Kindle. Book excerpt: This first book to cover exclusively and in detail the principles, tools and methods for determining the reliability of microelectromechanical materials, components and devices covers both component materials as well as entire MEMS devices. Divided into two major parts, following a general introductory chapter to reliability issues, the first part looks at the mechanical properties of the materials used in MEMS, explaining in detail the necessary measuring technologies -- nanoindenters, bulge methods, bending tests, tensile tests, and others. Part Two treats the actual devices, organized by important device categories such as pressure sensors, inertial sensors, RF MEMS, and optical MEMS.
Download or read book Intelligent Fault Diagnosis and Prognosis for Engineering Systems written by George Vachtsevanos and published by Wiley. This book was released on 2006-09-29 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Expert guidance on theory and practice in condition-based intelligent machine fault diagnosis and failure prognosis Intelligent Fault Diagnosis and Prognosis for Engineering Systems gives a complete presentation of basic essentials of fault diagnosis and failure prognosis, and takes a look at the cutting-edge discipline of intelligent fault diagnosis and failure prognosis technologies for condition-based maintenance. It thoroughly details the interdisciplinary methods required to understand the physics of failure mechanisms in materials, structures, and rotating equipment, and also presents strategies to detect faults or incipient failures and predict the remaining useful life of failing components. Case studies are used throughout the book to illustrate enabling technologies. Intelligent Fault Diagnosis and Prognosis for Engineering Systems offers material in a holistic and integrated approach that addresses the various interdisciplinary components of the field--from electrical, mechanical, industrial, and computer engineering to business management. This invaluably helpful book: * Includes state-of-the-art algorithms, methodologies, and contributions from leading experts, including cost-benefit analysis tools and performance assessment techniques * Covers theory and practice in a way that is rooted in industry research and experience * Presents the only systematic, holistic approach to a strongly interdisciplinary topic
Download or read book Design for Manufacturability Handbook written by James G. Bralla and published by McGraw Hill Professional. This book was released on 1999 with total page 1361 pages. Available in PDF, EPUB and Kindle. Book excerpt: Offers a blueprint for various stages of the manufacturing process. This handbook provides directions for solid and practical design, including a quick check of do's and don'ts as well as specific tips for developing the most producible design. It also includes the details needed to forecast a successful design project.
