Download or read book VLSI Planarization written by V.Z. Feinberg and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 187 pages. Available in PDF, EPUB and Kindle. Book excerpt: At the beginning we would like to introduce a refinement. The term 'VLSI planarization' means planarization of a circuit of VLSI, Le. the embedding of a VLSI circuit in the plane by different criteria such as the minimum number of connectors, the minimum total length of connectors, the minimum number of over-the-element routes, etc. A connector is designed to connect the broken sections of a net. It can be implemented in different ways depending on the technology. Connectors for a bipolar VLSI are implemented by diffused tun nels, for instance. By over-the-element route we shall mean a connection which intersects the enclosing rectangle of an element (or a cell). The possibility of the construction such connections during circuit planarization is reflected in element models and can be ensured, for example, by the availability of areas within the rectangles where connections may be routed. VLSI planarization is one of the basic stages (others will be discussed below) of the so called topological (in the mathematical sense) approach to VLSI design. This approach does not lie in the direction of the classical approach to automation of VLSI layout design. In the classical approach to computer aided design the placement and routing problems are solved successively. The topological approach, in contrast, allows one to solve both problems at the same time. This is achieved by constructing a planar embedding of a circuit and obtaining the proper VLSI layout on the basis of it.
Download or read book Advanced CMOS Process Technology written by J Pimbley and published by Elsevier. This book was released on 2012-12-02 with total page 305 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced CMOS Process Technology is part of the VLSI Electronics Microstructure Science series. The main topic of this book is complementary metal-oxide semiconductor or CMOS technology, which plays a significant part in the electronics systems. The topics covered in this book range from metallization, isolation techniques, reliability, and yield. The volume begins with an introductory chapter that discusses the microelectronics revolution of the 20th century. Then Chapter 2 puts focus on the CMOS devices and circuit background, discussing CMOS capacitors and field effect transistors. Metallization topics and concepts are covered in Chapter 3, while isolation techniques are tackled in Chapter 4. Long-term reliability of CMOS is the topic covered in Chapter 5. Finally, the ability of semiconductor technology to yield circuits is discussed in Chapter 6. The book is particularly addressed to engineers, scientists, and technical managers.
Download or read book Chemical Mechanical Planarization of Microelectronic Materials written by Joseph M. Steigerwald and published by John Wiley & Sons. This book was released on 1997 with total page 354 pages. Available in PDF, EPUB and Kindle. Book excerpt: The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry.
Download or read book High Performance Polymer written by Guy Rabilloud and published by Editions OPHRYS. This book was released on with total page 596 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microelectronic Materials and Processes written by R.A. Levy and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 992 pages. Available in PDF, EPUB and Kindle. Book excerpt: The primary thrust of very large scale integration (VLS!) is the miniaturization of devices to increase packing density, achieve higher speed, and consume lower power. The fabrication of integrated circuits containing in excess of four million components per chip with design rules in the submicron range has now been made possible by the introduction of innovative circuit designs and the development of new microelectronic materials and processes. This book addresses the latter challenge by assessing the current status of the science and technology associated with the production of VLSI silicon circuits. It represents the cumulative effort of experts from academia and industry who have come together to blend their expertise into a tutorial overview and cohesive update of this rapidly expanding field. A balance of fundamental and applied contributions cover the basics of microelectronics materials and process engineering. Subjects in materials science include silicon, silicides, resists, dielectrics, and interconnect metallization. Subjects in process engineering include crystal growth, epitaxy, oxidation, thin film deposition, fine-line lithography, dry etching, ion implantation, and diffusion. Other related topics such as process simulation, defects phenomena, and diagnostic techniques are also included. This book is the result of a NATO-sponsored Advanced Study Institute (AS!) held in Castelvecchio Pascoli, Italy. Invited speakers at this institute provided manuscripts which were edited, updated, and integrated with other contributions solicited from non-participants to this AS!.
Download or read book Proceedings of the Symposium on Electromigration of Metals and First International Symposium on Multilevel Metallization and Packaging written by James R. Lloyd and published by . This book was released on 1985 with total page 214 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Topics in Topological Graph Theory written by Lowell W. Beineke and published by Cambridge University Press. This book was released on 2009-07-09 with total page 387 pages. Available in PDF, EPUB and Kindle. Book excerpt: The use of topological ideas to explore various aspects of graph theory, and vice versa, is a fruitful area of research. There are links with other areas of mathematics, such as design theory and geometry, and increasingly with such areas as computer networks where symmetry is an important feature. Other books cover portions of the material here, but there are no other books with such a wide scope. This book contains fifteen expository chapters written by acknowledged international experts in the field. Their well-written contributions have been carefully edited to enhance readability and to standardize the chapter structure, terminology and notation throughout the book. To help the reader, there is an extensive introductory chapter that covers the basic background material in graph theory and the topology of surfaces. Each chapter concludes with an extensive list of references.
Download or read book Neural Network Parallel Computing written by Yoshiyasu Takefuji and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 237 pages. Available in PDF, EPUB and Kindle. Book excerpt: Neural Network Parallel Computing is the first book available to the professional market on neural network computing for optimization problems. This introductory book is not only for the novice reader, but for experts in a variety of areas including parallel computing, neural network computing, computer science, communications, graph theory, computer aided design for VLSI circuits, molecular biology, management science, and operations research. The goal of the book is to facilitate an understanding as to the uses of neural network models in real-world applications. Neural Network Parallel Computing presents a major breakthrough in science and a variety of engineering fields. The computational power of neural network computing is demonstrated by solving numerous problems such as N-queen, crossbar switch scheduling, four-coloring and k-colorability, graph planarization and channel routing, RNA secondary structure prediction, knight's tour, spare allocation, sorting and searching, and tiling. Neural Network Parallel Computing is an excellent reference for researchers in all areas covered by the book. Furthermore, the text may be used in a senior or graduate level course on the topic.
Download or read book Guidebook for Managing Silicon Chip Reliability written by Michael Pecht and published by CRC Press. This book was released on 2017-11-22 with total page 224 pages. Available in PDF, EPUB and Kindle. Book excerpt: Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future? Chapters discuss: failure sites, operational loads, and failure mechanism intrinsic device sensitivities electromigration hot carrier aging time dependent dielectric breakdown mechanical stress induced migration alpha particle sensitivity electrostatic discharge (ESD) and electrical overstress latch-up qualification screening guidelines for designing reliability Guidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.
Download or read book Proceedings of the Symposium on Multilevel Metallization Interconnection and Contact Technologies written by L. B. Rothman and published by . This book was released on 1987 with total page 288 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book ISTFA 2006 written by Electronic Device Failure Analysis Society and published by ASM International. This book was released on 2006 with total page 524 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Handbook of Algorithms for Physical Design Automation written by Charles J. Alpert and published by CRC Press. This book was released on 2008-11-12 with total page 1044 pages. Available in PDF, EPUB and Kindle. Book excerpt: The physical design flow of any project depends upon the size of the design, the technology, the number of designers, the clock frequency, and the time to do the design. As technology advances and design-styles change, physical design flows are constantly reinvented as traditional phases are removed and new ones are added to accommodate changes in
Download or read book Advances in Chemical Mechanical Planarization CMP written by Babu Suryadevara and published by Woodhead Publishing. This book was released on 2016-01-09 with total page 538 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction. - Considers techniques and processes for CMP of dielectric and metal films - Includes chapters devoted to CMP for particular materials - Addresses consumables and process control for improved CMP
Download or read book VLSI Planarization written by V. Feinberg and published by Springer. This book was released on 1997-04-30 with total page 200 pages. Available in PDF, EPUB and Kindle. Book excerpt: Based on original research as well as the literature, describes recent developments in one of the basic stages of the topological approach to VLSI design: embedding a VLSI in the plane by different criteria, such as minimizing the number of connectors, the total length of connectors, and the number of over-the- element routes. Concentrates on essentially hypergraph models of electric circuits and their planarization techniques, based on the notion that a hypergraph language offers the most adequate representation of a circuit's structure. Of interest to theoretical and applied mathematicians working in VLSI design, algorithms, graph theory, or complexity theory. Annotation copyrighted by Book News, Inc., Portland, OR
Download or read book Microelectronic Applications of Chemical Mechanical Planarization written by Yuzhuo Li and published by John Wiley & Sons. This book was released on 2007-12-04 with total page 760 pages. Available in PDF, EPUB and Kindle. Book excerpt: An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: * Provides in-depth coverage of a wide range of state-of-the-art technologies and applications * Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips * Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP * Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP * Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.
Download or read book Chemical Mechanical Planarization of Microelectronic Materials written by Joseph M. Steigerwald and published by John Wiley & Sons. This book was released on 2008-09-26 with total page 337 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now. Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP. Authors Steigerwald, Murarka, and Gutmann-all leading CMP pioneers-provide a historical overview of CMP, explain the various chemical and mechanical concepts involved, describe CMP materials and processes, review the latest scientific data on CMP worldwide, and offer examples of its uses in the microelectronics industry. They provide detailed coverage of the CMP of various materials used in the making of microcircuitry: tungsten, aluminum, copper, polysilicon, and various dielectric materials, including polymers. The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry. An indispensable resource for scientists and engineers working in the microelectronics industry Chemical Mechanical Planarization of Microelectronic Materials is the only comprehensive single-source reference to one of the fastest growing integrated circuit manufacturing technologies. It provides engineers and scientists who work in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP, including: * The history of CMP * Chemical and mechanical underpinnings of CMP * CMP materials and processes * Applications of CMP in the microelectronics industry * The CMP of tungsten, aluminum, copper, polysilicon, and various dielectrics, including polymers used in integrated circuit fabrication * Post-CMP cleaning techniques * Chapter-end problem sets are also included to assist readers in developing a practical understanding of CMP.
Download or read book Precision Machining of Advanced Materials written by L. Zhang and published by Trans Tech Publications Ltd. This book was released on 2001-01-10 with total page 205 pages. Available in PDF, EPUB and Kindle. Book excerpt: Precision machining is an essential manufacturing process to achieve high dimensional accuracy and high surface integrity of functional components for various technological applications, such as those in aeronautical, biomedical, mechanical, metrological, mechatronic, nano-technological and microscopy industries. To achieve a satisfactory operation of precision machining, however, one must have a deep understanding of the setting and control of machining conditions, mechanisms of material removal and effectiveness of the cutting tools. As a result, a quality precision machining requires a comprehensive integration of the development of machine tools, the improvement of machining methods and the wise application of materials science and engineering and mechanics of solids.
