Download or read book Transient Liquid Phase Bonding for Die Attach in High Power High Temperature Applications written by Avishesh Dhakal and published by . This book was released on 2012 with total page 158 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Die Attach Materials for High Temperature Applications in Microelectronics Packaging written by Kim S. Siow and published by Springer. This book was released on 2019-01-29 with total page 279 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.

Download or read book Transient Liquid Phase Bonding written by David J. Fisher and published by Materials Research Forum LLC. This book was released on 2019-02-16 with total page 166 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book presents a complete overview on the topic of Transient Liquid Phase Bonding (TLPB) which has many high-tech applications, ranging from the production and repair of turbine engines in the aerospace industry, to nuclear power plants and the connection of circuit lines in the microelectronics industry. The TLPB process and its specific applications are presented in great detail: Self-Bonding of Pure Materials; Bonding Different Pure Materials; Self-Bonding of Composites; Self-Bonding of Simple Alloys; Self-Bonding of Complex Alloys; Bonding Same-Base Alloys; Bonding Different-Base Alloys; Bonding Ceramics to Ceramics; Bonding Ceramics to Metals. The book references 483 original resources and includes their direct web link for in-depth reading.

Download or read book Transient Liquid Phase Bonding as a Joining Technique for High temperature Power Electronics written by Nicholas Seth Bosco and published by . This book was released on 2003 with total page 344 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Lead free Soldering Process Development and Reliability written by Jasbir Bath and published by John Wiley & Sons. This book was released on 2020-06-12 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt: Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: · Developments in process engineering (SMT, Wave, Rework, Paste Technology) · Low temperature, high temperature and high reliability alloys · Intermetallic compounds · PCB surface finishes and laminates · Underfills, encapsulants and conformal coatings · Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book’s explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements.

Download or read book Wettability of High Temperature Materials During Transient Liquid Phase TLP Bonding written by Subhadravalli Venkata Chitti and published by . This book was released on 2005 with total page 362 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Fundamentals of Electrochemical Deposition written by Milan Paunovic and published by John Wiley & Sons. This book was released on 2006-08-11 with total page 388 pages. Available in PDF, EPUB and Kindle. Book excerpt: Excellent teaching and resource material . . . it is concise, coherently structured, and easy to read . . . highly recommended for students, engineers, and researchers in all related fields." -Corrosion on the First Edition of Fundamentals of Electrochemical Deposition From computer hardware to automobiles, medical diagnostics to aerospace, electrochemical deposition plays a crucial role in an array of key industries. Fundamentals of Electrochemical Deposition, Second Edition is a comprehensive introduction to one of today's most exciting and rapidly evolving fields of practical knowledge. The most authoritative introduction to the field so far, the book presents detailed coverage of the full range of electrochemical deposition processes and technologies, including: * Metal-solution interphase * Charge transfer across an interphase * Formation of an equilibrium electrode potential * Nucleation and growth of thin films * Kinetics and mechanisms of electrodeposition * Electroless deposition * In situ characterization of deposition processes * Structure and properties of deposits * Multilayered and composite thin films * Interdiffusion in thin film * Applications in the semiconductor industry and the field of medicine This new edition updates the prior edition to address the new developments in the science and its applications, with new chapters on innovative applications of electrochemical deposition in semiconductor technology, magnetism and microelectronics, and medical instrumentation. Added coverage includes such topics as binding energy, nanoclusters, atomic force, and scanning tunneling microscopy.Example problems at the end of chapters and other features clarify and improve understanding of the material. Written by an author team with extensive experience in both industry and academe, this reference and text provides a well-rounded introduction to the field for students, as well as a means for professional chemists, engineers, and technicians to expand and sharpen their skills in using the technology.

Download or read book Extreme Environment Electronics written by John D. Cressler and published by CRC Press. This book was released on 2017-12-19 with total page 1041 pages. Available in PDF, EPUB and Kindle. Book excerpt: Unfriendly to conventional electronic devices, circuits, and systems, extreme environments represent a serious challenge to designers and mission architects. The first truly comprehensive guide to this specialized field, Extreme Environment Electronics explains the essential aspects of designing and using devices, circuits, and electronic systems intended to operate in extreme environments, including across wide temperature ranges and in radiation-intense scenarios such as space. The Definitive Guide to Extreme Environment Electronics Featuring contributions by some of the world’s foremost experts in extreme environment electronics, the book provides in-depth information on a wide array of topics. It begins by describing the extreme conditions and then delves into a description of suitable semiconductor technologies and the modeling of devices within those technologies. It also discusses reliability issues and failure mechanisms that readers need to be aware of, as well as best practices for the design of these electronics. Continuing beyond just the "paper design" of building blocks, the book rounds out coverage of the design realization process with verification techniques and chapters on electronic packaging for extreme environments. The final set of chapters describes actual chip-level designs for applications in energy and space exploration. Requiring only a basic background in electronics, the book combines theoretical and practical aspects in each self-contained chapter. Appendices supply additional background material. With its broad coverage and depth, and the expertise of the contributing authors, this is an invaluable reference for engineers, scientists, and technical managers, as well as researchers and graduate students. A hands-on resource, it explores what is required to successfully operate electronics in the most demanding conditions.

Download or read book High Temperature Electronics written by F. Patrick McCluskey and published by CRC Press. This book was released on 1996-12-13 with total page 354 pages. Available in PDF, EPUB and Kindle. Book excerpt: The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.

Download or read book Intermetallic Compounds written by Mahmood Aliofkhazraei and published by BoD – Books on Demand. This book was released on 2018-05-30 with total page 228 pages. Available in PDF, EPUB and Kindle. Book excerpt: Intermetallic compounds are usually brittle with high melting points. Their properties are often found among ceramic and metallic materials. In most cases, their hot corrosion resistance and simultaneously hardness are important. One of the main applications of intermetallic compounds is for superalloy turbine blades in which they show appropriate high-temperature-related properties. This book collects new developments about intermetallic compounds and their recent usages.

Download or read book Harsh Environment Electronics written by Ahmed Sharif and published by John Wiley & Sons. This book was released on 2019-08-05 with total page 398 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage. Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact. -Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics -Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature -Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications -Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more -A pivotal reference for professionals, engineers, students, and researchers Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.

Download or read book Brazing and Soldering 2012 written by Robbin Gourley and published by ASM International. This book was released on 2012-01-01 with total page 533 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Development of High Temperature Diffusion Barriers and a Transient Liquid phase Wafer Bonding for Thermoelectric MEMS Energy Harvester written by Nando Budhiman and published by . This book was released on 2015 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Innovative Solid State Bonding Designs and Techniques for High Power Electronic and Laser Diode Packaging written by Yi-Ling Chen and published by . This book was released on 2016 with total page 180 pages. Available in PDF, EPUB and Kindle. Book excerpt: Rapid evolution of electronics industry has made the adoption of high performance chips more urgent. In fact, those chips cannot be used unless high temperature die attach materials and methods are available. The conventional die attach methods typically require a processing temperature 20--30 °C above the melting temperature of bonding material, which melts and reacts with to-be-bonded parts to form the bonding joint. For high temperature applications (> 400 °C), the processing temperature will sharply increase along with the increased melting temperature to reach the molten phase. However, such high processing temperature will damage nearly all electronic components. To respond to such challenge, the metal bonding is considered to be a possible solution.In this dissertation, the solid-state bonding technique is employed for various bonding designs by electroplating Ag-based and In-based systems as bonding media. No molten phase or flux is involved. For most cases, the bonding conditions are conducted at 300 °C with 6.89 MPa (1,000 psi) pressure for a dwell time of 3 min in vacuum. The bonding time, 3 min, is constrained by the furnace. It is worth mentioning that this pressure is less than 10% of what is used in industrial thermo-compression processes.To begin with, silver (Ag) was chosen as a bonding medium because of its exceptional properties and reasonable price. There are two designs for the Ag layer. For the first design, the 50 microm Ag layer plated on the copper (Cu) substrate is initially annealed at 400 °C for 5 h to increase Ag grain sizes, thereby making it easier to deform during bonding. For the second design, the 10 microm Ag layer is plated on the substrate and followed another 5 microm Ag with cavities. The fundamental concept is to release the thermal induced stress by creating cavities in the Ag layer to allow easier plastic deformation for the bonding medium. The resulting Ag layers are then bonded to the Cu chips. For both designs, all samples are bonded well and pass MIL-STD-883J method 2019.9. The Ag layer is also applied to the Cu wire bonding. To overcome Cu oxidation issue, the bonding surface on the 1 mm Cu wire is plated a 50 microm Ag layer. An annealing step is followed to facilitate the Ag layer easier to deform and conform to the Cu or Si bonding surfaces. In-plane pull test and vertical pull test are performed to measure the breaking force of the wire bonds. For wire-bonds made on the Cu substrate, the breaking forces on in-plane pull test are greater than 20 kg. The breaking forces on vertical pull test are approximately one-half of in-plane pull test results. For wire-bonds made on Si chip, breaking forces are approximately 80% of those made on Cu substrate.Next, the novel method is to bond the Si chips to Cu substrates directly. This structure design can provide low-resistance paths for electricity and heat. There is no specific joint used in between. The basic concept is to provide room for Cu and Si to deform without restriction by producing trenches inside the Cu substrate. When the bond between two surfaces is formed, the trenches inside the Cu substrate could release the part of thermal stress from the coefficient of thermal expansion CTE mismatch. Therefore, the bond could deal with the large CTE mismatch between Si (3 ppm/°C) and Cu (17 ppm/°C). The cross-sectional images show that the Si chips are well bonded to the Cu substrates without visible voids and cracks. After the bonding process, the simple shear tests are conducted to evaluate the bond strength, while the Si chips are all broken first. It demonstrates that the bond is stronger than the Si chip itself.Finally, the Ag-rich Ag-In solid solution layers have successfully developed on Si and silicon carbide (SiC) chips. Ag has definite advantages among metals, but it still has its own weaknesses, which can actually or potentially lead to failure. That is Ag can be tarnished not only when exposed to certain corrosive gases such as hydrogen sulfide or sulfur gas but also under normal atmospheric conditions for a long period of time. Ag-In solid solution is further studied while Ag-In binary system has been demonstrated with an exceptional anti-tarnish property. To fabricate the single phase Ag-In solid solution, the Ag/In/Ag multilayers are electroplated on the chips. Importantly, the bottom Ag layer is initially annealed at 350 °C to increase its grain sizes and to reduce grain boundaries, inasmuch as the reaction rate between Ag and In is subject to the microstructure of Ag layer. The In/Ag layers are followed to be plated onto Si chip. To decompose AgIn2 and Ag2In, the two-step annealing process is then performed in a vacuum environment at 180 °C and 350 °C, respectively. After the bonding process, the compositions of resulting joints are measured by SEM/EDX, which is a homogeneous Ag-rich Ag-In solid solution.In this study, five different bonding designs are reported. All bonds made between the chips and the substrates are fabricated at relatively low processing temperatures. The bonding structures are designed to be used for high operating temperatures. The results are encouraging. These novel methods may bring a chance for those who need die-attach materials for high performance electronic devices under severe environmental conditions in industries.

Download or read book SiC based Miniaturized Devices written by Stephen Edward Saddow and published by MDPI. This book was released on 2020-06-18 with total page 170 pages. Available in PDF, EPUB and Kindle. Book excerpt: MEMS devices are found in many of today’s electronic devices and systems, from air-bag sensors in cars to smart phones, embedded systems, etc. Increasingly, the reduction in dimensions has led to nanometer-scale devices, called NEMS. The plethora of applications on the commercial market speaks for itself, and especially for the highly precise manufacturing of silicon-based MEMS and NEMS. While this is a tremendous achievement, silicon as a material has some drawbacks, mainly in the area of mechanical fatigue and thermal properties. Silicon carbide (SiC), a well-known wide-bandgap semiconductor whose adoption in commercial products is experiening exponential growth, especially in the power electronics arena. While SiC MEMS have been around for decades, in this Special Issue we seek to capture both an overview of the devices that have been demonstrated to date, as well as bring new technologies and progress in the MEMS processing area to the forefront. Thus, this Special Issue seeks to showcase research papers, short communications, and review articles that focus on: (1) novel designs, fabrication, control, and modeling of SiC MEMS and NEMS based on all kinds of actuation mechanisms; and (2) new developments in applying SiC MEMS and NEMS in consumer electronics, optical communications, industry, medicine, agriculture, space, and defense.

Download or read book Recent Progress in Lead Free Solder Technology written by Mohd Arif Anuar Mohd Salleh and published by Springer Nature. This book was released on 2022-03-01 with total page 332 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials’ development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.

Download or read book Green and Sustainable Manufacturing of Advanced Material written by Mrityunjay Singh and published by Elsevier. This book was released on 2015-08-18 with total page 708 pages. Available in PDF, EPUB and Kindle. Book excerpt: Sustainable development is a globally recognized mandate and it includes green or environment-friendly manufacturing practices. Such practices orchestrate with the self-healing and self-replenishing capability of natural ecosystems. Green manufacturing encompasses synthesis, processing, fabrication, and process optimization, but also testing, performance evaluation and reliability. The book shall serve as a comprehensive and authoritative resource on sustainable manufacturing of ceramics, metals and their composites. It is designed to capture the diversity and unity of methods and approaches to materials processing, manufacturing, testing and evaluation across disciplines and length scales. Each chapter incorporates in-depth technical information without compromising the delicate link between factual data and fundamental concepts or between theory and practice. Green and sustainable materials processing and manufacturing is designed as a key enabler of sustainable development. A one-stop compendium of new research and technology of green manufacturing of metals, ceramics and their composites In-depth cutting-edge treatment of synthesis, processing, fabrication, process optimization, testing, performance evaluation and reliability which are of critical importance to green manufacturing Stimulates fresh thinking and exchange of ideas and information on approaches to green materials processing across disciplines