Download or read book Thin Film Materials Processes and Reliability written by G. S. Mathad and published by The Electrochemical Society. This book was released on 2008-09 with total page 69 pages. Available in PDF, EPUB and Kindle. Book excerpt: The symposium covered three topics: i) plasma processing for

Download or read book Thin Film Materials Processes and Reliability written by G. S. Mathad and published by The Electrochemical Society. This book was released on 2003 with total page 438 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Thin Film Materials Processes and Reliability written by Electrochemical Society. Meeting and published by The Electrochemical Society. This book was released on 2001 with total page 232 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Electronic Thin Film Reliability written by King-Ning Tu and published by Cambridge University Press. This book was released on 2010-11-25 with total page 413 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thin films are widely used in the electronic device industry. As the trend for miniaturization of electronic devices moves into the nanoscale domain, the reliability of thin films becomes an increasing concern. Building on the author's previous book, Electronic Thin Film Science by Tu, Mayer and Feldman, and based on a graduate course at UCLA given by the author, this new book focuses on reliability science and the processing of thin films. Early chapters address fundamental topics in thin film processes and reliability, including deposition, surface energy and atomic diffusion, before moving onto systematically explain irreversible processes in interconnect and packaging technologies. Describing electromigration, thermomigration and stress migration, with a closing chapter dedicated to failure analysis, the reader will come away with a complete theoretical and practical understanding of electronic thin film reliability. Kept mathematically simple, with real-world examples, this book is ideal for graduate students, researchers and practitioners.

Download or read book Proceedings of the International Symposium on Thin Film Materials Processes Reliability and Applications Thin Film Processes written by G. S. Mathad and published by The Electrochemical Society. This book was released on 1998 with total page 388 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book The Materials Science of Thin Films written by Milton Ohring and published by Academic Press. This book was released on 1992 with total page 744 pages. Available in PDF, EPUB and Kindle. Book excerpt: Prepared as a textbook complete with problems after each chapter, specifically intended for classroom use in universities.

Download or read book Low and High Dielectric Constant Materials written by Rajendra Singh and published by The Electrochemical Society. This book was released on 2000 with total page 242 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book The Mechanics and Reliability of Films Multilayers and Coatings written by Matthew R. Begley and published by Cambridge University Press. This book was released on 2017-03-24 with total page 289 pages. Available in PDF, EPUB and Kindle. Book excerpt: A wide variety of applications ranging from microelectronics to turbines for propulsion and power generation rely on films, coatings, and multilayers to improve performance. As such, the ability to predict coating failure - such as delamination (debonding), mud-cracking, blistering, crack kinking, and the like - is critical to component design and development. This work compiles and organizes decades of research that established the theoretical foundation for predicting such failure mechanisms, and clearly outlines the methodology needed to predict performance. Detailed coverage of cracking in multilayers is provided, with an emphasis on the role of differences in thermoelastic properties between the layers. The comprehensive theoretical foundation of the book is complemented by easy-to-use analysis codes designed to empower novices with the tools needed to simulate cracking; these codes enable not only precise quantitative reproduction of results presented graphically in the literature, but also the generation of new results for more complex multilayered systems.

Download or read book Electronic Thin Film Reliability written by King-Ning Tu and published by Cambridge University Press. This book was released on 2010-11-25 with total page 412 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thin films are widely used in the electronic device industry. As the trend for miniaturization of electronic devices moves into the nanoscale domain, the reliability of thin films becomes an increasing concern. Building on the author's previous book, Electronic Thin Film Science by Tu, Mayer and Feldman, and based on a graduate course at UCLA given by the author, this new book focuses on reliability science and the processing of thin films. Early chapters address fundamental topics in thin film processes and reliability, including deposition, surface energy and atomic diffusion, before moving onto systematically explain irreversible processes in interconnect and packaging technologies. Describing electromigration, thermomigration and stress migration, with a closing chapter dedicated to failure analysis, the reader will come away with a complete theoretical and practical understanding of electronic thin film reliability. Kept mathematically simple, with real-world examples, this book is ideal for graduate students, researchers and practitioners.

Download or read book Materials Science of Thin Films written by Milton Ohring and published by Academic Press. This book was released on 2002 with total page 817 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is the first book that can be considered a textbook on thin film science, complete with exercises at the end of each chapter. Ohring has contributed many highly regarded reference books to the AP list, including Reliability and Failure of Electronic Materials and the Engineering Science of Thin Films. The knowledge base is intended for science and engineering students in advanced undergraduate or first-year graduate level courses on thin films and scientists and engineers who are entering or require an overview of the field. Since 1992, when the book was first published, the field of thin films has expanded tremendously, especially with regard to technological applications. The second edition will bring the book up-to-date with regard to these advances. Most chapters have been greatly updated, and several new chapters have been added.

Download or read book Handbook of Thin Film Deposition written by Krishna Seshan and published by William Andrew. This book was released on 2018-02-23 with total page 470 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Thin Film Deposition, Fourth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, materials for memory applications and methods for thin film optical processes. The book is broken up into three sections: scaling, equipment and processing, and applications. In this newly revised edition, the handbook will also explore the limits of thin film applications, most notably as they relate to applications in manufacturing, materials, design and reliability. Offers a practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance, applications and the limitations faced by those processes Covers core processes and applications in the semiconductor industry and new developments within the photovoltaic and optical thin film industries Features a new chapter discussing Gates Dielectrics

Download or read book Micro and Opto Electronic Materials and Structures Physics Mechanics Design Reliability Packaging written by Ephraim Suhir and published by Springer Science & Business Media. This book was released on 2007-05-26 with total page 1471 pages. Available in PDF, EPUB and Kindle. Book excerpt: This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.

Download or read book NBS DOE Workshop Stability of Thin Film Solar Cells and Materials written by David E. Sawyer and published by . This book was released on 1979 with total page 188 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Reliability of MEMS written by Osamu Tabata and published by John Wiley & Sons. This book was released on 2008-02-04 with total page 328 pages. Available in PDF, EPUB and Kindle. Book excerpt: This first book to cover exclusively and in detail the principles, tools and methods for determining the reliability of microelectromechanical materials, components and devices covers both component materials as well as entire MEMS devices. Divided into two major parts, following a general introductory chapter to reliability issues, the first part looks at the mechanical properties of the materials used in MEMS, explaining in detail the necessary measuring technologies -- nanoindenters, bulge methods, bending tests, tensile tests, and others. Part Two treats the actual devices, organized by important device categories such as pressure sensors, inertial sensors, RF MEMS, and optical MEMS.

Download or read book Proceedings of the Symposium on Interconnect and Contact Metallization written by Harzara S. Rathore and published by The Electrochemical Society. This book was released on 1998 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Handbook of Thin film Deposition Processes and Techniques written by Krishna Seshan and published by . This book was released on 2002 with total page 629 pages. Available in PDF, EPUB and Kindle. Book excerpt: The 2nd edition contains new chapters on contamination and contamination control that describe the basics and the issues. Another new chapter on meteorology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together physical vapor deposition techniques. Two entirely new areas are focused on: chemical mechanical polishing, which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials.

Download or read book Low and High Dielectric Constant Materials written by Mark J. Lododa and published by The Electrochemical Society. This book was released on 2000 with total page 262 pages. Available in PDF, EPUB and Kindle. Book excerpt: Contains papers from a May 2000 symposium, representing the state of the art in areas of dielectric materials science and process integration. Papers are arranged in sections on low and high dielectric constant materials, covering topics such as ammonia plasma passivation effects on properties of post-CMP low-k HSQ, characterization of ashing effects on low-k dielectric films, and electron beam curing of thin film polymer dielectrics. Other subjects include characterization of high-k dielectrics using the non-contact surface charge profiler method, and processing effects and electrical evaluation of ZrO2 formed by RTP oxidation of Zr. Loboda is affiliated with Dow Corning Corporation. c. Book News Inc.