Download or read book THERMEC 2006 written by Tara Chandra and published by Trans Tech Publications Ltd. This book was released on 2007-03-15 with total page 5101 pages. Available in PDF, EPUB and Kindle. Book excerpt: THERMEC 2006, 5th International Conference on PROCESSING & MANUFACTURING OF ADVANCED MATERIALS, July 4-8, 2006, Vancouver, Canada

Download or read book Thermo mechanical Characterization of Evolving Packaging Materials and Structures written by Sheng Liu and published by . This book was released on 1998 with total page 156 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book TMS 2013 142nd Annual Meeting and Exhibition written by The Minerals, Metals & Materials Society (TMS) and published by John Wiley & Sons. This book was released on 2013-02-22 with total page 1238 pages. Available in PDF, EPUB and Kindle. Book excerpt: Presenting papers from the 2013 annual meeting of The Minerals, Metals & Materials Society (TMS), this volume covers developments in all aspects of high temperature electrochemistry, from the fundamental to the empirical and from the theoretical to the applied.

Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1995 with total page 704 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Lead free Solders written by K. Subramanian and published by John Wiley & Sons. This book was released on 2012-03-06 with total page 510 pages. Available in PDF, EPUB and Kindle. Book excerpt: Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. Lead-free Solders: Materials Reliability for Electronics chronicles the search for reliable drop-in lead-free alternatives and covers: Phase diagrams and alloy development Effect of minor alloying additions Composite approaches including nanoscale reinforcements Mechanical issues affecting reliability Reliability under impact loading Thermomechanical fatigue Chemical issues affecting reliability Whisker growth Electromigration Thermomigration Presenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met.

Download or read book Investigations on Microstructure and Mechanical Properties of the Cu Pb free Solder Joint Interfaces written by Qingke Zhang and published by Springer. This book was released on 2015-10-31 with total page 153 pages. Available in PDF, EPUB and Kindle. Book excerpt: This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are shown, the shear fracture strength of the Cu6Sn5 IMC is measured experimentally for the first time, and the dynamic damage process and microstructure evolution behavior of Pb-free solder joints are revealed intuitively. The thesis puts forward the argument that the local cumulative damage is the major cause of failure in solder joints. The research results provide the experimental and theoretical basis for improving the reliability of solder joints.

Download or read book Lead Free Solder Interconnect Reliability written by Dongkai Shangguan and published by ASM International. This book was released on 2005 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Modeling and Numerical Simulation of Materials Behavior and Evolution Volume 731 written by Antonios Zavaliangos and published by . This book was released on 2002-08-09 with total page 344 pages. Available in PDF, EPUB and Kindle. Book excerpt: In recent years, numerical simulation and modeling of materials coupling multiple-length scales has received much attention. While challenges remain, significant advances have been made. An equally important area of materials modeling, one that has received much less attention, is the integration of multiple physical phenomena for simulation of complex materials behavior. This volume offers a review of current capabilities in materials modeling and simulation that (1) bridge length scales and time scales and (2) couple a variety of physical phenomena to either provide insight into fundamental aspects of materials structure or predict materials behavior. By bringing together the materials modeling community from around the world, the volume provides a current snapshot of the field. Topics include: multiscale modeling; mechanical properties; transport phenomena; phase transformations; microstructure and its evolution; atomistic modeling; and materials structure and properties.

Download or read book Mechanics of Solder Alloy Interconnects written by Darrel R. Frear and published by Springer Science & Business Media. This book was released on 1994-01-31 with total page 434 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.

Download or read book Non Equilibrium Thermodynamics written by S. R. De Groot and published by Courier Corporation. This book was released on 2013-01-23 with total page 532 pages. Available in PDF, EPUB and Kindle. Book excerpt: Classic monograph treats irreversible processes and phenomena of thermodynamics: non-equilibrium thermodynamics. Covers statistical foundations and applications with chapters on fluctuation theory, theory of stochastic processes, kinetic theory of gases, more.

Download or read book Solder Materials written by Kwang-lung Lin and published by World Scientific. This book was released on 2018-07-13 with total page 388 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a comprehensive overview of important aspects of solder materials including solderability and soldering reaction, physical metallurgy, mechanical properties, electromigration, and reliability of solder joint. The scope of this book covers mainly, but not limited to, the important research achievements of all the subjects having been disclosed and discussed in the literatures. It is a very informative book for those who are interested in learning the material properties of solders, carrying out fundamental research, and in carrying out practical applications. This book is an important resource for the various important subjects relating to solder materials.

Download or read book Constrained Deformation of Materials written by Y.-L. Shen and published by Springer Science & Business Media. This book was released on 2010-08-09 with total page 290 pages. Available in PDF, EPUB and Kindle. Book excerpt: "Constrained Deformation of Materials: Devices, Heterogeneous Structures and Thermo-Mechanical Modeling" is an in-depth look at the mechanical analyses and modeling of advanced small-scale structures and heterogeneous material systems. Mechanical deformations in thin films and miniaturized materials, commonly found in microelectronic devices and packages, MEMS, nanostructures and composite and multi-phase materials, are heavily influenced by the external or internal physical confinement. A continuum mechanics-based approach is used, together with discussions on micro-mechanisms, to treat the subject in a systematic manner under the unified theme. Readers will find valuable information on the proper application of thermo-mechanics in numerical modeling as well as in the interpretation and prediction of physical material behavior, along with many case studies. Additionally, particular attention is paid to practical engineering relevance. Thus real-life reliability issues are discussed in detail to serve the needs of researchers and engineers alike.

Download or read book The ELFNET Book on Failure Mechanisms Testing Methods and Quality Issues of Lead Free Solder Interconnects written by Günter Grossmann and published by Springer Science & Business Media. This book was released on 2011-05-12 with total page 313 pages. Available in PDF, EPUB and Kindle. Book excerpt: The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is the work of the European network ELFNET which was founded by the European Commission in the 6th Framework Programme. It brings together contributions from the leading European experts in lead-free soldering. The limited validity of testing methods originating from tin-lead solder was a major point of concern in ELFNET members' discussions. As a result, the network's reliability group decided to bring together the material properties of lead-free solders, as well as the basics of material science, and to discuss their influence on the procedures for accelerated testing. This has led to a matrix of failure mechanisms and their activation and, as a result, to a comprehensive coverage of the scientific background and its applications in reliability testing of lead-free solder joints. The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is written for scientists, engineers and researchers involved with lead-free electronics.

Download or read book Thermo mechanical Fatigue Behavior of Materials written by Huseyin Sehitoglu and published by ASTM International. This book was released on 2000 with total page 339 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Solder Joint Reliability Assessment written by Mohd N. Tamin and published by Springer Science & Business. This book was released on 2014-04-26 with total page 179 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover assumptions considered for a simplified physical model, FE model geometry development, constitutive models for solder joints and aspects of FE model validation. Fundamentals of the mechanics of solder material are adequately reviewed in relation to FE formulations. Concept of damage is introduced along with deliberation of cohesive zone model and continuum damage model for simulation of solder/IMC interface and bulk solder joint failure, respectively. Applications of the deliberated methodology to selected problems in assessing reliability of solder joints are demonstrated. These industry-defined research-based problems include solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, JEDEC board-level drop test and mechanisms of solder joint fatigue. Emphasis is placed on accurate quantitative assessment of solder joint reliability through basic understanding of the mechanics of materials as interpreted from results of FE simulations. The FE simulation methodology is readily applicable to numerous other problems in mechanics of materials and structures.

Download or read book Winter Annual Meeting written by American Society of Mechanical Engineers and published by . This book was released on 1998 with total page 442 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Interfacial Compatibility in Microelectronics written by Tomi Laurila and published by Springer Science & Business Media. This book was released on 2012-01-13 with total page 221 pages. Available in PDF, EPUB and Kindle. Book excerpt: Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the “traditional” method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced. In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes: solutions to several common reliability issues in microsystem technology, methods to understand and predict failure mechanisms at interfaces between dissimilar materials and an approach to DFR based on deep understanding in materials science, rather than on the use of mechanistic tools, such as FMEA. Interfacial Compatibility in Microelectronics provides a clear and methodical resource for graduates and postgraduates alike.