Download or read book Thermal Spreading and Contact Resistance written by Yuri S. Muzychka and published by John Wiley & Sons. This book was released on 2023-08-09 with total page 469 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thermal Spreading and Contact Resistance: Fundamentals and Applications Single source reference on how applying thermal spreading and contact resistance can solve problems across a variety of engineering fields Thermal Spreading and Contact Resistance: Fundamentals and Applications offers comprehensive coverage of the key information that engineers need to know to understand thermal spreading and contact resistance, including numerous predictive models for determining thermal spreading resistance and contact conductance of mechanical joints and interfaces, plus detailed examples throughout the book. Written by two of the leading experts in the field, Thermal Spreading and Contact Resistance: Fundamentals and Applications includes information on: Contact conductance, mass transfer, transport from super-hydrophobic surfaces, droplet/surface phase change problems, and tribology applications such as sliding surfaces and roller bearings Heat transfer in micro-devices and thermal spreaders, orthotropic systems, and multi-source applications for electronics thermal management applications Fundamental principles, thermal spreading in isotropic half-space regions, circular flux tubes and disc spreaders, and rectangular flux channels and compound spreaders Systems with non-uniform sink plane conductance, transient spreading resistance, and contact resistance between both non-conforming and conforming rough surfaces Providing comprehensive coverage of the subject, Thermal Spreading and Contact Resistance: Fundamentals and Applications is an essential resource for mechanical, aerospace, and chemical engineers working on research in the fields of heat transfer, thermal management of electronics, and tribology, as well as thermal engineers and researchers in the field of thermal physics.
Download or read book Cooling of Electronic Systems written by Sadik Kakaç and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 953 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.
Download or read book Heat Transfer written by Adrian Bejan and published by John Wiley & Sons. This book was released on 2022-04-05 with total page 612 pages. Available in PDF, EPUB and Kindle. Book excerpt: HEAT TRANSFER Provides authoritative coverage of the fundamentals of heat transfer, written by one of the most cited authors in all of Engineering Heat Transfer presents the fundamentals of the generation, use, conversion, and exchange of heat between physical systems. A pioneer in establishing heat transfer as a pillar of the modern thermal sciences, Professor Adrian Bejan presents the fundamental concepts and problem-solving methods of the discipline, predicts the evolution of heat transfer configurations, the principles of thermodynamics, and more. Building upon his classic 1993 book Heat Transfer, the author maintains his straightforward scientific approach to teaching essential developments such as Fourier conduction, fins, boundary layer theory, duct flow, scale analysis, and the structure of turbulence. In this new volume, Bejan explores topics and research developments that have emerged during the past decade, including the designing of convective flow and heat and mass transfer, the crucial relationship between configuration and performance, and new populations of configurations such as tapered ducts, plates with multi-scale features, and dendritic fins. Heat Transfer: Evolution, Design and Performance: Covers thermodynamics principles and establishes performance and evolution as fundamental concepts in thermal sciences Demonstrates how principles of physics predict a future with economies of scale, multi-scale design, vascularization, and hierarchical distribution of many small features Explores new work on conduction architecture, convection with nanofluids, boiling and condensation on designed surfaces, and resonance of natural circulation in enclosures Includes numerous examples, problems with solutions, and access to a companion website Heat Transfer: Evolution, Design and Performance is essential reading for undergraduate and graduate students in mechanical and chemical engineering, and for all engineers, physicists, biologists, and earth scientists.
Download or read book Qpedia Thermal Management Electronics Cooling Book Volume 1 written by and published by Advanced Thermal Solutions. This book was released on with total page 186 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Heat Transfer Handbook written by Adrian Bejan and published by John Wiley & Sons. This book was released on 2003-06-30 with total page 1496 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chapters contributed by thirty world-renown experts. * Covers all aspects of heat transfer, including micro-scale and heat transfer in electronic equipment. * An associated Web site offers computer formulations on thermophysical properties that provide the most up-to-date values.
Download or read book Electronics Cooling written by S. M. Sohel Murshed and published by BoD – Books on Demand. This book was released on 2016-06-15 with total page 184 pages. Available in PDF, EPUB and Kindle. Book excerpt: Featuring contributions from the renowned researchers and academicians in the field, this book covers key conventional and emerging cooling techniques and coolants for electronics cooling. It includes following thematic topics: - Cooling approaches and coolants - Boiling and phase change-based technologies - Heat pipes-based cooling - Microchannels cooling systems - Heat loop cooling technology - Nanofluids as coolants - Theoretical development for the junction temperature of package chips. This book is intended to be a reference source and guide to researchers, engineers, postgraduate students, and academicians in the fields of thermal management and cooling technologies as well as for people in the electronics and semiconductors industries.
Download or read book Advances in Heat Transfer and Thermal Engineering written by Chuang Wen and published by Springer Nature. This book was released on 2021-06-01 with total page 914 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book gathers selected papers from the 16th UK Heat Transfer Conference (UKHTC2019), which is organised every two years under the aegis of the UK National Heat Transfer Committee. It is the premier forum in the UK for the local and international heat transfer community to meet, disseminate ongoing work, and discuss the latest advances in the heat transfer field. Given the range of topics discussed, these proceedings offer a valuable asset for engineering researchers and postgraduate students alike.
Download or read book Thermal Contact Conductance written by Chakravarti V. Madhusudana and published by Springer Science & Business Media. This book was released on 2013-09-24 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt: The work covers both theoretical and practical aspects of thermal contact conductance. The theoretical discussion focuses on heat transfer through spots, joints, and surfaces, as well as the role of interstitial materials (both planned and inadvertent). The practical discussion includes formulae and data that can be used in designing heat-transfer equipment for a variety of joints, including special geometries and configurations. All of the material has been updated to reflect the latest advances in the field.
Download or read book Thermoelectrics written by HoSung Lee and published by John Wiley & Sons. This book was released on 2016-09-07 with total page 440 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thermoelectrics: Design and Materials HoSung Lee, Western Michigan University, USA A comprehensive guide to the basic principles of thermoelectrics Thermoelectrics plays an important role in energy conversion and electronic temperature control. The book comprehensively covers the basic physical principles of thermoelectrics as well as recent developments and design strategies of materials and devices. The book is divided into two sections: the first section is concerned with design and begins with an introduction to the fast developing and multidisciplinary field of thermoelectrics. This section also covers thermoelectric generators and coolers (refrigerators) before examining optimal design with dimensional analysis. A number of applications are considered, including solar thermoelectric generators, thermoelectric air conditioners and refrigerators, thermoelectric coolers for electronic devices, thermoelectric compact heat exchangers, and biomedical thermoelectric energy harvesting systems. The second section focuses on materials, and covers the physics of electrons and phonons, theoretical modeling of thermoelectric transport properties, thermoelectric materials, and nanostructures. Key features: Provides an introduction to a fast developing and interdisciplinary field. Includes detailed, fundamental theories. Offers a platform for advanced study. Thermoelectrics: Design and Materials is a comprehensive reference ideal for engineering students, as well as researchers and practitioners working in thermodynamics. Cover designed by Yujin Lee
Download or read book Thermal Management for Opto electronics Packaging and Applications written by Xiaobing Luo and published by John Wiley & Sons. This book was released on 2024-05-29 with total page 373 pages. Available in PDF, EPUB and Kindle. Book excerpt: A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling Practical discussions of thermally enhanced thermal interfacial materials (TIMs) Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.
Download or read book Advanced Thermal Design of Electronic Equipment written by Ralph Remsburg and published by Springer Science & Business Media. This book was released on 2011-06-27 with total page 618 pages. Available in PDF, EPUB and Kindle. Book excerpt: The field of electronic packaging continues to grow at an amazing rate. To be successful in this field requires analytical skills, a foundation in mechanical engineering, and access to the latest developments in the electronics field. The emphasis for each project that the electronic packaging engineer faces changes from project to project, and from company to company, yet some constants should continue into the foreseeable future. One of these is the emphasis on ther mal design. Although just a few years ago thermal analysis of electronic equipment was an afterthought, it is becoming one of the primary aspects of many packaging jobs. It seems that the days of just adding a bigger fan to reduce the overheat ing problem are almost over. Replacing that thought is the up-front commitment to CFD (Computational Fluid Dynamics) software code, FEA (Finite Element Analysis) software, and the realization that the problem will only get worse. As the electronic circuit size is reduced, speed is increased. As the power of these systems increases and the volume allowed diminishes, heat flux or density (heat per unit area, W/m 2 or Btulh ft2) has spiraled. Much of the improvement in the reliability and packaging density of electronic circuits can be traced to advances in thermal design. While air cooling is still used extensively, advanced heat transfer techniques using exotic synthetic liquids are becoming more prominent, allowing still smaller systems to be manufactured. The appli cation of advanced thermal management techniques requires a background in fluid dynamics.
Download or read book Thermal Management of Electronic Systems II written by E. Beyne and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 358 pages. Available in PDF, EPUB and Kindle. Book excerpt: For the second time, the Eurotherm Committee has chosen Thermal Managment of Electronic Systems as the subject for its 45th Seminar, held at IMEC in Leuven, Belgium, from 20 to 22 September 1995. After the successfui first edition of this seminar in Delft, June 14-16, 1993, it was decided to repeat this event on a two year basis. This volume constitutes the edited proceedings of the Seminar. Thermal management of electronic systems is gaining importance. Whereas a few years ago papers on this subject where mainly devoted to applications in high end markets, such as mainframes and telecommunication switching equipment, we see a growing importance in the "lower" end applications. This may be understood from the growing impact of electronics on every day life, from car electronics, GSM phones, personal computers to electronic games. These applications add new requirements to the thermal design. The thermal problem and the applicable cooling strategies are quite different from those in high end products. In this seminar the latest developments in many of the different aspects of the thermal design of electronic systems were discussed. Particular attention was given to thermal modelling, experimental characterisation and the impact of thermal design on the reliability of electronic systems.
Download or read book Proceedings of the 11th International Symposium on Heating Ventilation and Air Conditioning ISHVAC 2019 written by Zhaojun Wang and published by Springer Nature. This book was released on 2020-03-19 with total page 1492 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents selected papers from the 11th International Symposium on Heating, Ventilation and Air Conditioning (ISHVAC 2019), with a focus on HVAC techniques for improving indoor environment quality and the energy efficiency of heating and cooling systems. Presenting inspiration for implementing more efficient and safer HVAC systems, the book is a valuable resource for academic researchers, engineers in industry, and government regulators.
Download or read book Thermal Design of Electronic Equipment written by Ralph Remsburg and published by CRC Press. This book was released on 2017-12-19 with total page 395 pages. Available in PDF, EPUB and Kindle. Book excerpt: In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.
Download or read book The Electronics Handbook written by Jerry C. Whitaker and published by CRC Press. This book was released on 2018-10-03 with total page 2636 pages. Available in PDF, EPUB and Kindle. Book excerpt: During the ten years since the appearance of the groundbreaking, bestselling first edition of The Electronics Handbook, the field has grown and changed tremendously. With a focus on fundamental theory and practical applications, the first edition guided novice and veteran engineers along the cutting edge in the design, production, installation, operation, and maintenance of electronic devices and systems. Completely updated and expanded to reflect recent advances, this second edition continues the tradition. The Electronics Handbook, Second Edition provides a comprehensive reference to the key concepts, models, and equations necessary to analyze, design, and predict the behavior of complex electrical devices, circuits, instruments, and systems. With 23 sections that encompass the entire electronics field, from classical devices and circuits to emerging technologies and applications, The Electronics Handbook, Second Edition not only covers the engineering aspects, but also includes sections on reliability, safety, and engineering management. The book features an individual table of contents at the beginning of each chapter, which enables engineers from industry, government, and academia to navigate easily to the vital information they need. This is truly the most comprehensive, easy-to-use reference on electronics available.
Download or read book Electronic Systems Maintenance Handbook written by Jerry C. Whitaker and published by CRC Press. This book was released on 2017-12-19 with total page 624 pages. Available in PDF, EPUB and Kindle. Book excerpt: The days of troubleshooting a piece of gear armed only with a scope, voltmeter, and a general idea of how the hardware works are gone forever. As technology continues to drive equipment design forward, maintenance difficulties will continue to increase, and those responsible for maintaining this equipment will continue to struggle to keep up. The Electronic Systems Maintenance Handbook, Second Edition establishes a foundation for servicing, operating, and optimizing audio, video, computer, and RF systems. Beginning with an overview of reliability principles and properties, a team of top experts describes the steps essential to ensuring high reliability and minimum downtime. They examine heat management issues, grounding systems, and all aspects of system test and measurement. They even explore disaster planning and provide guidelines for keeping a facility running under extreme circumstances. Today more than ever, the reliability of a system can have a direct and immediate impact on the profitability of an operation. Advocating a carefully planned, systematic maintenance program, the richly illustrated Electronic Systems Maintenance Handbook helps engineers and technicians meet the challenges inherent in modern electronic equipment and ensure top quality performance from each piece of hardware.
Download or read book Heat Transfer written by Younes Shabany and published by CRC Press. This book was released on 2009-12-17 with total page 526 pages. Available in PDF, EPUB and Kindle. Book excerpt: The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In particular, thermal management has become essential to the design and manufacturing of most electronic systems.Heat Transfer: Thermal Management of Electronics details how engineers can use
