Download or read book Thermal Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2011 12th International Conference on written by and published by . This book was released on 2011 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Thermal Mechanical and Multi physics Simulation and Experiments in Micro electronics and Micro systems EuroSimE 2011 12th International Conference on Thermal Mechanical and Multi Physics Simulation and Experiments in Micro Electronics and Micro Systems EuroSimE was Held in Linz Austria on 18 20th of April 2011 7 Papers written by and published by . This book was released on 2012 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Molecular Modeling and Multiscaling Issues for Electronic Material Applications written by Artur Wymyslowski and published by Springer. This book was released on 2014-11-20 with total page 203 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book offers readers a snapshot of the progression of molecular modeling in the electronics industry and how molecular modeling is currently being used to understand materials to solve relevant issues in this field. The reader is introduced to the evolving role of molecular modeling, especially seen from the perspective of the IEEE community and modeling in electronics. This book also covers the aspects of molecular modeling needed to understand the relationship between structures and mechanical performance of materials. The authors also discuss the transitional topic of multiscale modeling and recent developments on the atomistic scale and current attempts to reach the submicron scale, as well as the role that quantum mechanics can play in performance prediction.
Download or read book Mechanics of Microsystems written by Alberto Corigliano and published by John Wiley & Sons. This book was released on 2018-04-02 with total page 332 pages. Available in PDF, EPUB and Kindle. Book excerpt: Mechanics of Microsystems Alberto Corigliano, Raffaele Ardito, Claudia Comi, Attilio Frangi, Aldo Ghisi and Stefano Mariani, Politecnico di Milano, Italy A mechanical approach to microsystems, covering fundamental concepts including MEMS design, modelling and reliability Mechanics of Microsystems takes a mechanical approach to microsystems and covers fundamental concepts including MEMS design, modelling and reliability. The book examines the mechanical behaviour of microsystems from a ‘design for reliability’ point of view and includes examples of applications in industry. Mechanics of Microsystems is divided into two main parts. The first part recalls basic knowledge related to the microsystems behaviour and offers an overview on microsystems and fundamental design and modelling tools from a mechanical point of view, together with many practical examples of real microsystems. The second part covers the mechanical characterization of materials at the micro-scale and considers the most important reliability issues (fracture, fatigue, stiction, damping phenomena, etc) which are fundamental to fabricate a real working device. Key features: Provides an overview of MEMS, with special focus on mechanical-based Microsystems and reliability issues. Includes examples of applications in industry. Accompanied by a website hosting supplementary material. The book provides essential reading for researchers and practitioners working with MEMS, as well as graduate students in mechanical, materials and electrical engineering.
Download or read book Reliability of Organic Compounds in Microelectronics and Optoelectronics written by Willem Dirk van Driel and published by Springer Nature. This book was released on 2022-01-31 with total page 552 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book aims to provide a comprehensive reference into the critical subject of failure and degradation in organic materials, used in optoelectronics and microelectronics systems and devices. Readers in different industrial sectors, including microelectronics, automotive, lighting, oil/gas, and petrochemical will benefit from this book. Several case studies and examples are discussed, which readers will find useful to assess and mitigate similar failure cases. More importantly, this book presents methodologies and useful approaches in analyzing a failure and in relating a failure to the reliability of materials and systems.
Download or read book 2014 15th International Conference on Thermal Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014 written by and published by . This book was released on 2014 with total page 720 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book MEMS and Nanotechnology Volume 6 written by Gordon A. Shaw and published by Springer Science & Business Media. This book was released on 2012-09-06 with total page 156 pages. Available in PDF, EPUB and Kindle. Book excerpt: MEMS and Nanotechnology, Volume 6: Proceedings of the 2012 Annual Conference on Experimental and Applied Mechanics represents one of seven volumes of technical papers presented at the Society for Experimental Mechanics SEM 12th International Congress & Exposition on Experimental and Applied Mechanics, held at Costa Mesa, California, June 11-14, 2012. The full set of proceedings also includes volumes on Dynamic Behavior of Materials, Challenges in Mechanics of Time-Dependent Materials and Processes in Conventional and Multifunctional Materials, Imaging Methods for Novel Materials and Challenging Applications, Experimental and Applied Mechanics, Mechanics of Biological Systems and Materials and, Composite Materials and Joining Technologies for Composites.
Download or read book Thermal Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2012 13th International Conference on written by and published by . This book was released on 2012 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Thermal Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2013 14th International Conference on written by and published by . This book was released on 2013 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Solid State Lighting Reliability Part 2 written by Willem Dirk van Driel and published by Springer. This book was released on 2017-07-11 with total page 603 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the past four years we have witnessed rapid development in technology and significant market penetration in many applications for LED systems. New processes and new materials have been introduced; new standards and new testing methods have been developed; new driver, control and sensing technologies have been integrated; and new and unknown failure modes have also been presented. In this book, Solid State Lighting Reliability Part 2, we invited the experts from industry and academia to present the latest developments and findings in the LED system reliability arena. Topics in this book cover the early failures and critical steps in LED manufacturing; advances in reliability testing and standards; quality of colour and colour stability; degradation of optical materials and the associated chromaticity maintenance; characterization of thermal interfaces; LED solder joint testing and prediction; common failure modes in LED drivers; root causes for lumen depreciation; corrosion sensitivity of LED packages; reliability management for automotive LEDs, and lightning effects on LEDs. This book is a continuation of Solid State Lighting Reliability: Components to Systems (published in 2013), which covers reliability aspects ranging from the LED to the total luminaire or system of luminaires. Together, these two books are a full set of reference books for Solid State Lighting reliability from the performance of the (sub-) components to the total system, regardless its complexity.
Download or read book Thermal Management for LED Applications written by Clemens J.M. Lasance and published by Springer Science & Business Media. This book was released on 2013-09-17 with total page 550 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thermal Management for LED Applications provides state-of-the-art information on recent developments in thermal management as it relates to LEDs and LED-based systems and their applications. Coverage begins with an overview of the basics of thermal management including thermal design for LEDs, thermal characterization and testing of LEDs, and issues related to failure mechanisms and reliability and performance in harsh environments. Advances and recent developments in thermal management round out the book with discussions on advances in TIMs (thermal interface materials) for LED applications, advances in forced convection cooling of LEDs, and advances in heat sinks for LED assemblies.
Download or read book Thermal Mechanical and Multi physics Simulation and Experiments in Micro electronics and Micro systems written by Artur Wymysłowski and published by . This book was released on 2012 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Residual Stresses in Composite Materials written by Mahmood M. Shokrieh and published by Woodhead Publishing. This book was released on 2021-06-22 with total page 504 pages. Available in PDF, EPUB and Kindle. Book excerpt: The residual stress is a common phenomenon in composite materials. They can either add to or significantly reduce material strength. Because of the increasing demand for high-strength, lightweight materials such as composites and their wide range of applications; it is critical that the residual stresses of composite materials are understood and measured correctly. The first edition of this book consists of thirteen chapters divided into two parts. The first part reviews destructive and non-destructive testing (NDT) techniques for measuring residual stresses. There are also additional chapters on using mathematical (analytical and numerical) methods for the calculation of residual stresses in composite materials. These include the simulated hole drilling method, the slitting/crack compliance method, measuring residual stresses in homogeneous and composite glass materials using photoelastic techniques, and modeling residual stresses in composite materials. The second part of the book discusses measuring residual stresses in different types of composites including polymer and metal matrix composites. The addition of nanoparticles to the matrix of polymeric composites as a new technique for the reduction of residual stresses is also discussed. In the Second Edition of this book, each of the original chapters of the first edition has been fully updated, taking into account the latest research and new developments. There are also five new chapters on the theoretical and experimental studies of residual stresses in the composite integrated circuits; residual stresses in additive manufacturing of polymers and polymer matrix composites; residual stresses in metal matrix composites fabricated by additive manufacturing; the eigenstrain based method for the incremental hole-drilling technique; and the estimation of residual stresses in polymer matrix composites using the digital image correlation technique. Residual Stresses in Composite Materials, Second Edition, provides a unique and comprehensive overview of this important topic and is an invaluable reference text for both academics and professionals working in the mechanical engineering, civil engineering, aerospace, automotive, marine, and sporting industries. Presents the latest developments on theoretical and experimental studies of residual stresses in composites Reviews destructive and non-destructive testing (NDT) techniques for measuring residual stresses Discusses residual stresses in the polymer matrix, metal matrix, and ceramic matrix composites Considers the addition of nanoparticles to the matrix as a new technique for reduction of residual stresses in polymeric composites Introduces the latest advancements of research on the residual stresses in additive-manufactured polymer and metal matrix composites
Download or read book Thermal Mechanical and Multi physics Simulation and Experiments in Micro electronics and Micro systems written by L. J. Ernst and published by . This book was released on 2008 with total page 360 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 3D Microelectronic Packaging written by Yan Li and published by Springer. This book was released on 2017-01-20 with total page 465 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.
Download or read book Prognostics and Health Management of Electronics written by Michael G. Pecht and published by John Wiley & Sons. This book was released on 2018-08-15 with total page 800 pages. Available in PDF, EPUB and Kindle. Book excerpt: An indispensable guide for engineers and data scientists in design, testing, operation, manufacturing, and maintenance A road map to the current challenges and available opportunities for the research and development of Prognostics and Health Management (PHM), this important work covers all areas of electronics and explains how to: assess methods for damage estimation of components and systems due to field loading conditions assess the cost and benefits of prognostic implementations develop novel methods for in situ monitoring of products and systems in actual life-cycle conditions enable condition-based (predictive) maintenance increase system availability through an extension of maintenance cycles and/or timely repair actions; obtain knowledge of load history for future design, qualification, and root cause analysis reduce the occurrence of no fault found (NFF) subtract life-cycle costs of equipment from reduction in inspection costs, downtime, and inventory Prognostics and Health Management of Electronics also explains how to understand statistical techniques and machine learning methods used for diagnostics and prognostics. Using this valuable resource, electrical engineers, data scientists, and design engineers will be able to fully grasp the synergy between IoT, machine learning, and risk assessment.
Download or read book Thermal Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2015 16th International Conference on written by and published by . This book was released on 2015 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
