Download or read book Proceedings of the Third International Symposium on Microstructures and Microfabricated Systems written by Peter J. Hesketh and published by The Electrochemical Society. This book was released on 1997 with total page 234 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book SiC Materials and Devices written by and published by Academic Press. This book was released on 1998-07-02 with total page 435 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume addresses the subject of materials science, specifically the materials aspects, device applications, and fabricating technology of SiC.

Download or read book Proceedings of Eighth International Congress on Information and Communication Technology written by Xin-She Yang and published by Springer Nature. This book was released on 2023-09-14 with total page 1119 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book gathers selected high-quality research papers presented at the Eighth International Congress on Information and Communication Technology, held at Brunel University, London, on 20–23 February 2023. It discusses emerging topics pertaining to information and communication technology (ICT) for managerial applications, e-governance, e-agriculture, e-education and computing technologies, the Internet of Things (IoT) and e-mining. Written by respected experts and researchers working on ICT, the book offers a valuable asset for young researchers involved in advanced studies. The work is presented in four volumes.

Download or read book The Arts of VLSI Opamp Circuit Design A Structural Approach Based on Symmetry written by Hongjiang Song and published by Lulu.com. This book was released on 2014-03-21 with total page 316 pages. Available in PDF, EPUB and Kindle. Book excerpt: This text is developed from the notes of a VLSI circuit design class (EEE598) the author offered in Engineering School at Arizona State University. The materials cover the structural design approaches of VLSI operational amplifier circuits based on the symmetry principle, symmetry circuit structures, prototype circuits, and symmetry scaling/transformation techniques.

Download or read book Design of 3D Integrated Circuits and Systems written by Rohit Sharma and published by CRC Press. This book was released on 2018-09-03 with total page 328 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.

Download or read book Wafer Level 3 D ICs Process Technology written by Chuan Seng Tan and published by Springer Science & Business Media. This book was released on 2009-06-29 with total page 365 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.

Download or read book Towards a Modeling Synthesis of Two or Three Dimensional Circuits Through Substrate Coupling and Interconnections Noises and Parasites written by Christian Gontrand and published by Bentham Science Publishers. This book was released on 2014-04-21 with total page 225 pages. Available in PDF, EPUB and Kindle. Book excerpt: The number of transistors in integrated circuits doubles every two years, as stipulated by Moore’s law, and this has been the driving force for the huge development of the microelectronics industry in the past 50 years – currently advanced to the nanometric scale. This e-book is dedicated to electronic noises and parasites, accounting for issues involving substrate coupling and interconnections, in the perspective of the 3D integration: a second track for enhancing integration, also compatible with Moore’s law. This reference explains the modeling of 3D circuits without delving into the latest advances, but highlights crucial problems, for instance electro-thermo-mechanical problems, which could be addressed through 3D modeling. The book also explains electromagnetic interferences , at different modeling levels (device and circuit) oriented towards 3D integration technologies. It also covers substrate noise, such as disturbances of digital blocks, power bounces, phase noise in oscillators, both at the device level, such as carriers or field fluctuations, and circuit levels. The entanglement between interconnect and substrate is also discussed. This e-book serves as a reference for advanced graduates or researchers in the field of micro and nano electronics interested in topics relevant to electromagnetic interference or the ‘noise’ domain, at device or circuit and system levels

Download or read book Compact Models for Integrated Circuit Design written by Samar K. Saha and published by CRC Press. This book was released on 2018-09-03 with total page 548 pages. Available in PDF, EPUB and Kindle. Book excerpt: Compact Models for Integrated Circuit Design: Conventional Transistors and Beyond provides a modern treatise on compact models for circuit computer-aided design (CAD). Written by an author with more than 25 years of industry experience in semiconductor processes, devices, and circuit CAD, and more than 10 years of academic experience in teaching compact modeling courses, this first-of-its-kind book on compact SPICE models for very-large-scale-integrated (VLSI) chip design offers a balanced presentation of compact modeling crucial for addressing current modeling challenges and understanding new models for emerging devices. Starting from basic semiconductor physics and covering state-of-the-art device regimes from conventional micron to nanometer, this text: Presents industry standard models for bipolar-junction transistors (BJTs), metal-oxide-semiconductor (MOS) field-effect-transistors (FETs), FinFETs, and tunnel field-effect transistors (TFETs), along with statistical MOS models Discusses the major issue of process variability, which severely impacts device and circuit performance in advanced technologies and requires statistical compact models Promotes further research of the evolution and development of compact models for VLSI circuit design and analysis Supplies fundamental and practical knowledge necessary for efficient integrated circuit (IC) design using nanoscale devices Includes exercise problems at the end of each chapter and extensive references at the end of the book Compact Models for Integrated Circuit Design: Conventional Transistors and Beyond is intended for senior undergraduate and graduate courses in electrical and electronics engineering as well as for researchers and practitioners working in the area of electron devices. However, even those unfamiliar with semiconductor physics gain a solid grasp of compact modeling concepts from this book.

Download or read book Handbook on Securing Cyber Physical Critical Infrastructure written by Sajal K Das and published by Elsevier. This book was released on 2012-01-31 with total page 849 pages. Available in PDF, EPUB and Kindle. Book excerpt: Introduction: Securing Cyber-Physical Infrastructures--An Overview Part 1: Theoretical Foundations of Security Chapter 1: Security and Vulnerability of Cyber-Physical Infrastructure Networks: A Control-Theoretic Approach Chapter 2: Game Theory for Infrastructure Security -- The Power of Intent-Based Adversary Models Chapter 3: An Analytical Framework for Cyber-Physical Networks Chapter 4: Evolution of Widely Spreading Worms and Countermeasures : Epidemic Theory and Application Part 2: Security for Wireless Mobile Networks Chapter 5: Mobile Wireless Network Security Chapter 6: Robust Wireless Infrastructure against Jamming Attacks Chapter 7: Security for Mobile Ad Hoc Networks Chapter 8: Defending against Identity-Based Attacks in Wireless Networks Part 3: Security for Sensor Networks Chapter 9: Efficient and Distributed Access Control for Sensor Networks Chapter 10: Defending against Physical Attacks in Wireless Sensor Networks Chapter 11: Node Compromise Detection in Wireless Sensor N ...

Download or read book Applied Cryptography for Cyber Security and Defense Information Encryption and Cyphering written by Nemati, Hamid R. and published by IGI Global. This book was released on 2010-08-31 with total page 408 pages. Available in PDF, EPUB and Kindle. Book excerpt: Applied Cryptography for Cyber Security and Defense: Information Encryption and Cyphering applies the principles of cryptographic systems to real-world scenarios, explaining how cryptography can protect businesses' information and ensure privacy for their networks and databases. It delves into the specific security requirements within various emerging application areas and discusses procedures for engineering cryptography into system design and implementation.

Download or read book Three Dimensional Integrated Circuit Design written by Yuan Xie and published by Springer Science & Business Media. This book was released on 2009-12-02 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt: We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore’s law. The trouble began a number of years ago when CMOS devices were no longer able to proceed along the classical scaling trends. Key device parameters such as gate oxide thickness were simply no longer able to scale. As a result, device o- state currents began to creep up at an alarming rate. These continuing problems with classical scaling have led to a leveling off of IC clock speeds to the range of several GHz. Of course, chips can be clocked higher but the thermal issues become unmanageable. This has led to the recent trend toward microprocessors with mul- ple cores, each running at a few GHz at the most. The goal is to continue improving performance via parallelism by adding more and more cores instead of increasing speed. The challenge here is to ensure that general purpose codes can be ef?ciently parallelized. There is another potential solution to the problem of how to improve CMOS technology performance: three-dimensional integrated circuits (3D ICs).

Download or read book Wireless Technologies Concepts Methodologies Tools and Applications written by Management Association, Information Resources and published by IGI Global. This book was released on 2011-08-31 with total page 2875 pages. Available in PDF, EPUB and Kindle. Book excerpt: Contains the latest research, case studies, theories, and methodologies within the field of wireless technologies.

Download or read book Signal Processing and Analysis of Electrical Circuit written by Adam Glowacz and published by MDPI. This book was released on 2020-03-13 with total page 604 pages. Available in PDF, EPUB and Kindle. Book excerpt: This Special Issue with 35 published articles shows the significance of the topic “Signal Processing and Analysis of Electrical Circuit”. This topic has been gaining increasing attention in recent times. The presented articles can be categorized into four different areas: signal processing and analysis methods of electrical circuits; electrical measurement technology; applications of signal processing of electrical equipment; fault diagnosis of electrical circuits. It is a fact that the development of electrical systems, signal processing methods, and circuits has been accelerating. Electronics applications related to electrical circuits and signal processing methods have gained noticeable attention in recent times. The methods of signal processing and electrical circuits are widely used by engineers and scientists all over the world. The constituent papers represent a significant contribution to electronics and present applications that can be used in industry. Further improvements to the presented approaches are required for realizing their full potential.

Download or read book Handbook of 3D Integration Volume 1 written by Philip Garrou and published by John Wiley & Sons. This book was released on 2011-09-22 with total page 798 pages. Available in PDF, EPUB and Kindle. Book excerpt: The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.

Download or read book Bio and Nano Packaging Techniques for Electron Devices written by Gerald Gerlach and published by Springer Science & Business Media. This book was released on 2012-07-16 with total page 619 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses future trends and developments in electron device packaging and the opportunities of nano and bio techniques as future solutions. It describes the effect of nano-sized particles and cell-based approaches for packaging solutions with their diverse requirements. It offers a comprehensive overview of nano particles and nano composites and their application as packaging functions in electron devices. The importance and challenges of three-dimensional design and computer modeling in nano packaging is discussed; also ways for implementation are described. Solutions for unconventional packaging solutions for metallizations and functionalized surfaces as well as new packaging technologies with high potential for industrial applications are discussed. The book brings together a comprehensive overview of nano scale components and systems comprising electronic, mechanical and optical structures and serves as important reference for industrial and academic researchers.

Download or read book Technologies for Wireless Computing written by Anantha P. Chandrakasan and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 193 pages. Available in PDF, EPUB and Kindle. Book excerpt: Research over the last decade has brought about the development of high-performance systems such as powerful workstations, sophisticated computer graphics, and multimedia systems such as real-time video and speech recognition. A significant change in the attitude of users is the desire to have access to this computation at any location without the need to be connected to the wired power source. This has resulted in the explosive growth of research and development in the area of wireless computing over the last five years. Technologies for Wireless Computing deals with several key technologies required for wireless computing. The topics covered include reliable wireless protocols, portable terminal design considerations, video coding, RF circuit design issues and tools, display technology, energy-efficient applications, specific and programmable design techniques, energy efficiency metrics, low-voltage process technology and circuit design considerations, and CAD tools for low-power design at the behavior, logic and physical design level. Technologies for Wireless Computing is an edited volume of original research comprising invited contributions by leading researchers. This research work has also been published as a special issue of the Journal of VLSI Signal Processing Systems (Volume 13, Numbers 2 & 3).

Download or read book Index of Conference Proceedings written by British Library. Document Supply Centre and published by . This book was released on 2002 with total page 696 pages. Available in PDF, EPUB and Kindle. Book excerpt: