Download or read book Mechanical Design of Electronic Systems written by James W. Dally and published by College House Enterprises. This book was released on 2008-01-01 with total page 648 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book The mechanical aspects of electronic design written by CONSTRONIC. 1, 1972, Budapest and published by . This book was released on 1972 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Mechanical Aspects in Electronics Systems Design written by Vinay Divakar and published by GRIN Verlag. This book was released on 2014-08-27 with total page 37 pages. Available in PDF, EPUB and Kindle. Book excerpt: Scientific Study from the year 2013 in the subject Engineering - Mechanical Engineering, grade: B+, , course: Electronics Systems Design, language: English, abstract: In chapter 1, the present research carried on the mature laser technology i.e. GaAs, in order to improve its efficiency. The packaging principle used for receivers can be applied for the packaging of the laser driver circuit and the laser source in a single module. The concept of FRACAS (Failure Reporting, Analysis and Corrective Action System) has been described and failure analysis technique for Electrical overstress (EOS) is described. An industrial approach to calculating the reliability of a system with some known data is described. Some challenges with respect to packaging has been discussed in detail and some methods to overcome challenges such as lattice mismatch has been described. Every electronic components or electronic systems have certain specifications based on which it is developed and all components have datasheets of their own. The datasheets consists complete details related to the product such as product design specifications, packaging type, power ratings, dimensions etc. Any components can be selected for a particular application by referring their datasheets. In chapter 2, a datasheet for a DC power supply has been developed covering most of the important details that may be needed for designing and modeling using software tools. The schematic of the power supply is developed and practical tests are performed on the power supply, which has been described in details with the test results. The power supply has four interfaces and the functionality and usability of these interfaces has been shown and described in detail. Before the large scale manufacturing and production of any product, it is necessary to conduct two basic tests i.e. Thermal analysis and vibration tests for any given product. These tests help us to get an insight to the reliability of the product. In chapter 3, the power supply is modeled using the software tool ICEPACK v13, using which thermal analysis is performed on the critical components and the temperature variation curves along with the simulation results has been discussed. The method of casing used for the power supply for modeling and the types of conventions i.e. natural and forced convention systems has been compared and discussed. An experimental set up used for performing vibration testing on the power supply has been demonstrated and described in detail.
Download or read book The Mechanical Aspects of Electronic Design written by and published by . This book was released on 1972 with total page 322 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book The Elements of Mechanical Design written by James G. Skakoon and published by American Society of Mechanical Engineers. This book was released on 2008 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book contains principles and practices for mechanical designers and represent engineering fundamentals in a practical way.
Download or read book Practical Guide to the Packaging of Electronics written by Ali Jamnia and published by CRC Press. This book was released on 2016-12-01 with total page 374 pages. Available in PDF, EPUB and Kindle. Book excerpt: Successfully Estimate the Thermal and Mechanical Characteristics of Electronics Systems A definitive guide for practitioners new to the field or requiring a refresher course, Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition provides an understanding of system failures and helps identify the areas where they can occur. Specifically designed for the mechanical, electrical, or quality engineer, the book addresses engineering issues involved in electronics packaging and provides the basics needed to design a new system or troubleshoot a current one. Updated to reflect recent developments in the field, this latest edition adds two new chapters on acoustic and reliability fundamentals, and contains more information on electrical failures and causes. It also includes tools for understanding heat transfer, shock, and vibration. Additionally, the author: Addresses various cross-discipline issues in the design of electromechanical products Provides a solid foundation for heat transfer, vibration, and life expectancy calculations Identifies reliability issues and concerns Develops the ability to conduct a more thorough analysis for the final design Includes design tips and guidelines for each aspect of electronics packaging Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition explains the mechanical and thermal/fluid aspects of electronic product design and offers a basic understanding of electronics packaging design issues. Defining the material in-depth, it also describes system design guidelines and identifies reliability concerns for practitioners in mechanical, – electrical or quality engineering.
Download or read book Mechanical Aspects of Electronic Design written by Hiradás technikai Tudomanyos Egyesület and published by . This book was released on 1972 with total page 610 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Mechanical Analysis of Electronic Packaging Systems written by Mckeown and published by CRC Press. This book was released on 1999-04-06 with total page 382 pages. Available in PDF, EPUB and Kindle. Book excerpt: "Fills the niche between purely technical engineering texts and sophisticated engineering software guides-providing a pragmatic, common sense approach to analyzing and remedying electronic packaging configuration problems. Combines classical engineering techniques with modern computing to achieve optimum results in assessment cost and accuracy."
Download or read book Practical Guide to the Packaging of Electronics written by Ali Jamnia and published by CRC Press. This book was released on 2002-10-08 with total page 200 pages. Available in PDF, EPUB and Kindle. Book excerpt: Whether you are designing a new system or troubleshooting a current one, this ingenious text offers a wealth of valuable information. The author focuses on reliability problems and the design of systems with incomplete criteria and components and provides a simple approach for estimating thermal and mechanical characteristics of electronic systems.
Download or read book Fundamentals of Electronic Systems Design written by Jens Lienig and published by Springer. This book was released on 2017-04-25 with total page 251 pages. Available in PDF, EPUB and Kindle. Book excerpt: This textbook covers the design of electronic systems from the ground up, from drawing and CAD essentials to recycling requirements. Chapter by chapter, it deals with the challenges any modern system designer faces: The design process and its fundamentals, such as technical drawings and CAD, electronic system levels, assembly and packaging issues and appliance protection classes, reliability analysis, thermal management and cooling, electromagnetic compatibility (EMC), all the way to recycling requirements and environmental-friendly design principles. "This unique book provides fundamental, complete, and indispensable information regarding the design of electronic systems. This topic has not been addressed as complete and thorough anywhere before. Since the authors are world-renown experts, it is a foundational reference for today’s design professionals, as well as for the next generation of engineering students." Dr. Patrick Groeneveld, Synopsys Inc.
Download or read book Mechanical Aspects of Electronic Design written by Scientific Society for Telecommunication and published by . This book was released on with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Passive Components for Circuit Design written by Ian Sinclair and published by Elsevier. This book was released on 2000-11-20 with total page 305 pages. Available in PDF, EPUB and Kindle. Book excerpt: Passive Components for Circuit Design is a unique introduction to this key area of analog electronics designed for technician engineers and anyone involved in circuit design. The coverage encompasses all component types capable of power amplification: resistors, capacitors, transformers, solenoids, motors and transducers. The behaviour of the components is explored along with the different types available and the principles of circuit design. Tolerances, stability, variation with temperature, reliability and manufacturing standards are all covered. Reading this book will improve your skills in component selection and analog circuit design. These are essential skills not only for the analog designer, but for all circuit designers, professional or amateur. Gain a deeper understanding of using passive components Understand the range of components and their applications before designing and specifying Acquire a working knowledge with a minimum of maths
Download or read book Handbook of Electronic Package Design written by Michael Pecht and published by CRC Press. This book was released on 2018-10-24 with total page 904 pages. Available in PDF, EPUB and Kindle. Book excerpt: Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development
Download or read book Mechanical design for electronics product written by Jerry Wang and published by Jerry Wang. This book was released on 2019-10-22 with total page 137 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is a summary of my over 15 years work as a mechanical design engineer in electronics industry. The contents include: · The task, design considerations, developing steps of mechanical design for electronics product. · The frequent using mechanical components design guideline. · Specific function design, such as seal, EMC, screw torque definition and calculation. · Tolerance analysis. · Preliminary thermal distribution design. · Other topics such as DFM, failure root cause analysis, etc. Components design guideline is the major part of this book. The components are categorized according manufacturing method, such as sheet metal, plastic injection, die casting, Aluminium extrusion, over mold, rubber keypad and standards components selection. In each individual guideline, the typical structure is used to include the main items of: · Characters about advantages and disadvantages. · Brief description of typical manufacturing process and related equipment. · Frequent using material. · Structure design considerations. · Typical features. · Tolerance. · Frequent defects and analysis. The aim of this book is to provide guide and support to the junior mechanical design engineers in electronics industry, and I assume the readers have mechanical knowledge and reasonable design practise. So I excluded the massive basics that can be found from popular manuals or standards to make the book brief and wish could bring the readers practical help.
Download or read book Electronic Circuit Design written by Nihal Kularatna and published by CRC Press. This book was released on 2017-12-19 with total page 502 pages. Available in PDF, EPUB and Kindle. Book excerpt: With growing consumer demand for portability and miniaturization in electronics, design engineers must concentrate on many additional aspects in their core design. The plethora of components that must be considered requires that engineers have a concise understanding of each aspect of the design process in order to prevent bug-laden prototypes. Electronic Circuit Design allows engineers to understand the total design process and develop prototypes which require little to no debugging before release. It providesstep-by-step instruction featuring modern components, such as analog and mixed signal blocks, in each chapter. The book details every aspect of the design process from conceptualization and specification to final implementation and release. The text also demonstrates how to utilize device data sheet information and associated application notes to design an electronic system. The hybrid nature of electronic system design poses a great challenge to engineers. This book equips electronics designers with the practical knowledge and tools needed to develop problem free prototypes that are ready for release.
Download or read book Constronic written by Hiradástechnikai Tudományos Egyesület (Magyarország) and published by . This book was released on 1972 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Practical Guide to the Packaging of Electronics Second Edition written by Ali Jamnia and published by CRC Press. This book was released on 2008-11-20 with total page 336 pages. Available in PDF, EPUB and Kindle. Book excerpt: As the demand for packaging more electronic capabilities into smaller packages rises, product developers must be more cognizant of how the system configuration will impact its performance. Practical Guide to the Packaging of Electronics: Second Edition, Thermal and Mechanical Design and Analysis provides a basic understanding of the issues that concern the field of electronics packaging. First published in 2003, this book has been extensively updated, includes more detail where needed, and provides additional segments for clarification. This volume supplies a solid foundation for heat transfer, vibration, and life expectancy calculations. Topics discussed include various modes of heat removal, such as conduction, radiation, and convection; the impact of thermal stresses; vibration and the resultant stresses; shock management; mechanical, electrical, and chemically induced reliability; and more. Unlike many other available works, it neither assumes the reader’s familiarity with the subject nor is it so basic that the reader may lose interest. Dr. Ali Jamnia has published a large number of engineering papers and presentations and is the holder of a number of patents and patent applications. He has been involved in the issues of electronics packaging since the early ‘90s and since 1995 has worked toward the development of innovative electronics systems to aid individuals with physical or cognitive disabilities. By consulting this manual, engineers, program managers, and quality assurance managers involved in electronic systems gain a fundamental grasp of the issues involved in electronics packaging, learn how to define guidelines for a system’s design, develop the ability to identify reliability issues and concerns, and are able to conduct more complete analyses for the final design.
