Download or read book The 18th International Conference on Electronic Packaging Technology written by Tianchun Ye and published by . This book was released on 2017 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Semiconductor Advanced Packaging written by John H. Lau and published by Springer Nature. This book was released on 2021-05-17 with total page 513 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Download or read book Electronic Enclosures Housings and Packages written by Frank Suli and published by Woodhead Publishing. This book was released on 2018-11-01 with total page 490 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and potential future directions.
Download or read book Proceedings of the 7th International Conference on Nanomanufacturing nanoMan2021 written by Shuming Yang and published by Springer Nature. This book was released on 2022-04-15 with total page 309 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a compilation of selected papers from the 7th International Conference on Nanomanufacturing (nanoMan2021), held in Xi’an on November 17-19, 2021 after postponing twice due to COVID-19 pandemic. It encompasses the synthesis of nanomaterials, the fabrication of devices, the characterization of various products and systems, process monitoring and quality control, simulations, and the applications of nanoscience and nanotechnologies.
Download or read book Chiplet Design and Heterogeneous Integration Packaging written by John H. Lau and published by Springer Nature. This book was released on 2023-03-27 with total page 542 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Download or read book Interconnect Reliability in Advanced Memory Device Packaging written by Chong Leong, Gan and published by Springer Nature. This book was released on 2023-05-30 with total page 223 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects. This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.
Download or read book 2017 18th International Conference on Electronic Packaging Technology ICEPT written by IEEE Staff and published by . This book was released on 2017-08-16 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The conference will exchange the latest developments in the field of electronic packaging technology through exhibitions, special lectures, special reports, thematic forums, club reports, posters and other forms of experience
Download or read book Reliability and Failure Analysis of High Power LED Packaging written by Cher Ming Tan and published by Woodhead Publishing. This book was released on 2022-09-24 with total page 190 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reliability and Failure Analysis of High-Power LED Packaging provides fundamental understanding of the reliability and failure analysis of materials for high-power LED packaging, with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliability standards in determining the lifetime of high-power LEDs due to the lack of deep understanding of the packaging materials and their interaction with each other. Many new failure mechanisms are investigated and presented with consideration of the different stresses imposed by varying environmental conditions. The detailed failure mechanisms are unique to this book and will provide insights for readers regarding the possible failure mechanisms in high-power LEDs. The authors also show the importance of simulation in understanding the hidden failure mechanisms in LEDs. Along with simulation, the use of various destructive and non-destructive tools such as C-SAM, SEM, FTIR, Optical Microscopy, etc. in investigation of the causes of LED failures are reviewed. The advancement of LEDs in the last two decades has opened vast new applications for LEDs which also has led to harsher stress conditions for high-power LEDs. Thus, existing standards and reliability tests need to be revised to meet the new demands for high-power LEDs. - Introduces the failure mechanisms of high-power LEDs under varying environmental conditions and methods of how to test, simulate, and predict them - Describes the chemistry underlying the material degradation and its impact on LEDs - Discusses future directions of new packaging materials for improved performance and reliability of high-power LEDs
Download or read book Mechanics of Microelectronics written by G.Q. Zhang and published by Springer Science & Business Media. This book was released on 2006-08-25 with total page 580 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the microelectronics industry essential for current and future development. It aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains important and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.
Download or read book Hybridized and Coupled Nanogenerators written by Ya Yang and published by John Wiley & Sons. This book was released on 2021-02-08 with total page 387 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive guide to efficiently scavenge multi-energies from the surrounding environment to power some electronic devices and realize self-powered sensing! With the advantages of high-integration level, low cost, and high-conversion efficiency, hybridized nanogenerators have many potential applications in multi-energy scavenging and sensor fields. This book offers a comprehensive review of the design, performance, and applications of hybridized and coupled nanogenerators. The author a noted expert on the topic explores the various new hybridized and multi-effects coupled nanogenerators. The book examines the current approaches of improving electric generation performance and offers an introduction to the applications of hybridized nanogenerators in energy harvesting and sensing. This technology has proven to be highly applicable in multi-energy scavenging and self-powered sensor fields. This book includes: Examines the potential applications of hybridized and coupled nanogenerators in multi-energy scavenging and sensor fields Covers the principles of device design Explores the most current approaches to improve performance Reviews various multi-effects coupled nanogenerators and their potential applications Written for materials scientists, engineering scientists, electronics engineers, bioengineers, sensor developers, and sensor industry professionals, This book is a guide to hybridized and coupled nanogenerators that achieve the maximum utilization of multi-type and stable energies.
Download or read book Thermal Management for Opto electronics Packaging and Applications written by Xiaobing Luo and published by John Wiley & Sons. This book was released on 2024-05-29 with total page 373 pages. Available in PDF, EPUB and Kindle. Book excerpt: A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling Practical discussions of thermally enhanced thermal interfacial materials (TIMs) Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.
Download or read book Memoirs of the Institute of Scientific and Industrial Research Osaka University written by and published by . This book was released on 2018 with total page 230 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Intelligent Robotics and Applications written by Huayong Yang and published by Springer Nature. This book was released on 2023-10-09 with total page 618 pages. Available in PDF, EPUB and Kindle. Book excerpt: The 9-volume set LNAI 14267-14275 constitutes the proceedings of the 16th International Conference on Intelligent Robotics and Applications, ICIRA 2023, which took place in Hangzhou, China, during July 5–7, 2023. The 413 papers included in these proceedings were carefully reviewed and selected from 630 submissions. They were organized in topical sections as follows: Part I: Human-Centric Technologies for Seamless Human-Robot Collaboration; Multimodal Collaborative Perception and Fusion; Intelligent Robot Perception in Unknown Environments; Vision-Based Human Robot Interaction and Application. Part II: Vision-Based Human Robot Interaction and Application; Reliable AI on Machine Human Reactions; Wearable Sensors and Robots; Wearable Robots for Assistance, Augmentation and Rehabilitation of Human Movements; Perception and Manipulation of Dexterous Hand for Humanoid Robot. Part III: Perception and Manipulation of Dexterous Hand for Humanoid Robot; Medical Imaging for Biomedical Robotics; Advanced Underwater Robot Technologies; Innovative Design and Performance Evaluation of Robot Mechanisms; Evaluation of Wearable Robots for Assistance and Rehabilitation; 3D Printing Soft Robots. Part IV: 3D Printing Soft Robots; Dielectric Elastomer Actuators for Soft Robotics; Human-like Locomotion and Manipulation; Pattern Recognition and Machine Learning for Smart Robots. Part V: Pattern Recognition and Machine Learning for Smart Robots; Robotic Tactile Sensation, Perception, and Applications; Advanced Sensing and Control Technology for Human-Robot Interaction; Knowledge-Based Robot Decision-Making and Manipulation; Design and Control of Legged Robots. Part VI: Design and Control of Legged Robots; Robots in Tunnelling and Underground Space; Robotic Machining of Complex Components; Clinically Oriented Design in Robotic Surgery and Rehabilitation; Visual and Visual-Tactile Perception for Robotics. Part VII: Visual and Visual-Tactile Perception for Robotics; Perception, Interaction, and Control of Wearable Robots; Marine Robotics and Applications; Multi-Robot Systems for Real World Applications; Physical and Neurological Human-Robot Interaction. Part VIII: Physical and Neurological Human-Robot Interaction; Advanced Motion Control Technologies for Mobile Robots; Intelligent Inspection Robotics; Robotics in Sustainable Manufacturing for Carbon Neutrality; Innovative Design and Performance Evaluation of Robot Mechanisms. Part IX: Innovative Design and Performance Evaluation of Robot Mechanisms; Cutting-Edge Research in Robotics.
Download or read book Lead free Soldering Process Development and Reliability written by Jasbir Bath and published by John Wiley & Sons. This book was released on 2020-07-28 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt: Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: · Developments in process engineering (SMT, Wave, Rework, Paste Technology) · Low temperature, high temperature and high reliability alloys · Intermetallic compounds · PCB surface finishes and laminates · Underfills, encapsulants and conformal coatings · Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book’s explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements.
Download or read book Plant Nanobionics written by Ram Prasad and published by Springer Nature. This book was released on 2019-09-30 with total page 496 pages. Available in PDF, EPUB and Kindle. Book excerpt: Plant Nanobionics, Volume 2 continues the important discussion of nanotechnology in plants, but focuses with a focus on biosynthesis and toxicity. This book discusses novel approaches to biosynthesis of nanoparticles for the increase of plant production systems, controlled release of agrochemicals and management of plant biotic stress. Green biosynthesis of metallic nanoparticles from bee propolis, artificial photosynthesis and hybrid structures are presented. Although engineered nanoparticles have great potential for solving many agricultural and societal problems, their consequences on the ecosystems and environment must be responsibly considered. This volume aims to contribute to the limited literature on this topic through its comprehensive examination of nanoparticle toxicity on plants, microbes and human health. Environmental risks with recent data are discussed as well as risks associated with the transfer of nanoparticles through the food chain. This volume highlights the study of a mechanistic approach and the study of nanoparticles towards nanobionics. The application of polymeric materials for smart packing in the food industry and agriculture sector as well as the future of nanomaterials in detecting soil microbes for environmental remediation are also included.
Download or read book TSV 3D RF Integration written by Shenglin Ma and published by Elsevier. This book was released on 2022-04-27 with total page 294 pages. Available in PDF, EPUB and Kindle. Book excerpt: TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters. A series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology. - Provides a detailed demonstration of the design and process development of HR-Si (High-Resistivity Silicon) interposer technology - Presents a series of implementation case studies that detail modeling and simulation, integration, qualification and testing methods - Offers a systematic and comparative literature review of HR-Si interposer technology by topic - Offers solutions to problems with TSV (through silicon via) interposer technology, including high frequency loss and cooling problems - Gives a systematic and accessible accounting on this leading technology
Download or read book Applications of Electromagnetic Waves written by Reza K. Amineh and published by MDPI. This book was released on 2021-01-20 with total page 242 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electromagnetic (EM) waves carry energy through propagation in space. This radiation associates with entangled electric and magnetic fields which must exist simultaneously. Although all EM waves travel at the speed of light in vacuum, they cover a wide range of frequencies called the EM spectrum. The various portions of the EM spectrum are referred to by various names based on their different attributes in the emission, transmission, and absorption of the corresponding waves and also based on their different practical applications. There are no certain boundaries separating these various portions, and the ranges tend to overlap. Overall, the EM spectrum, from the lowest to the highest frequency (longest to shortest wavelength) contains the following waves: radio frequency (RF), microwaves, millimeter waves, terahertz, infrared, visible light, ultraviolet, X-rays, and gamma rays. This Special Issue consists of sixteen papers covering a broad range of topics related to the applications of EM waves, from the design of filters and antennas for wireless communications to biomedical imaging and sensing and beyond.
