Download or read book Texas Instruments Technical Journal written by and published by . This book was released on 1998 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Handbook of Semiconductor Manufacturing Technology written by Yoshio Nishi and published by CRC Press. This book was released on 2017-12-19 with total page 1720 pages. Available in PDF, EPUB and Kindle. Book excerpt: Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Download or read book Embedded Systems Design with the Texas Instruments MSP432 32 bit Processor written by Dung Dang and published by Morgan & Claypool Publishers. This book was released on 2016-10-26 with total page 576 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a thorough introduction to the Texas Instruments MPS432TM microcontroller. The MPS432 is a 32-bit processor with the ARM Cortex M4F architecture and a built-in floating point unit. At the core, the MSP432 features a 32-bit ARM Cortex-M4F CPU, a RISC-architecture processing unit that includes a built-in DSP engine and a floating point unit. As an extension of the ultra-low-power MSP microcontroller family, the MSP432 features ultra-low power consumption and integrated digital and analog hardware peripherals. The MSP432 is a new member to the MSP family. It provides for a seamless transition to applications requiring 32-bit processing at an operating frequency of up to 48 MHz. The processor may be programmed at a variety of levels with different programming languages including the user-friendly Energia rapid prototyping platform, in assembly language, and in C. A number of C programming options are also available to developers, starting with register-level access code where developers can directly configure the device's registers, to Driver Library, which provides a standardized set of application program interfaces (APIs) that enable software developers to quickly manipulate various peripherals available on the device. Even higher abstraction layers are also available, such as the extremely user-friendly Energia platform, that enables even beginners to quickly prototype an application on MSP432. The MSP432 LaunchPad is supported by a host of technical data, application notes, training modules, and software examples. All are encapsulated inside one handy package called MSPWare, available as both a stand-alone download package as well as on the TI Cloud development site: dev.ti.com The features of the MSP432 may be extended with a full line of BoosterPack plug-in modules. The MSP432 is also supported by a variety of third party modular sensors and software compiler companies. In the back, a thorough introduction to the MPS432 line of microcontrollers, programming techniques, and interface concepts are provided along with considerable tutorial information with many illustrated examples. Each chapter provides laboratory exercises to apply what has been presented in the chapter. The book is intended for an upper level undergraduate course in microcontrollers or mechatronics but may also be used as a reference for capstone design projects. Practicing engineers already familiar with another microcontroller, who require a quick tutorial on the microcontroller, will also find this book very useful. Finally, middle school and high school students will find the MSP432 highly approachable via the Energia rapid prototyping system.
Download or read book Hein Semke 40 anos de actividade em Portugal written by and published by . This book was released on 1972 with total page 355 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book PC Tech Journal written by and published by . This book was released on 1988 with total page 1196 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Failure Analysis of Integrated Circuits written by Lawrence C. Wagner and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 256 pages. Available in PDF, EPUB and Kindle. Book excerpt: This "must have" reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.
Download or read book Semiconductor Wafer Bonding VIII Science Technology and Applications written by and published by The Electrochemical Society. This book was released on 2005 with total page 476 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Encyclopedia of Mobile Computing and Commerce written by Taniar, David and published by IGI Global. This book was released on 2007-04-30 with total page 1176 pages. Available in PDF, EPUB and Kindle. Book excerpt: The "Encyclopedia of Mobile Computing and Commerce" presents current trends in mobile computing and their commercial applications. Hundreds of internationally renowned scholars and practitioners have written comprehensive articles exploring such topics as location and context awareness, mobile networks, mobile services, the socio impact of mobile technology, and mobile software engineering.
Download or read book Control System Applications written by William S. Levine and published by CRC Press. This book was released on 2018-10-24 with total page 442 pages. Available in PDF, EPUB and Kindle. Book excerpt: Control technology permeates every aspect of our lives. We rely on them to perform a wide variety of tasks without giving much thought to the origins of the technology or how it became such an important part of our lives. Control System Applications covers the uses of control systems, both in the common and in the uncommon areas of our lives. From the everyday to the unusual, it's all here. From process control to human-in-the-loop control, this book provides illustrations and examples of how these systems are applied. Each chapter contains an introduction to the application, a section defining terms and references, and a section on further readings that help you understand and use the techniques in your work environment. Highly readable and comprehensive, Control System Applications explores the uses of control systems. It illustrates the diversity of control systems and provides examples of how the theory can be applied to specific practical problems. It contains information about aspec ts of control that are not fully captured by the theory, such as techniques for protecting against controller failure and the role of cost and complexity in specifying controller designs.
Download or read book The ESD Handbook written by Steven H. Voldman and published by John Wiley & Sons. This book was released on 2021-03-25 with total page 1172 pages. Available in PDF, EPUB and Kindle. Book excerpt: A practical and comprehensive reference that explores Electrostatic Discharge (ESD) in semiconductor components and electronic systems The ESD Handbook offers a comprehensive reference that explores topics relevant to ESD design in semiconductor components and explores ESD in various systems. Electrostatic discharge is a common problem in the semiconductor environment and this reference fills a gap in the literature by discussing ESD protection. Written by a noted expert on the topic, the text offers a topic-by-topic reference that includes illustrative figures, discussions, and drawings. The handbook covers a wide-range of topics including ESD in manufacturing (garments, wrist straps, and shoes); ESD Testing; ESD device physics; ESD semiconductor process effects; ESD failure mechanisms; ESD circuits in different technologies (CMOS, Bipolar, etc.); ESD circuit types (Pin, Power, Pin-to-Pin, etc.); and much more. In addition, the text includes a glossary, index, tables, illustrations, and a variety of case studies. Contains a well-organized reference that provides a quick review on a range of ESD topics Fills the gap in the current literature by providing information from purely scientific and physical aspects to practical applications Offers information in clear and accessible terms Written by the accomplished author of the popular ESD book series Written for technicians, operators, engineers, circuit designers, and failure analysis engineers, The ESD Handbook contains an accessible reference to ESD design and ESD systems.
Download or read book SOI Design written by Andrew Marshall and published by Springer Science & Business Media. This book was released on 2007-05-08 with total page 410 pages. Available in PDF, EPUB and Kindle. Book excerpt: This title introduces state-of-the-art design principles for SOI circuit design, and is primarily concerned with circuit-related issues. It considers SOI material in terms of implementation that is promising or has been used elsewhere in circuit development, with historical perspective where appropriate.
Download or read book ESD Testing written by Steven H. Voldman and published by John Wiley & Sons. This book was released on 2016-10-07 with total page 328 pages. Available in PDF, EPUB and Kindle. Book excerpt: With the evolution of semiconductor technology and global diversification of the semiconductor business, testing of semiconductor devices to systems for electrostatic discharge (ESD) and electrical overstress (EOS) has increased in importance. ESD Testing: From Components to Systems updates the reader in the new tests, test models, and techniques in the characterization of semiconductor components for ESD, EOS, and latchup. Key features: Provides understanding and knowledge of ESD models and specifications including human body model (HBM), machine model (MM), charged device model (CDM), charged board model (CBM), cable discharge events (CDE), human metal model (HMM), IEC 61000-4-2 and IEC 61000-4-5. Discusses new testing methodologies such as transmission line pulse (TLP), to very fast transmission line pulse (VF-TLP), and future methods of long pulse TLP, to ultra-fast TLP (UF-TLP). Describes both conventional testing and new testing techniques for both chip and system level evaluation. Addresses EOS testing, electromagnetic compatibility (EMC) scanning, to current reconstruction methods. Discusses latchup characterization and testing methodologies for evaluation of semiconductor technology to product testing. ESD Testing: From Components to Systems is part of the authors’ series of books on electrostatic discharge (ESD) protection; this book will be an invaluable reference for the professional semiconductor chip and system-level ESD and EOS test engineer. Semiconductor device and process development, circuit designers, quality, reliability and failure analysis engineers will also find it an essential reference. In addition, its academic treatment will appeal to both senior and graduate students with interests in semiconductor process, device physics, semiconductor testing and experimental work.
Download or read book Handbook of Systems Engineering and Management written by Andrew P. Sage and published by John Wiley & Sons. This book was released on 2014-12-31 with total page 1502 pages. Available in PDF, EPUB and Kindle. Book excerpt: The trusted handbook—now in a new edition This newly revised handbook presents a multifaceted view of systems engineering from process and systems management perspectives. It begins with a comprehensive introduction to the subject and provides a brief overview of the thirty-four chapters that follow. This introductory chapter is intended to serve as a "field guide" that indicates why, when, and how to use the material that follows in the handbook. Topical coverage includes: systems engineering life cycles and management; risk management; discovering system requirements; configuration management; cost management; total quality management; reliability, maintainability, and availability; concurrent engineering; standards in systems engineering; system architectures; systems design; systems integration; systematic measurements; human supervisory control; managing organizational and individual decision-making; systems reengineering; project planning; human systems integration; information technology and knowledge management; and more. The handbook is written and edited for systems engineers in industry and government, and to serve as a university reference handbook in systems engineering and management courses. By focusing on systems engineering processes and systems management, the editors have produced a long-lasting handbook that will make a difference in the design of systems of all types that are large in scale and/or scope.
Download or read book Characterization of Integrated Circuit Packaging Materials written by Thomas Moore and published by Elsevier. This book was released on 2013-10-22 with total page 293 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.
Download or read book Industrial And Engineering Applications Of Artificial Intelligence And Expert Systems written by Moonis Ali and published by CRC Press. This book was released on 1988-08 with total page 636 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book See Me See You written by Clarissa Chikiamco and published by National Gallery Singapore. This book was released on 2024-03-26 with total page 275 pages. Available in PDF, EPUB and Kindle. Book excerpt: See Me, See You is the world’s first exhibition of early video installation of Southeast Asia, spanning the early 1980s to the early 1990s. This catalogue traces the journeys and evolving identities of the ten artists featured in the show and their pivotal experiments with the moving image, which incorporate readymade objects and cathode-ray tube television monitors as well as performative and participatory elements. Their artworks encapsulate the techniques and materials of their generation and mark the emergence of video installation as a form in the region. The publication features interviews, essays, rare archival images and texts, as well as a timeline that highlights the definitive technological moments and inventions that propelled television and video in global and regional contexts.
Download or read book Advances in Rapid Thermal and Integrated Processing written by F. Roozeboom and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 568 pages. Available in PDF, EPUB and Kindle. Book excerpt: Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are discussed at the graduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage.
