Download or read book Test Procedures for Developing Solder Data written by T. A. Siewert and published by National Institute of Standards & Technology. This book was released on 2002 with total page 31 pages. Available in PDF, EPUB and Kindle. Book excerpt: Prepared by the NEMI Task Group on Lead-Free Alloys and Reliability. Documents standardized test procedures that can produce valid and reproducible mechanical-property data for lead-free solders.
Download or read book Test Procedures for Developing Solder Data written by T. E. Siewert and published by Forgotten Books. This book was released on 2017-10-27 with total page 42 pages. Available in PDF, EPUB and Kindle. Book excerpt: Excerpt from Test Procedures for Developing Solder Data: Nemi Task Group on Lead-Free Alloys and Reliability The following pages describe the wide variety of mechanical property tests that were selected for this collection, thenrefined, by the nemi Task Groups on Lead-free Alloys and Reliability. Use as many of the tests as needed for your application. When you perform any of these tests, record as much information as possible. In the Foreword, we include a link to some data that have already been generated and entered into a prototype public database. Additional data are welcome. About the Publisher Forgotten Books publishes hundreds of thousands of rare and classic books. Find more at www.forgottenbooks.com This book is a reproduction of an important historical work. Forgotten Books uses state-of-the-art technology to digitally reconstruct the work, preserving the original format whilst repairing imperfections present in the aged copy. In rare cases, an imperfection in the original, such as a blemish or missing page, may be replicated in our edition. We do, however, repair the vast majority of imperfections successfully; any imperfections that remain are intentionally left to preserve the state of such historical works.
Download or read book NIST Recommended Practice Guide written by and published by . This book was released on 2002 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Lead Free Solder Process Development written by Gregory Henshall and published by John Wiley & Sons. This book was released on 2011-03-29 with total page 241 pages. Available in PDF, EPUB and Kindle. Book excerpt: Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distribution Examines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB) Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD) Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries.
Download or read book Lead free Soldering Process Development and Reliability written by Jasbir Bath and published by John Wiley & Sons. This book was released on 2020-07-28 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt: Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: · Developments in process engineering (SMT, Wave, Rework, Paste Technology) · Low temperature, high temperature and high reliability alloys · Intermetallic compounds · PCB surface finishes and laminates · Underfills, encapsulants and conformal coatings · Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book’s explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements.
Download or read book U S Government Research Development Reports written by and published by . This book was released on 1966 with total page 384 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Performance Testing for Aerospace and High Performance Electronic Interconnects Containing Pb free Solder and Finishes written by G-24 Pb-free Risk Management Committee for ADHP. and published by . This book was released on 2018 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This document defines: 1A default method for those companies that require a pre-defined approach and 2A protocol for those companies that wish to develop their own test methods.The default method (Section 4 of the document) is intended for use by electronic equipment manufacturers, repair facilities, or programs which, for a variety of reasons, may be unable to develop methods specific to their own products and applications. It is to be used when little or no other information is available to define, conduct, and interpret results from reliability, qualification, or other tests for electronic equipment containing Pb-free solder. The default method is intended to be conservative, i.e., it is biased toward minimizing the risk to users of AHP electronic equipment.The protocol (Section 5 of the document) is intended for use by manufacturers or repair facilities which have the necessary resources to design and conduct reliability, qualification, or process development tests that are specific to their products, their operating conditions, and their applications. Users of the protocol will have the necessary knowledge, experience, and data to customize their own methods for designing, conducting, and interpreting results from the data. Key to developing a protocol is a firm understanding of all material properties for the Pb-free material in question as well as knowledge of package- and board-level attributes as described in Section 4.1.1. As an example, research has shown that the mechanisms for creep are very different between SnPb and Tin-Silver-Copper (SAC) solders. Understanding these mechanisms is key to determining critical test parameters such as dwell time for thermal cycling. The protocol portion of this document provides guidance on performing sufficient characterization of new materials in order to accurately define test parameters.Use of the protocol is encouraged, since it is likely to yield more accurate results. Reference [7] provides a comprehensive overview of those technical considerations necessary in implementing a test protocol.This document addresses the evaluation of failure mechanisms, through performance testing, expected in electronic products containing Pb-free solder. One failure mode, fatigue-failure through the solder-joint, is considered a primary failure mode in AHP electronics and can be understood in terms of physics-of-failure and life-projections. Understanding the all potential failure modes caused by Pb-free solder of AHP electronics is a critical element in defining early field-failures/reliability issues. Grouping of different failure modes may result in incorrect and/or misleading test conclusions. Failure analysis efforts should be conducted to insure that individual failure modes are identified enabling the correct application of reliability assessments and life-projection efforts.When properly used, the methods or protocol defined in this document may be used along with the processes documented in compliance to Reference [3], to satisfy, at least in part, the reliability requirements of References [3] and [4].This document may be used for products in all stages of the transition to Pb-free solder, including: Products that have been designed and qualified with traditional SnPb electronic components, materials, and assembly processes, and are being re-qualified with use of Pb-free components Products with SnPb designs transitioning to Pb-free solder; and Products newly-designed with Pb-free solder.For programs that were designed with SnPb solder, and are currently not using any Pb-free solder, the traditional methods may be used. It is important, however, for those programs to have processes in place to maintain the SnPb configuration including those outsourced or manufactured by subcontractors.With respect to products as mentioned above, the methods presented in this document are intended to be applied at the level of assembly at which soldering occurs, i.e., circuit-card assembly level. For those users interested in COTS (commercial-off-the-shelf) testing, some guidance at box-level (e.g., power suppliers, module assemblies, etc.) is provided in Section 6.0.IMPORTANT TO NOTE: This standard does not apply to space flight hardware. Applications that do not permit the use of Pb-free soldering for circuit board assembly, such as electronic hardware for space flight, are outside the scope of this document.The demonstration of successful performance or acceptable reliability of hardware through a test program consistent with this Standard may be application-specific, and should not be construed as demonstrating qualification of the same hardware for a different application where Pb-free solder and finishes have been prohibited.
Download or read book Bulletin de l Institut international du froid written by and published by . This book was released on 2004 with total page 766 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Soldering written by Mel Schwartz and published by ASM International. This book was released on 2014-03-01 with total page 207 pages. Available in PDF, EPUB and Kindle. Book excerpt: Covers various soldering methods and techniques as well as the latest on solder alloys, solder films, surface preparation, fluxes and cleaning methods, heating methods, inspection techniques, and quality control and reliability. Geared to scientists, material engineers, designers, manufacturing engineers, and technologists who need immediate practical guidance rather than theoretical instruction.
Download or read book Tests for Tin lead Solders and Solder Joints written by Vernon R. Miller and published by . This book was released on 1967 with total page 36 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book U S Government Research Reports written by and published by . This book was released on 1964 with total page 2194 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Materials Science and Engineering Laboratory written by and published by . This book was released on 1993 with total page 32 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Engine Coolant Testing 2nd Symposium written by Roy E. Beal and published by ASTM International. This book was released on 1986 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Lead Free Electronics written by Edwin Bradley and published by John Wiley & Sons. This book was released on 2007-10-26 with total page 472 pages. Available in PDF, EPUB and Kindle. Book excerpt: Based on the results of a more than two-year study, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing is the first practical, primary reference to cover Pb-free solder assembly as well as the analysis and reasoning behind the selection of Sn-Ag-Cu as the recommended Pb-free replacement for Sn-Pb. Reflecting the results of a two-year study, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing provides full coverage of the issues surrounding the implementation of Pb-free solder into electronic board assembly. This book is extremely timelyâ??most electronic manufacturers are going to change over to Pb free soldering by 2006 to meet new European laws. All manufacturers around the globe are going to be affected by this change. The text provides specific results from the thirty company NEMI project activities. It contains integrated and fully documented book chapters with references to existing published work in the area. These serve as tremendous resources for engineers and companies faced with making the switch to Pb-free solder assembly.
Download or read book Statistical Methods for Testing Development and Manufacturing written by Forrest W. Breyfogle, III and published by John Wiley & Sons. This book was released on 1992-04-16 with total page 556 pages. Available in PDF, EPUB and Kindle. Book excerpt: Clearly illustrates how established techniques can be easily understood and used with a sample size that is smaller than normally envisioned. Provides solutions to complex industrial problems by demonstrating how to define the problem and evaluate it statistically with the aim of accelerating product design testing that requires fewer samples and offers more information with less test effort. Along with examples, it contains detailed additional material presented in tabular form for both easy reference and cross-reference.
Download or read book Dictionary of Occupational Titles written by and published by . This book was released on 1977 with total page 1420 pages. Available in PDF, EPUB and Kindle. Book excerpt: Supplement to 3d ed. called Selected characteristics of occupations (physical demands, working conditions, training time) issued by Bureau of Employment Security.
Download or read book Dictionary of Occupational Titles written by United States Employment Service and published by . This book was released on 1977 with total page 1434 pages. Available in PDF, EPUB and Kindle. Book excerpt:
