Download or read book Mechanical Properties of Structural Films written by Christopher L. Muhlstein and published by ASTM International. This book was released on 2001 with total page 333 pages. Available in PDF, EPUB and Kindle. Book excerpt: Recent advances in the mechanical properties of structural films are described in these papers from a November 2000 symposium held in Orlando, Florida. Papers are organized in sections on fracture and fatigue of structural films, elastic behavior and residual stress in thin films, tensile testing of
Download or read book Tensile Testing of Thin Films written by D. T. Read and published by . This book was released on 1997 with total page 96 pages. Available in PDF, EPUB and Kindle. Book excerpt: Five technical papers covering the development of a set of techniques for measuring the tensile properties of thin films are gathered here. Also included are drawings of the mechanical components of the apparatus and listings of two computer programs. Additional necessary parts include a computer, instrumentation, two piezoelectric stacks, and an appropriate platform equipped with a microscope. Piezoelectric stacks are used as actuators. Noncontacting eddy-current displacement sensors measure both the tensile displacement and the force.Closed-loop feedback control allows a variety of test programs. The maximum available displacement is about 50 um, and the maximum available force is about 0.3 N. The resolution of displacement is about 25 nm, and the resolution of force is about 100 uN. Cyclic loading has been demonstrated for cycles as short as 20 s.
Download or read book Unified Constitutive Laws of Plastic Deformation written by A. S. Krausz and published by Elsevier. This book was released on 1996-05-31 with total page 479 pages. Available in PDF, EPUB and Kindle. Book excerpt: High-technology industries using plastic deformation demand soundly-based economical decisions in manufacturing design and product testing, and the unified constitutive laws of plastic deformation give researchers aguideline to use in making these decisions. This book provides extensive guidance in low cost manufacturing without the loss of product quality. Each highly detailed chapter of Unified Constitutive Laws of Plastic Deformation focuses on a distinct set of defining equations. Topics covered include anisotropic and viscoplastic flow, and the overall kinetics and thermodynamics of deformation. This important book deals with a prime topic in materials science and engineering, and will be of great use toboth researchers and graduate students. - Describes the theory and applications of the constitutive law of plastic deformation for materials testing - Examines the constitutive law of plastic deformation as it applies to process and product design - Includes a program on disk for the determination and development of the constitutive law of plastic deformation - Considers economical design and testing methods
Download or read book Thin Film Materials written by L. B. Freund and published by Cambridge University Press. This book was released on 2004-01-08 with total page 772 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thin film mechanical behavior and stress presents a technological challenge for materials scientists, physicists and engineers. This book provides a comprehensive coverage of the major issues and topics dealing with stress, defect formation, surface evolution and allied effects in thin film materials. Physical phenomena are examined from the continuum down to the sub-microscopic length scales, with the connections between the structure of the material and its behavior described. Theoretical concepts are underpinned by discussions on experimental methodology and observations. Fundamental scientific concepts are embedded through sample calculations, a broad range of case studies with practical applications, thorough referencing, and end of chapter problems. With solutions to problems available on-line, this book will be essential for graduate courses on thin films and the classic reference for researchers in the field.
Download or read book Materials Science of Thin Films written by Milton Ohring and published by Academic Press. This book was released on 2002 with total page 817 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is the first book that can be considered a textbook on thin film science, complete with exercises at the end of each chapter. Ohring has contributed many highly regarded reference books to the AP list, including Reliability and Failure of Electronic Materials and the Engineering Science of Thin Films. The knowledge base is intended for science and engineering students in advanced undergraduate or first-year graduate level courses on thin films and scientists and engineers who are entering or require an overview of the field. Since 1992, when the book was first published, the field of thin films has expanded tremendously, especially with regard to technological applications. The second edition will bring the book up-to-date with regard to these advances. Most chapters have been greatly updated, and several new chapters have been added.
Download or read book Introduction to Ceramics written by W. David Kingery and published by John Wiley & Sons. This book was released on 1976-05-04 with total page 1060 pages. Available in PDF, EPUB and Kindle. Book excerpt: This 2nd edition of Introduction to Ceramics has been printed 15 years after the 1st edition. Many advances have been made in understanding and controlling and developing new ceramic processes and products. this text has a considerable amount of new material and the product modification.
Download or read book Security and Reliability of Damaged Structures and Defective Materials written by Guy Pluvinage and published by Springer Science & Business Media. This book was released on 2009-07-06 with total page 419 pages. Available in PDF, EPUB and Kindle. Book excerpt: Structures that are essential for economy and security such as energy production, transportation and supply, water supply, buildings, are susceptible to failure, because of defects already present in the material, or created at fabrication, or appearing during service. Methods of assesment of the nocivity of these defects are needed, to predict the remaining service life and the eventual emergency of stopping service and repairing, if possible. To reach this objectives, this book presents the last methods derived from the classical linear, non-linear fracture mechanics concepts, including fatigue and notch fracture mechanics. Several examples of structures rehabilitations and repairing are given. This book gathers the presentation made during the Advanced Research Workshop held in Portoroz (Slovenia) in October 2008, under the auspices of NATO Science for Peace and Security Programme. It is edited by Professor Guy Pluvinage from the University Paul Verlaine – Metz (France) and Professor Aleksandar Sedmak from the University of Belgrade, Faculty of Mechanical Engineering. Both have a long and rich experience in analysis of theoretical and practical cases in safety and reliability of structures. Other contributors are all known as experts in the areas of fatigue, facture and reliability of structures.
Download or read book Advanced Interconnects for ULSI Technology written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2012-02-17 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.
Download or read book Continuum Scale Simulation of Engineering Materials written by Dierk Raabe and published by John Wiley & Sons. This book was released on 2006-03-06 with total page 885 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book fills a gap by presenting our current knowledge and understanding of continuum-based concepts behind computational methods used for microstructure and process simulation of engineering materials above the atomic scale. The volume provides an excellent overview on the different methods, comparing the different methods in terms of their respective particular weaknesses and advantages. This trains readers to identify appropriate approaches to the new challenges that emerge every day in this exciting domain. Divided into three main parts, the first is a basic overview covering fundamental key methods in the field of continuum scale materials simulation. The second one then goes on to look at applications of these methods to the prediction of microstructures, dealing with explicit simulation examples, while the third part discusses example applications in the field of process simulation. By presenting a spectrum of different computational approaches to materials, the book aims to initiate the development of corresponding virtual laboratories in the industry in which these methods are exploited. As such, it addresses graduates and undergraduates, lecturers, materials scientists and engineers, physicists, biologists, chemists, mathematicians, and mechanical engineers.
Download or read book Reliability of MEMS written by Osamu Tabata and published by John Wiley & Sons. This book was released on 2008-02-04 with total page 328 pages. Available in PDF, EPUB and Kindle. Book excerpt: This first book to cover exclusively and in detail the principles, tools and methods for determining the reliability of microelectromechanical materials, components and devices covers both component materials as well as entire MEMS devices. Divided into two major parts, following a general introductory chapter to reliability issues, the first part looks at the mechanical properties of the materials used in MEMS, explaining in detail the necessary measuring technologies -- nanoindenters, bulge methods, bending tests, tensile tests, and others. Part Two treats the actual devices, organized by important device categories such as pressure sensors, inertial sensors, RF MEMS, and optical MEMS.
Download or read book Advanced Materials Modelling for Structures written by Holm Altenbach and published by Springer Science & Business Media. This book was released on 2013-02-05 with total page 365 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume presents the major outcome of the IUTAM symposium on “Advanced Materials Modeling for Structures”. It discusses advances in high temperature materials research, and also to provides a discussion the new horizon of this fundamental field of applied mechanics. The topics cover a large domain of research but place a particular emphasis on multiscale approaches at several length scales applied to non linear and heterogeneous materials. Discussions of new approaches are emphasised from various related disciplines, including metal physics, micromechanics, mathematical and computational mechanics.
Download or read book American Society for Composites written by Michael Hyer and published by DEStech Publications, Inc. This book was released on 2011-06-28 with total page 2760 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Simulated Space Environmental Testing on Thin Films written by Dennis A. Russell and published by . This book was released on 2000 with total page 102 pages. Available in PDF, EPUB and Kindle. Book excerpt: An exploratory program has been conducted, to irradiate some mature commercial and some experimental polymer films with radiation simulating certain Earth orbits, and to obtain data about the response of each test film's reflective and tensile properties. Protocols to conduct optimized tests were considered and developed to a "prototype" level during this program. Fifteen polymer film specimens were arranged on a specially designed test fixture. The fixture featured controlled exposure areas, and protected the ends of the samples for later gripping in tensile tests. The fixture containing the films was installed in a clean vacuum chamber where protons, electrons and solar ultraviolent (UV) radiation could simultaneously irradiate the specimens. Near realtime UV rates were used, whereas proton and electron rates were accelerated appreciably to simulate 5 years in orbit during a two month test. Periodically, the spectral reflectance of each film was measured in situ. After the end of the irradiation, final reflectance measurements were made in situ, and solar absorptance values were derived for each specimen. These samples were then measured in air for thermal emittance and for tensile strength. Most specimens withstood the irradiation intact, but with reduced reflectance (increased solar absorptance). Thermal emittance changed slightly in several materials, as did their tensile strength and elongation at break. Conclusions are drawn about the performance of the films. Simulated testing to an expected 5 year dose of electrons and protons consistent with those expected at 1.2 and 0.98 AU orbits and 100 equivalent solar hours exposure.
Download or read book Micro and Opto Electronic Materials and Structures Physics Mechanics Design Reliability Packaging written by Ephraim Suhir and published by Springer Science & Business Media. This book was released on 2007-05-26 with total page 1471 pages. Available in PDF, EPUB and Kindle. Book excerpt: This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
Download or read book Advances in Multiphysics Simulation and Experimental Testing of MEMS written by Attilio Frangi and published by World Scientific. This book was released on 2008 with total page 504 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume takes a much needed multiphysical approach to the numerical and experimental evaluation of the mechanical properties of MEMS and NEMS. The contributed chapters present many of the most recent developments in fields ranging from microfluids and damping to structural analysis, topology optimization and nanoscale simulations. The book responds to a growing need emerging in academia and industry to merge different areas of expertise towards a unified design and analysis of MEMS and NEMS.
Download or read book Adhesion Measurement of Thin Films Thick Films and Bulk Coatings written by K. L. Mittal and published by ASTM International. This book was released on 1978 with total page 420 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Dynamic Behavior of Materials Volume 1 written by Tom Proulx and published by Springer Science & Business Media. This book was released on 2011-05-27 with total page 455 pages. Available in PDF, EPUB and Kindle. Book excerpt: Dynamic Behavior of Materials represents one of eight volumes of technical papers presented at the Society for Experimental Mechanics Annual Conference on Experimental and Applied Mechanics, held at Uncasville, Connecticut, June 13-16, 2011. The full set of proceedings also includes volumes on Mechanics of Biological Systems and Materials, Mechanics of Time-Dependent Materials and Processes in Conventional and Multifunctional Materials, MEMS and Nanotechnology; Optical Measurements, Modeling and, Metrology; Experimental and Applied Mechanics, Thermomechanics and Infra-Red Imaging, and Engineering Applications of Residual Stress.