Download or read book Substrate Noise Coupling in Analog RF Circuits written by Stephane Bronckers and published by Artech House. This book was released on 2010 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents case studies to illustrate that careful modeling of the assembly characteristics and layout details is required to bring simulations and measurements into agreement. Engineers learn how to use a proper combination of isolation structures and circuit techniques to make analog/RF circuits more immune to substrate noise. Topics include substrate noise propagation, passive isolation structures, noise couple in active devices, measuring the coupling mechanisms in analog/RF circuits, prediction of the impact of substrate noise on analog/RF circuits, and noise coupling in analog/RF systems.
Download or read book Substrate Noise Coupling in RFICs written by Ahmed Helmy and published by Springer Science & Business Media. This book was released on 2008-03-23 with total page 129 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book reports modeling and simulation techniques for substrate noise coupling effects in RFICs and introduces isolation structures and design guides to mitigate such effects with the ultimate goal of enhancing the yield of RF and mixed signal SoCs. The book further reports silicon measurements, and new test and noise isolation structures. To the authors’ knowledge, this is the first title devoted to the topic of substrate noise coupling in RFICs as part of a large SoC.
Download or read book Substrate Noise Coupling in Mixed Signal ASICs written by Stéphane Donnay and published by Springer Science & Business Media. This book was released on 2006-05-31 with total page 287 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is the first in a series of three dedicated to advanced topics in Mixed-Signal IC design methodologies. It is one of the results achieved by the Mixed-Signal Design Cluster, an initiative launched in 1998 as part of the TARDIS project, funded by the European Commission within the ESPRIT-IV Framework. This initiative aims to promote the development of new design and test methodologies for Mixed-Signal ICs, and to accelerate their adoption by industrial users. As Microelectronics evolves, Mixed-Signal techniques are gaining a significant importance due to the wide spread of applications where an analog front-end is needed to drive a complex digital-processing subsystem. In this sense, Analog and Mixed-Signal circuits are recognized as a bottleneck for the market acceptance of Systems-On-Chip, because of the inherent difficulties involved in the design and test of these circuits. Specially, problems arising from the use of a common substrate for analog and digital components are a main limiting factor. The Mixed-Signal Cluster has been formed by a group of 11 Research and Development projects, plus a specific action to promote the dissemination of design methodologies, techniques, and supporting tools developed within the Cluster projects. The whole action, ending in July 2002, has been assigned an overall budget of more than 8 million EURO.
Download or read book Noise Coupling in System on Chip written by Thomas Noulis and published by CRC Press. This book was released on 2018-01-09 with total page 519 pages. Available in PDF, EPUB and Kindle. Book excerpt: Noise Coupling is the root-cause of the majority of Systems on Chip (SoC) product fails. The book discusses a breakthrough substrate coupling analysis flow and modelling toolset, addressing the needs of the design community. The flow provides capability to analyze noise components, propagating through the substrate, the parasitic interconnects and the package. Using this book, the reader can analyze and avoid complex noise coupling that degrades RF and mixed signal design performance, while reducing the need for conservative design practices. With chapters written by leading international experts in the field, novel methodologies are provided to identify noise coupling in silicon. It additionally features case studies that can be found in any modern CMOS SoC product for mobile communications, automotive applications and readout front ends.
Download or read book Substrate Noise written by Edoardo Charbon and published by Springer Science & Business Media. This book was released on 2007-05-08 with total page 178 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the past decade, substrate noise has had a constant and significant impact on the design of analog and mixed-signal integrated circuits. Only recently, with advances in chip miniaturization and innovative circuit design, has substrate noise begun to plague fully digital circuits as well. To combat the effects of substrate noise, heavily over-designed structures are generally adopted, thus seriously limiting the advantages of innovative technologies. Substrate Noise: Analysis and Optimization for IC Design addresses the main problems posed by substrate noise from both an IC and a CAD designer perspective. The effects of substrate noise on performance in digital, analog, and mixed-signal circuits are presented, along with the mechanisms underlying noise generation, injection, and transport. Popular solutions to the substrate noise problem and the trade-offs often debated by designers are extensively discussed. Non-traditional approaches as well as semi-automated techniques to combat substrate noise are also addressed. Substrate Noise: Analysis and Optimization for IC Design will be of interest to researchers and professionals interested in signal integrity, as well as to mixed signal and RF designers.
Download or read book Analysis and Solutions for Switching Noise Coupling in Mixed Signal ICs written by X. Aragones and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 242 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modern microelectronic design is characterized by the integration of full systems on a single die. These systems often include large high performance digital circuitry, high resolution analog parts, high driving I/O, and maybe RF sections. Designers of such systems are constantly faced with the challenge to achieve compatibility in electrical characteristics of every section: some circuitry presents fast transients and large consumption spikes, whereas others require quiet environments to achieve resolutions well beyond millivolts. Coupling between those sections is usually unavoidable, since the entire system shares the same silicon substrate bulk and the same package. Understanding the way coupling is produced, and knowing methods to isolate coupled circuitry, and how to apply every method, is then mandatory knowledge for every IC designer. Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs is an in-depth look at coupling through the common silicon substrate, and noise at the power supply lines. It explains the elementary knowledge needed to understand these phenomena and presents a review of previous works and new research results. The aim is to provide an understanding of the reasons for these particular ways of coupling, review and suggest solutions to noise coupling, and provide criteria to apply noise reduction. Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs is an ideal book, both as introductory material to noise-coupling problems in mixed-signal ICs, and for more advanced designers facing this problem.
Download or read book Analog Circuit Design written by Johan Huijsing and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 410 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume of Analog Circuit Design concentrates on three topics: Volt Electronics; Design and Implementation of Mixed-Mode Systems; Low-Noise and RF Power Amplifiers for Telecommunication. The book comprises six papers on each topic written by internationally recognised experts. These papers are tutorial in nature and together make a substantial contribution to improving the design of analog circuits. The book is divided into three parts: Part I, Volt Electronics, presents some of the circuit design challenges which are having to be met as the need for more electronics on a chip forces smaller transistor dimensions, and thus lower breakdown voltages. The papers cover techniques for 1-Volt electronics. Part II, Design and Implementation of Mixed-Mode Systems, deals with the various problems that are encountered in mixed analog-digital design. In the future, all integrated circuits are bound to contain both digital and analog sub-blocks. Problems such as substrate bounce and other substrate coupling effects cause deterioration in signal integrity. Both aspects of mixed-signal design have been addressed in this section and it illustrates that careful layout techniques embedded in a hierarchical design methodology can allow us to cope with most of the challenges presented by mixed analog-digital design. Part III, Low-noise and RF Power Amplifiers for Telecommunication, focuses on telecommunications systems. In these systems low-noise amplifiers are front-ends of receiver designs. At the transmitter part a high-performance, high-efficiency power amplifier is a critical design. Examples of both system parts are described in this section. Analog Circuit Design is an essential reference source for analog design engineers and researchers wishing to keep abreast with the latest developments in the field. The tutorial nature of the contributions also makes it suitable for use in an advanced course.
Download or read book Wireless Technologies written by Krzysztof Iniewski and published by CRC Press. This book was released on 2017-12-19 with total page 696 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced concepts for wireless technologies present a vision of technology that is embedded in our surroundings and practically invisible. From established radio techniques like GSM, 802.11 or Bluetooth to more emerging technologies, such as Ultra Wide Band and smart dust motes, a common denominator for future progress is the underlying integrated circuit technology. Wireless Technologies responds to the explosive growth of standard cellular radios and radically different wireless applications by presenting new architectural and circuit solutions engineers can use to solve modern design problems. This reference addresses state-of-the art CMOS design in the context of emerging wireless applications, including 3G/4G cellular telephony, wireless sensor networks, and wireless medical application. Written by top international experts specializing in both the IC industry and academia, this carefully edited work uncovers new design opportunities in body area networks, medical implants, satellite communications, automobile radar detection, and wearable electronics. The book is divided into three sections: wireless system perspectives, chip architecture and implementation issues, and devices and technologies used to fabricate wireless integrated circuits. Contributors address key issues in the development of future silicon-based systems, such as scale of integration, ultra-low power dissipation, and the integration of heterogeneous circuit design style and processes onto one substrate. Wireless sensor network systems are now being applied in critical applications in commerce, healthcare, and security. This reference, which contains 25 practical and scientifically rigorous articles, provides the knowledge communications engineers need to design innovative methodologies at the circuit and system level.
Download or read book Substrate Noise written by Edoardo Charbon and published by . This book was released on 2014-01-15 with total page 198 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Noise Coupling in System on Chip written by Thomas Noulis and published by . This book was released on 2017 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: "Noise Coupling is the root-cause of the majority of Systems on Chip (SoC) product fails. The book discusses a breakthrough substrate coupling analysis flow and modelling toolset, addressing the needs of the design community. The flow provides capability to analyze noise components, propagating through the substrate, the parasitic interconnects and the package. Using this book, the reader can analyze and avoid complex noise coupling that degrades RF and mixed signal design performance, while reducing the need for conservative design practices. With chapters written by leading international experts in the field, novel methodologies are provided to identify noise coupling in silicon. It additionally features case studies that can be found in any modern CMOS SoC product for mobile communications, automotive applications and readout front ends."--Provided by publisher.
Download or read book Microwave and Millimeter Wave Circuits and Systems written by Apostolos Georgiadis and published by John Wiley & Sons. This book was released on 2012-09-17 with total page 552 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microwave and Millimeter Wave Circuits and Systems: Emerging Design, Technologies and Applications provides a wide spectrum of current trends in the design of microwave and millimeter circuits and systems. In addition, the book identifies the state-of-the art challenges in microwave and millimeter wave circuits systems design such as behavioral modeling of circuit components, software radio and digitally enhanced front-ends, new and promising technologies such as substrate-integrated-waveguide (SIW) and wearable electronic systems, and emerging applications such as tracking of moving targets using ultra-wideband radar, and new generation satellite navigation systems. Each chapter treats a selected problem and challenge within the field of Microwave and Millimeter wave circuits, and contains case studies and examples where appropriate. Key Features: Discusses modeling and design strategies for new appealing applications in the domain of microwave and millimeter wave circuits and systems Written by experts active in the Microwave and Millimeter Wave frequency range (industry and academia) Addresses modeling/design/applications both from the circuit as from the system perspective Covers the latest innovations in the respective fields Each chapter treats a selected problem and challenge within the field of Microwave and Millimeter wave circuits, and contains case studies and examples where appropriate This book serves as an excellent reference for engineers, researchers, research project managers and engineers working in R&D, professors, and post-graduates studying related courses. It will also be of interest to professionals working in product development and PhD students.
Download or read book Design of High speed Communication Circuits written by Ramesh Harjani and published by World Scientific. This book was released on 2006 with total page 233 pages. Available in PDF, EPUB and Kindle. Book excerpt: MOS technology has rapidly become the de facto standard for mixed-signal integrated circuit design due to the high levels of integration possible as device geometries shrink to nanometer scales. The reduction in feature size means that the number of transistor and clock speeds have increased significantly. In fact, current day microprocessors contain hundreds of millions of transistors operating at multiple gigahertz. Furthermore, this reduction in feature size also has a significant impact on mixed-signal circuits. Due to the higher levels of integration, the majority of ASICs possesses some analog components. It has now become nearly mandatory to integrate both analog and digital circuits on the same substrate due to cost and power constraints. This book presents some of the newer problems and opportunities offered by the small device geometries and the high levels of integration that is now possible. The aim of this book is to summarize some of the most critical aspects of high-speed analog/RF communications circuits. Attention is focused on the impact of scaling, substrate noise, data converters, RF and wireless communication circuits and wireline communication circuits, including high-speed I/O. Contents: Achieving Analog Accuracy in Nanometer CMOS (M P Flynn et al.); Self-Induced Noise in Integrated Circuits (R Gharpurey & S Naraghi); High-Speed Oversampling Analog-to-Digital Converters (A Gharbiya et al.); Designing LC VCOs Using Capacitive Degeneration Techniques (B Jung & R Harjani); Fully Integrated Frequency Synthesizers: A Tutorial (S T Moon et al.); Recent Advances and Design Trends in CMOS Radio Frequency Integrated Circuits (D J Allstot et al.); Equalizers for High-Speed Serial Links (P K Hanumolu et al.); Low-Power, Parallel Interface with Continuous-Time Adaptive Passive Equalizer and Crosstalk Cancellation (C P Yue et al.). Readership: Technologists, scientists, and engineers in the field of high-speed communication circuits. It can also be used as a textbook for graduate and advanced undergraduate courses.
Download or read book Physical Design for 3D Integrated Circuits written by Aida Todri-Sanial and published by CRC Press. This book was released on 2017-12-19 with total page 529 pages. Available in PDF, EPUB and Kindle. Book excerpt: Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
Download or read book Substrate Integrated Suspended Line Circuits and Systems written by Kaixue Ma and published by Artech House. This book was released on 2024-03-31 with total page 305 pages. Available in PDF, EPUB and Kindle. Book excerpt: Substrate Integrated Suspended Line Circuits and Systems provides a systematic overview of the new transmission line - the substrate-integrated suspension line (SISL). It details the fundamentals and classical application examples of the SISL. The basic SISL concept and structure, various passive circuits and active circuits, and front-end sub-systems are systematically introduced. Featuring research on topics such as high-performance RF/microwave/mm-wave circuits and system, this book is ideal for researchers, engineers, scientists, scholars, educators, and students. Since transmission line is a fundamental component of microwave and mm-wave circuits, the properties of a transmission line, such as losses, size, and dispersion, are vital to the performance of the whole system. Suspended line has been proved to be an excellent transmission line, as it has attractive features such as low loss, weak dispersion, high power capacity, and low effective dielectric constant. However, Conventional waveguide suspended line circuits require metal housing to form air cavities which is Substrate Integrated Suspended Line Circuits and Systems essential to the operation of suspended lines circuits. Also, the metal shell should provide mechanical support and shielding, which contribute to large size and heavy weight. Meanwhile, precise mechanical fabrication and assembling are strongly required, which brings difficulties to the design and fabrication of conventional suspended line circuits, and the manufacturing cost of suspended line circuits increases correspondingly. In this book, we will introduce a new platform of high-performance transmission line, i.e. substrate integrated suspended line (SISL). SISL keeps all the merits of the suspended line while overcomes the drawbacks of conventional waveguide suspended line circuits. Moreover, it is self-packaged and highly integrated. The basic SISL concept and structure, various passive circuits and active circuits, and front-end sub-systems will be systematically introduced. Featuring research on topics such as high-performance RF/microwave/mm-wave circuits and system, this book is ideally designed for researchers, engineers, scientists, scholars, educators, and students.
Download or read book Parasitic Substrate Coupling in High Voltage Integrated Circuits written by Pietro Buccella and published by Springer. This book was released on 2018-03-14 with total page 183 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book introduces a new approach to model and predict substrate parasitic failures in integrated circuits with standard circuit design tools. The injection of majority and minority carriers in the substrate is a recurring problem in smart power ICs containing high voltage, high current switching devices besides sensitive control, protection and signal processing circuits. The injection of parasitic charges leads to the activation of substrate bipolar transistors. This book explores how these events can be evaluated for a wide range of circuit topologies. To this purpose, new generalized devices implemented in Verilog-A are used to model the substrate with standard circuit simulators. This approach was able to predict for the first time the activation of a latch-up in real circuits through post-layout SPICE simulation analysis. Discusses substrate modeling and circuit-level simulation of parasitic bipolar device coupling effects in integrated circuits; Includes circuit back-annotation of the parasitic lateral n-p-n and vertical p-n-p bipolar transistors in the substrate; Uses Spice for simulation and characterization of parasitic bipolar transistors, latch-up of the parasitic p-n-p-n structure, and electrostatic discharge (ESD) protection devices; Offers design guidelines to reduce couplings by adding specific protections.
Download or read book Low Power RF Circuit Design in Standard CMOS Technology written by Unai Alvarado and published by Springer Science & Business Media. This book was released on 2011-10-18 with total page 248 pages. Available in PDF, EPUB and Kindle. Book excerpt: Low Power Consumption is one of the critical issues in the performance of small battery-powered handheld devices. Mobile terminals feature an ever increasing number of wireless communication alternatives including GPS, Bluetooth, GSM, 3G, WiFi or DVB-H. Considering that the total power available for each terminal is limited by the relatively slow increase in battery performance expected in the near future, the need for efficient circuits is now critical. This book presents the basic techniques available to design low power RF CMOS analogue circuits. It gives circuit designers a complete guide of alternatives to optimize power consumption and explains the application of these rules in the most common RF building blocks: LNA, mixers and PLLs. It is set out using practical examples and offers a unique perspective as it targets designers working within the standard CMOS process and all the limitations inherent in these technologies.
Download or read book Towards a Modeling Synthesis of Two or Three Dimensional Circuits Through Substrate Coupling and Interconnections Noises and Parasites written by Christian Gontrand and published by Bentham Science Publishers. This book was released on 2014-04-21 with total page 225 pages. Available in PDF, EPUB and Kindle. Book excerpt: The number of transistors in integrated circuits doubles every two years, as stipulated by Moore’s law, and this has been the driving force for the huge development of the microelectronics industry in the past 50 years – currently advanced to the nanometric scale. This e-book is dedicated to electronic noises and parasites, accounting for issues involving substrate coupling and interconnections, in the perspective of the 3D integration: a second track for enhancing integration, also compatible with Moore’s law. This reference explains the modeling of 3D circuits without delving into the latest advances, but highlights crucial problems, for instance electro-thermo-mechanical problems, which could be addressed through 3D modeling. The book also explains electromagnetic interferences , at different modeling levels (device and circuit) oriented towards 3D integration technologies. It also covers substrate noise, such as disturbances of digital blocks, power bounces, phase noise in oscillators, both at the device level, such as carriers or field fluctuations, and circuit levels. The entanglement between interconnect and substrate is also discussed. This e-book serves as a reference for advanced graduates or researchers in the field of micro and nano electronics interested in topics relevant to electromagnetic interference or the ‘noise’ domain, at device or circuit and system levels
