Download or read book Structural Analysis in Microelectronics and Fiber Optic Systems written by and published by . This book was released on 1997 with total page 294 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Structural Analysis in Microelectronics and Fiber Optics 1996 written by Ephraim Suhir and published by . This book was released on 1996 with total page 236 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proceedings of the November 1996 symposium. Contains 18 papers arranged in sections on structural reliability and dynamics, structural analysis of IC packages, solder alloys and joints, and fiber-optic and optoelectronic structures. Specific topics include singular solutions of interfacial stresses
Download or read book Micro and Opto Electronic Materials and Structures Physics Mechanics Design Reliability Packaging written by Ephraim Suhir and published by Springer Science & Business Media. This book was released on 2007-05-26 with total page 1471 pages. Available in PDF, EPUB and Kindle. Book excerpt: This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
Download or read book Modeling and Simulation for Microelectronic Packaging Assembly written by Shen Liu and published by John Wiley & Sons. This book was released on 2011-08-24 with total page 586 pages. Available in PDF, EPUB and Kindle. Book excerpt: Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging
Download or read book Structural Analysis in Microelectronics and Fiber Optics 1997 written by American Society of Mechanical Engineers. Electrical and Electronic Packaging Division and published by Amer Society of Mechanical. This book was released on 1997-01-01 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt: A selection of 16 papers applying theoretical and experimental methods of structural analysis and engineering mechanics to various mechanical, materials, and manufacturing problems in microelectronics and photonics. Among the topics are assessing chip-scale package design options, the experimental e
Download or read book Directory of Published Proceedings written by and published by . This book was released on 2001 with total page 68 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices written by Ephraim Suhir and published by CRC Press. This book was released on 2021-01-28 with total page 344 pages. Available in PDF, EPUB and Kindle. Book excerpt: Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. Describes how to use the developed methods of analytical predictive modeling to minimize thermal stresses and strains in solder joint of IC devices Shows how to build the preprocessing models in finite-element analyses (FEA) by comparing the FEA and analytical data Covers how to design the most effective test vehicles for testing solder joints Details how to design and organize, in addition to or sometimes even instead of highly accelerated life tests (HALT), highly focused and highly cost-effective failure oriented accelerated testing (FOAT) to understand the physic of failure of solder joint interconnections Outlines how to convert the low cycle fatigue conditions into elastic fatigue conditions and to assess the fatigue lifetime in such cases Illustrates ways to replace time- and labor-consuming, expensive, and possibly misleading temperature cycling tests with simpler and physically meaningful accelerated tests This book is aimed towards professionals in electronic and photonic packaging, electronic and optical materials, materials engineering, and mechanical design.
Download or read book Proceedings of the International Conference on Smart Materials Structures and Systems written by and published by Allied Publishers. This book was released on 1999 with total page 762 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings written by and published by . This book was released on 2000 with total page 1796 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Structural Dynamics of Electronic and Photonic Systems written by Ephraim Suhir and published by John Wiley & Sons. This book was released on 2011-04-04 with total page 610 pages. Available in PDF, EPUB and Kindle. Book excerpt: The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer's viewpoint will be conducted to the key components’ level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice.
Download or read book International Journal of Prognostics and Health Management Volume 2 color written by PHM Society and published by Lulu.com. This book was released on 2013-09-24 with total page 151 pages. Available in PDF, EPUB and Kindle. Book excerpt: International Journal of Prognostics and Health Management (IJPHM) was established in 2009 to facilitate archival publication of peer-reviewed results from research and development in the area of PHM. As a journal solely dedicated to the emerging field of PHM IJPHM is the first of its kind and has been a focal point for dissemination of peer-reviewed PHM knowledge. While for the first few years the journal maintained only an online presence, the printed volumes will now be available and can be obtained upon request. IJPHM is dedicated to all aspects of PHM: technical, management, economic, and social. In addition to regular periodic volumes IJPHM also publishes special issues with quality papers dedicated to focused topics.
Download or read book Index of Conference Proceedings written by British Library. Document Supply Centre and published by . This book was released on 2000 with total page 836 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book American Book Publishing Record written by and published by . This book was released on 1998 with total page 1222 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Journal of Electronic Packaging written by and published by . This book was released on 2003 with total page 484 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Moisture Sensitivity of Plastic Packages of IC Devices written by X.J. Fan and published by Springer Science & Business Media. This book was released on 2010-07-23 with total page 573 pages. Available in PDF, EPUB and Kindle. Book excerpt: Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.
Download or read book Analysis and Design Issues for Modern Aerospace Vehicles 1997 written by George J. Simitses and published by . This book was released on 1997 with total page 508 pages. Available in PDF, EPUB and Kindle. Book excerpt: This title compiles the 47 papers from the four separate symposia on structural similitude and size effects, thermo mechanical interaction in structures and materials, sandwich structures, and structural and aero-mechanical research in high-cycle fatigue.
Download or read book Poly 99 written by and published by . This book was released on 1999 with total page 282 pages. Available in PDF, EPUB and Kindle. Book excerpt: The 33 papers from the December 1999 workshop report on current knowledge in the field of mechanics, physics and reliability of polymers, particularly those used in plastic packages of integrated circuit (IC) devices. Topics include fracture and damage investigations enhancing the thermo-mechanical reliability of plastic packages, the effect of polymer material properties on wire bonding to MCMs and advanced copper-low-K ICs, evaluation of the moisture sensitivity of molding compounds of IC packages, the influence of visco-elastic polymeric materials on flexural vibrations, application of the probabilistic approach in thermal stress modeling of packaging, and fiber optic sensor evaluation of epoxy-cured fiber optic connectors. No subject index.
