Download or read book Electrical Performance of Electronic Packaging written by and published by . This book was released on 2004 with total page 372 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Index to IEEE Publications written by Institute of Electrical and Electronics Engineers and published by . This book was released on 1997 with total page 1468 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Modeling and Design of Electromagnetic Compatibility for High Speed Printed Circuit Boards and Packaging written by Xing-Chang Wei and published by CRC Press. This book was released on 2017-09-19 with total page 341 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems. This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.

Download or read book Distributed Transformers for Broadband Monolithic Millimeter Wave Integrated Power Amplifiers written by Pahl, Kai-Philipp Walter and published by KIT Scientific Publishing. This book was released on 2015-09-18 with total page 254 pages. Available in PDF, EPUB and Kindle. Book excerpt: This work presents methods and techniques to optimize and implement distributed magnetic transformers for their application in matching networks of Monolithic Millimeter-wave Integrated Circuits (MMICs). It describes strategies for the efficiency and bandwidth optimization of the transformers and demonstrates their potential based on an optimized transformer geometry as well as two MMIC power amplifiers.

Download or read book The Nystrom Method in Electromagnetics written by Mei Song Tong and published by John Wiley & Sons. This book was released on 2020-08-10 with total page 522 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive, step-by-step reference to the Nyström Method for solving Electromagnetic problems using integral equations Computational electromagnetics studies the numerical methods or techniques that solve electromagnetic problems by computer programming. Currently, there are mainly three numerical methods for electromagnetic problems: the finite-difference time-domain (FDTD), finite element method (FEM), and integral equation methods (IEMs). In the IEMs, the method of moments (MoM) is the most widely used method, but much attention is being paid to the Nyström method as another IEM, because it possesses some unique merits which the MoM lacks. This book focuses on that method—providing information on everything that students and professionals working in the field need to know. Written by the top researchers in electromagnetics, this complete reference book is a consolidation of advances made in the use of the Nyström method for solving electromagnetic integral equations. It begins by introducing the fundamentals of the electromagnetic theory and computational electromagnetics, before proceeding to illustrate the advantages unique to the Nyström method through rigorous worked out examples and equations. Key topics include quadrature rules, singularity treatment techniques, applications to conducting and penetrable media, multiphysics electromagnetic problems, time-domain integral equations, inverse scattering problems and incorporation with multilevel fast multiple algorithm. Systematically introduces the fundamental principles, equations, and advantages of the Nyström method for solving electromagnetic problems Features the unique benefits of using the Nyström method through numerical comparisons with other numerical and analytical methods Covers a broad range of application examples that will point the way for future research The Nystrom Method in Electromagnetics is ideal for graduate students, senior undergraduates, and researchers studying engineering electromagnetics, computational methods, and applied mathematics. Practicing engineers and other industry professionals working in engineering electromagnetics and engineering mathematics will also find it to be incredibly helpful.

Download or read book New Materials and Devices Enabling 5G Applications and Beyond written by Nadine Collaert and published by Elsevier. This book was released on 2024-01-24 with total page 369 pages. Available in PDF, EPUB and Kindle. Book excerpt: New Materials and Devices for 5G Applications and Beyond focuses on the materials, device architectures and enabling integration schemes for 5G applications and emerging technologies. It gives a comprehensive overview of the trade-offs, challenges and unique properties of novel upcoming technologies. Starting from the application side and its requirements, the book examines different technologies under consideration for the different functions, both more conventional to exploratory, and within this context the book provides guidance to the reader on how to possibly optimize the system for a particular application. This book aims at guiding the reader through the technologies required to enable 5G applications, with the main focus on mm-wave frequencies, up to THz. New Materials and Devises for 5G Applications and Beyond is suitable for industrial researchers and development engineers, and researchers in materials science, device engineering and circuit design. - Reviews challenges and emerging opportunities for materials, devices, and integration to enable 5G technologies - Includes discussion of technologies such as RF-MEMs, RF FINFETs, and transistors based on current and emerging materials (InP, GaN, etc.) - Focuses on mm-wave frequencies up to the terahertz regime

Download or read book Compound Semiconductor Integrated Circuits written by Tho T. Vu and published by World Scientific. This book was released on 2003-01-01 with total page 366 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is the book version of a special issue of the International Journal of High Speed Electronics and Systems, reviewing recent work in the field of compound semiconductor integrated circuits. There are fourteen invited papers covering a wide range of applications, frequencies and materials. These papers deal with digital, analog, microwave and millimeter-wave technologies, devices and integrated circuits for wireline fiber-optic lightwave transmissions, and wireless radio-frequency microwave and millimeter-wave communications. In each case, the market is young and experiencing rapid growth for both commercial and millitary applications. Many new semiconductor technologies compete for these new markets, leading to an alphabet soup of semiconductor materials described in these papers. The book also includes three papers focused on radiation effects and reliability in III-V semiconductor electronics, which are useful for reference and future directions. Moreover, reliability is covered in several papers separately for certain process technologies. Contents: Present and Future of High-Speed Compound Semiconductor IC''s (T Otsuji); The Transforming MMIC (E J Martinez); Distributed Amplifier for Fiber-Optic Communication Systems (H Shigematsu et al.); Microwave GaN-Based Power Transistors on Large-Scale Silicon Wafers (S Manohar et al.); Radiation Effects in High Speed III-V Integrated Circuits (T R Weatherford); Radiation Effects in III-V Semiconductor Electronics (B D Weaver et al.); Reliability and Radiation Hardness of Compound Semiconductors (S A Kayali & A H Johnston); and other papers. Readership: Engineers, scientists and graduate students working on high speed electronics and systems, and in the area of compound semiconductor integrated circuits.

Download or read book Transient Signals on Transmission Lines written by Andrew Peterson and published by Springer Nature. This book was released on 2022-06-01 with total page 143 pages. Available in PDF, EPUB and Kindle. Book excerpt: This lecture provides an introduction to transmission line effects in the time domain. Fundamentals including time of flight, impedance discontinuities, proper termination schemes, nonlinear and reactive loads, and crosstalk are considered. Required prerequisite knowledge is limited to conventional circuit theory. The material is intended to supplement standard textbooks for use with undergraduate students in electrical engineering or computer engineering. The contents should also be of value to practicing engineers with interests in signal integrity and high-speed digital design. Table of Contents: Introduction / Solution of the Transmission Line Equations / DC Signals on a Resistively Loaded Transmission Line / Termination Schemes / Equivalent Circuits, Cascaded Lines, and Fan-Outs / Initially-Charged Transmission Lines / Finite Duration Pulses on Transmission Lines / Transmission Lines with Reactive Terminations / Lines with Nonlinear Loads / Crosstalk on Weakly Coupled Transmission Lines

Download or read book RF Technologies for Low Power Wireless Communications written by Tatsuo Itoh and published by John Wiley & Sons. This book was released on 2004-04-07 with total page 482 pages. Available in PDF, EPUB and Kindle. Book excerpt: A survey of microwave technology tailored for professionals in wireless communications RF Technologies for Low Power Wireless Communications updates recent developments in wireless communications from a hardware design standpoint and offers specialized coverage of microwave technology with a focus on the low power wireless units required in modern wireless systems. It explores results of recent research that focused on a holistic, integrated approach to the topics of materials, devices, circuits, modulation, and architectures rather than the more traditional approach of research into isolated topical areas. Twelve chapters deal with various fundamental research aspects of low power wireless electronics written by world-class experts in each field. The first chapter offers an overview of wireless architecture and performance, followed by detailed coverage of: Advanced GaAs-based HBT designs InP-based devices and circuits Si/SiGe HBT technology Noise in GaN devices Power amplifier architectures and nonlinearities Planar-oriented components MEMS and micromachined components Resonators, filters, and low-noise oscillators Antennas Transceiver front-end architectures With a clear focus and expert contributors, RF Technologies for Low Power Wireless Communications will be of interest to a wide range of electrical engineering disciplines working in wireless technologies.

Download or read book Silicon organic hybrid electro optic modulators for high speed communication systems written by Zwickel, Heiner and published by KIT Scientific Publishing. This book was released on 2024-04-09 with total page 196 pages. Available in PDF, EPUB and Kindle. Book excerpt: SOH (silicon-organic hybrid) elektrooptische Modulatoren kombinieren Siliziumphotonik mit organischen elektro-optischen Materialien. Dieses Buch befasst sich mit Aspekten, die speziell für den Einsatz von SOH-Modulatoren in praktischen optischen Hochgeschwindigkeitskommunikationssystemen relevant sind, wie z. B. Aufbau- und Verbindungstechnik, Modellierung und die Implementierung effizienter Modulationsformate für IM/DD-Formate. - Silicon-organic hybrid (SOH) electro-optic modulators combining silicon photonic structures with organic EO materials are investigated. This book addresses aspects that are specifically relevant for the use of SOH modulators in practical high-speed optical communication systems such as packaging, modelling of the device, and the implementation of efficient intensity-modulation/direct-detection (IM/DD) modulation formats.

Download or read book Electrical Design of Through Silicon Via written by Manho Lee and published by Springer. This book was released on 2014-05-11 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt: Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.

Download or read book Grounds for Grounding written by Elya B. Joffe and published by John Wiley & Sons. This book was released on 2023-01-25 with total page 1220 pages. Available in PDF, EPUB and Kindle. Book excerpt: GROUNDS FOR GROUNDING Gain a comprehensive understanding of all aspects of grounding theory and application in this new, expanded edition Grounding design and installation are crucial to ensure the safety and performance of any electrical or electronic system irrespective of size. Successful grounding design requires a thorough familiarity with theory combined with practical experience with real-world systems. Rarely taught in schools due to its complexity, identifying and implementing the appropriate solution to grounding problems is nevertheless a vital skill in the industrial world for any electrical engineer. In Grounds for Grounding, readers will discover a complete and thorough approach to the topic that blends theory and practice to demonstrate that a few rules apply to many applications. The book provides basic concepts of Electromagnetic Compatibility (EMC) that act as the foundation for understanding grounding theory and its applications. Each avenue of grounding is covered in its own chapter, topics from safety aspects in facilities, lightning, and NEMP to printed circuit board, cable shields, and enclosure grounding, and more. Grounds for Grounding readers will also find: Revised and updated information presented in every chapter New chapters on grounding for generators, uninterruptible power sources (UPSs) New appendices including a grounding design checklist, grounding documentation content, and grounding verification procedures Grounds for Grounding is a useful reference for engineers in circuit design, equipment, and systems, as well as power engineers, platform, and facility designers.

Download or read book Signal Propagation on Interconnects written by Hartmut Grabinski and published by Springer Science & Business Media. This book was released on 1998-10-31 with total page 168 pages. Available in PDF, EPUB and Kindle. Book excerpt: A selection of contributions to a May 1997 workshop, surveying issues in signal propagation on interconnects. Papers report on results dealing with simulation and measurement of noise and radiated emissions on boards, describe ground bounce effects as well as inductance calculations in multilayer packages, discuss timing simulation techniques, and illustrate ways to overcome performance problems. For researchers in chip and package design, circuit design, and signal integrity. No index. Annotation copyrighted by Book News, Inc., Portland, OR

Download or read book High Speed Circuit Board Signal Integrity Second Edition written by Stephen C. Thierauf and published by Artech House. This book was released on 2017-04-30 with total page 321 pages. Available in PDF, EPUB and Kindle. Book excerpt: This thoroughly updated leading-edge circuit design resource offers the knowledge needed to quickly pinpoint transmission problems that can compromise the entire circuit design. This new edition demonstrates how to apply EM theory to solve signal integrity problems with a practical application-oriented approach. Discussing both design and debug issues at gigabit per second data rates, the book serves as a practical reference for projects involving high-speed serial signaling on printed wiring boards. Step-by-step, this book goes from reviewing the essentials of linear circuit theory, to examining practical issues of pulse propagation along lossless and lossy transmission lines. It provides detailed guidelines for crosstalk, attenuation, power supply decoupling, and layer stackup tradeoffs (including pad/antipad tradeoffs). Other key topics include the construction of etched conductors, analysis of return paths and split planes, microstrip and stripline characteristics, and SMT capacitors. Filled with on-the-job-proven examples, this hands-on reference is the book that engineers can turn to time and again to design out and troubleshoot circuit signal loss and impedance problems.

Download or read book Electrical Modeling and Design for 3D System Integration written by Er-Ping Li and published by John Wiley & Sons. This book was released on 2012-03-19 with total page 394 pages. Available in PDF, EPUB and Kindle. Book excerpt: New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures. Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through: The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards An equivalent circuit model of through-silicon vias Metal-oxide-semiconductor capacitance effects of through-silicon vias Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.

Download or read book Power Integrity Modeling and Design for Semiconductors and Systems written by Madhavan Swaminathan and published by Pearson Education. This book was released on 2007-11-19 with total page 599 pages. Available in PDF, EPUB and Kindle. Book excerpt: The First Comprehensive, Example-Rich Guide to Power Integrity Modeling Professionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems. Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the art. Using realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise. The authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications. Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applications. The authors Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists. It will also be valuable to developers building software that helps to analyze high-speed systems.

Download or read book Clocking in Modern VLSI Systems written by Thucydides Xanthopoulos and published by Springer Science & Business Media. This book was released on 2009-08-19 with total page 339 pages. Available in PDF, EPUB and Kindle. Book excerpt: . . . ????????????????????????????????? ????????????? ????????????,????? ???? ??????????? ???????????????????? ???. THUCYDIDIS HISTORIAE IV:108 C. Hude ed. , Teubner, Lipsiae MCMXIII ???????????,????? ??,? ????????????????? ???????????????????? ?????? ?????? ?????? ??? ????????? ??? ?’ ?????????? ??’ ?????????? ? ??????? ??? ????????????? ???????. ???????????????????:108 ???????????? ?????????????????????? ?. ?????????????. ????????????,????? It being the fashion of men, what they wish to be true to admit even upon an ungrounded hope, and what they wish not, with a magistral kind of arguing to reject. Thucydides (the Peloponnesian War Part I), IV:108 Thomas Hobbes Trans. , Sir W. Molesworth ed. In The English Works of Thomas Hobbes of Malmesbury, Vol. VIII I have been introduced to clock design very early in my professional career when I was tapped right out of school to design and implement the clock generation and distribution of the Alpha 21364 microprocessor. Traditionally, Alpha processors - hibited highly innovative clocking systems, always worthy of ISSCC/JSSC publi- tions and for a while Alpha processors were leading the industry in terms of clock performance. I had huge shoes to ?ll. Obviously, I was overwhelmed, confused and highly con?dent that I would drag the entire project down.