Download or read book ISSM 2007 written by and published by . This book was released on 2007 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Semiconductor Manufacturing 2007 ISSM 2007 International Symposium on written by Components, Packaging, and Manufacturing Technology Society and published by . This book was released on 2007 with total page 626 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Computational Intelligence and Optimization Methods for Control Engineering written by Maude Josée Blondin and published by Springer Nature. This book was released on 2019-09-20 with total page 355 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume presents some recent and principal developments related to computational intelligence and optimization methods in control. Theoretical aspects and practical applications of control engineering are covered by 14 self-contained contributions. Additional gems include the discussion of future directions and research perspectives designed to add to the reader’s understanding of both the challenges faced in control engineering and the insights into the developing of new techniques. With the knowledge obtained, readers are encouraged to determine the appropriate control method for specific applications.

Download or read book Extending Moore s Law through Advanced Semiconductor Design and Processing Techniques written by Wynand Lambrechts and published by CRC Press. This book was released on 2018-09-13 with total page 345 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a methodological understanding of the theoretical and technical limitations to the longevity of Moore’s law. The book presents research on factors that have significant impact on the future of Moore’s law and those factors believed to sustain the trend of the last five decades. Research findings show that boundaries of Moore’s law primarily include physical restrictions of scaling electronic components to levels beyond that of ordinary manufacturing principles and approaching the bounds of physics. The research presented in this book provides essential background and knowledge to grasp the following principles: Traditional and modern photolithography, the primary limiting factor of Moore’s law Innovations in semiconductor manufacturing that makes current generation CMOS processing possible Multi-disciplinary technologies that could drive Moore's law forward significantly Design principles for microelectronic circuits and components that take advantage of technology miniaturization The semiconductor industry economic market trends and technical driving factors The complexity and cost associated with technology scaling have compelled researchers in the disciplines of engineering and physics to optimize previous generation nodes to improve system-on-chip performance. This is especially relevant to participate in the increased attractiveness of the Internet of Things (IoT). This book additionally provides scholarly and practical examples of principles in microelectronic circuit design and layout to mitigate technology limits of previous generation nodes. Readers are encouraged to intellectually apply the knowledge derived from this book to further research and innovation in prolonging Moore’s law and associated principles.

Download or read book Fabless Semiconductor Manufacturing written by Chinmay K. Maiti and published by CRC Press. This book was released on 2022-11-17 with total page 314 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book deals with 3D nanodevices such as nanowire and nanosheet transistors at 7 nm and smaller technology nodes. It discusses technology computer-aided design (TCAD) simulations of stress- and strain-engineered advanced semiconductor devices, including III-nitride and RF FDSOI CMOS, for flexible and stretchable electronics. The book focuses on how to set up 3D TCAD simulation tools, from mask layout to process and device simulation, including fabless intelligent manufacturing. The simulation examples chosen are from the most popular devices in use today and provide useful technology and device physics insights. In order to extend the role of TCAD in the More-than-Moore era, the design issues related to strain engineering for flexible and stretchable electronics have been introduced for the first time.

Download or read book Advances in Laser Materials Processing written by Jonathan R. Lawrence and published by Elsevier. This book was released on 2010-07-27 with total page 865 pages. Available in PDF, EPUB and Kindle. Book excerpt: Because of its capacity for continuous development and flexibility of use, the laser has become a mainstream manufacturing tool in many industrial sectors. This timely book relays the state-of-the-art in laser materials processing technology and applications and likely advances to be made from current research taking place around the world. The book also promotes appreciation for laser applications in a variety of industrial sectors. After two introductory chapters, the book reviews the main areas of laser processing. Starting with laser cutting and machining, the book discusses laser welding, annealing and hardening. It then considers surface treatment, coating and materials deposition as well as other engineering techniques such as peening and net-shape engineering, before discussing laser micro and nano-fabrication techniques. The book concludes by looking at modelling and process control. With its distinguished editorial team and contributions from renowned researchers working in every corner of the globe, Advances in laser materials processing provides a comprehensive yet detailed coverage of the many topics that comprise the field of laser materials processing. It provides a reference source for the scientists and engineers in such areas as metals processing and microelectronics, as well those conducting laser materials processing research in either academia or industry. A comprehensive practitioner guide and reference work explaining state-of-the-art laser processing technologies in manufacturing and other disciplines Explores the challenges, potential and future directions through the continuous development of new, application-specific lasers in materials processing Discusses coatings and material deposition with lasers with including the production of coatings by laser-assisted processes, laser direct metal deposition and laser induced forward transfer (LIFT)

Download or read book Handbook for Cleaning for Semiconductor Manufacturing written by Karen A. Reinhardt and published by John Wiley & Sons. This book was released on 2011-04-12 with total page 596 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides an In-depth discussion of surface conditioning for semiconductor applications The Handbook of Cleaning for Semiconductor Manufacturing: Fundamentals and Applications provides an in-depth discussion of surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet processing is reviewed as well as surface and colloidal aspects of cleaning and etching. Topics covered in this new reference include: Front end line (FEOL) and back end of line (BEOL) cleaning applications such as high-k/metal gate post-etch cleaning and pore sealing, high-dose implant stripping and cleaning, and germanium, and silicon passivation Formulation development practices, methodology and a new directions are presented including chemicals used for preventing corrosion of copper lines, cleaning aluminium lines, reclaiming wafers, and water bonding, as well as the filtering and recirculating of chemicals including reuse and recycling Wetting, cleaning, and drying of features, such as high aspect ratio features and hydrophilic surface states, especially how to dry without watermarks, the abilities to wet hydrophobic surfaces and to remove liquid from deep features The chemical reactions and mechanisms of silicon dioxide etching with hydrofluoric acid, particle removal with ammonium hydroxide/hydrogen peroxide mixture, and metal removal with hydrochloric acid The Handbook of Cleaning for Semiconductor Manufacturing: Fundamentals and Applications is a valuable resource for any engineer or manager associated with using or supplying cleaning and contamination free technologies for semiconductor manufacturing. Engineers working for semiconductor manufacturing, capital equipment, chemicals, or other industries that assures cleanliness of chemicals, material, and equipment in the manufacturing area will also find this handbook an indispensible reference.

Download or read book Handbook of Emerging Materials for Semiconductor Industry written by Young Suh Song and published by Springer Nature. This book was released on with total page 930 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Production Scheduling written by Rodrigo Righi and published by BoD – Books on Demand. This book was released on 2012-01-11 with total page 246 pages. Available in PDF, EPUB and Kindle. Book excerpt: Generally speaking, scheduling is the procedure of mapping a set of tasks or jobs (studied objects) to a set of target resources efficiently. More specifically, as a part of a larger planning and scheduling process, production scheduling is essential for the proper functioning of a manufacturing enterprise. This book presents ten chapters divided into five sections. Section 1 discusses rescheduling strategies, policies, and methods for production scheduling. Section 2 presents two chapters about flow shop scheduling. Section 3 describes heuristic and metaheuristic methods for treating the scheduling problem in an efficient manner. In addition, two test cases are presented in Section 4. The first uses simulation, while the second shows a real implementation of a production scheduling system. Finally, Section 5 presents some modeling strategies for building production scheduling systems. This book will be of interest to those working in the decision-making branches of production, in various operational research areas, as well as computational methods design. People from a diverse background ranging from academia and research to those working in industry, can take advantage of this volume.

Download or read book The Sixth International Symposium on Neural Networks ISNN 2009 written by Hongwei Wang and published by Springer Science & Business Media. This book was released on 2009-05-03 with total page 904 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume of Advances in Soft Computing and Lecture Notes in Computer th Science vols. 5551, 5552 and 5553, constitute the Proceedings of the 6 Inter- tional Symposium of Neural Networks (ISNN 2009) held in Wuhan, China during May 26–29, 2009. ISNN is a prestigious annual symposium on neural networks with past events held in Dalian (2004), Chongqing (2005), Chengdu (2006), N- jing (2007) and Beijing (2008). Over the past few years, ISNN has matured into a well-established series of international conference on neural networks and their applications to other fields. Following this tradition, ISNN 2009 provided an a- demic forum for the participants to disseminate their new research findings and discuss emerging areas of research. Also, it created a stimulating environment for the participants to interact and exchange information on future research challenges and opportunities of neural networks and their applications. ISNN 2009 received 1,235 submissions from about 2,459 authors in 29 co- tries and regions (Australia, Brazil, Canada, China, Democratic People's Republic of Korea, Finland, Germany, Hong Kong, Hungary, India, Islamic Republic of Iran, Japan, Jordan, Macao, Malaysia, Mexico, Norway, Qatar, Republic of Korea, Singapore, Spain, Taiwan, Thailand, Tunisia, United Kingdom, United States, Venezuela, Vietnam, and Yemen) across six continents (Asia, Europe, North America, South America, Africa, and Oceania). Based on rigorous reviews by the Program Committee members and reviewers, 95 high-quality papers were selected to be published in this volume.

Download or read book 2009 International Conference on Semiconductor Technology for Ultra Large Scale Integrated Circuits and Thin Film Transistors written by Yue Kuo and published by The Electrochemical Society. This book was released on 2009-07 with total page 350 pages. Available in PDF, EPUB and Kindle. Book excerpt: This issue of ECS Transactions includes 33 papers that were presented at the Second International Conference on Semiconductor Technology for Ultra Large Integrated Circuits and Thin Film Transistors (ULSIC vs. TFT II), held in the Xi¿an Garden Hotel, Xian, China, July 5-10, 2009. This symposium was sponsored by the Engineering Conferences International.

Download or read book Industry 4 1 written by Fan-Tien Cheng and published by John Wiley & Sons. This book was released on 2021-10-26 with total page 562 pages. Available in PDF, EPUB and Kindle. Book excerpt: Industry 4.1 Intelligent Manufacturing with Zero Defects Discover the future of manufacturing with this comprehensive introduction to Industry 4.0 technologies from a celebrated expert in the field Industry 4.1: Intelligent Manufacturing with Zero Defects delivers an in-depth exploration of the functions of intelligent manufacturing and its applications and implementations through the Intelligent Factory Automation (iFA) System Platform. The book’s distinguished editor offers readers a broad range of resources that educate and enlighten on topics as diverse as the Internet of Things, edge computing, cloud computing, and cyber-physical systems. You’ll learn about three different advanced prediction technologies: Automatic Virtual Metrology (AVM), Intelligent Yield Management (IYM), and Intelligent Predictive Maintenance (IPM). Different use cases in a variety of manufacturing industries are covered, including both high-tech and traditional areas. In addition to providing a broad view of intelligent manufacturing and covering fundamental technologies like sensors, communication standards, and container technologies, the book offers access to experimental data through the IEEE DataPort. Finally, it shows readers how to build an intelligent manufacturing platform called an Advanced Manufacturing Cloud of Things (AMCoT). Readers will also learn from: An introduction to the evolution of automation and development strategy of intelligent manufacturing A comprehensive discussion of foundational concepts in sensors, communication standards, and container technologies An exploration of the applications of the Internet of Things, edge computing, and cloud computing The Intelligent Factory Automation (iFA) System Platform and its applications and implementations A variety of use cases of intelligent manufacturing, from industries like flat-panel, semiconductor, solar cell, automotive, aerospace, chemical, and blow molding machine Perfect for researchers, engineers, scientists, professionals, and students who are interested in the ongoing evolution of Industry 4.0 and beyond, Industry 4.1: Intelligent Manufacturing with Zero Defects will also win a place in the library of laypersons interested in intelligent manufacturing applications and concepts. Completely unique, this book shows readers how Industry 4.0 technologies can be applied to achieve the goal of Zero Defects for all product

Download or read book System on Chip 2007 International Symposium on written by and published by . This book was released on 2007 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Semiconductor Process Reliability in Practice written by Zhenghao Gan and published by McGraw Hill Professional. This book was released on 2012-10-06 with total page 623 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proven processes for ensuring semiconductor device reliability Co-written by experts in the field, Semiconductor Process Reliability in Practice contains detailed descriptions and analyses of reliability and qualification for semiconductor device manufacturing and discusses the underlying physics and theory. The book covers initial specification definition, test structure design, analysis of test structure data, and final qualification of the process. Real-world examples of test structure designs to qualify front-end-of-line devices and back-end-of-line interconnects are provided in this practical, comprehensive guide. Coverage includes: Basic device physics Process flow for MOS manufacturing Measurements useful for device reliability characterization Hot carrier injection Gate-oxide integrity (GOI) and time-dependent dielectric breakdown (TDDB) Negative bias temperature instability Plasma-induced damage Electrostatic discharge protection of integrated circuits Electromigration Stress migration Intermetal dielectric breakdown

Download or read book Design Rules in a Semiconductor Foundry written by Eitan N. Shauly and published by CRC Press. This book was released on 2022-11-30 with total page 831 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nowadays over 50% of integrated circuits are fabricated at wafer foundries. This book presents a foundry-integrated perspective of the field and is a comprehensive and up-to-date manual designed to serve process, device, layout, and design engineers. It comprises chapters carefully selected to cover topics relevant for them to deal with their work. The book provides an insight into the different types of design rules (DRs) and considerations for setting new DRs. It discusses isolation, gate patterning, S/D contacts, metal lines, MOL, air gaps, and so on. It explains in detail the layout rules needed to support advanced planarization processes, different types of dummies, and related utilities as well as presents a large set of guidelines and layout-aware modeling for RF CMOS and analog modules. It also discusses the layout DRs for different mobility enhancement techniques and their related modeling, listing many of the dedicated rules for static random-access memory (SRAM), embedded polyfuse (ePF), and LogicNVM. The book also provides the setting and calibration of the process parameters set and describes the 28~20 nm planar MOSFET process flow for low-power and high-performance mobile applications in a step-by-step manner. It includes FEOL and BEOL physical and environmental tests for qualifications together with automotive qualification and design for automotive (DfA). Written for the professionals, the book belongs to the bookshelf of microelectronic discipline experts.

Download or read book 3D Integration for NoC based SoC Architectures written by Abbas Sheibanyrad and published by Springer Science & Business Media. This book was released on 2010-11-08 with total page 280 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.

Download or read book Real Options in Engineering Design Operations and Management written by Harriet Black Nembhard and published by CRC Press. This book was released on 2009-10-27 with total page 258 pages. Available in PDF, EPUB and Kindle. Book excerpt: Given that engineering flexibility can potentially provide a competitive advantage, the question then becomes: Precisely how valuable is this flexibility? However, traditional methods often fail to accurately capture the economic value of investments in an environment of widespread uncertainty and rapid change. The real options method represents th