Download or read book Mechanics of Microelectronics written by G.Q. Zhang and published by Springer Science & Business Media. This book was released on 2006-08-25 with total page 580 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the microelectronics industry essential for current and future development. It aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains important and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.

Download or read book Copper Wire Bonding written by Preeti S Chauhan and published by Springer Science & Business Media. This book was released on 2013-09-20 with total page 254 pages. Available in PDF, EPUB and Kindle. Book excerpt: This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process and reliability concerns due to its material properties. Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation. In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed. The book also discusses best practices and recommendations on the bond process, bond–pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components. In summary, this book: Introduces copper wire bonding technologies Presents copper wire bonding processes Discusses copper wire bonding metallurgies Covers recent advancements in copper wire bonding including the bonding process, equipment changes, bond–pad materials and surface finishes Covers the reliability tests and concerns Covers the current implementation of copper wire bonding in the electronics industry Features 120 figures and tables Copper Wire Bonding is an essential reference for industry professionals seeking detailed information on all facets of copper wire bonding technology.

Download or read book Accelerated Testing written by Wayne B. Nelson and published by John Wiley & Sons. This book was released on 2009-09-25 with total page 626 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Wiley-Interscience Paperback Series consists of selected books that have been made more accessible to consumers in an effort to increase global appeal and general circulation. With these new unabridged softcover volumes, Wiley hopes to extend the lives of these works by making them available to future generations of statisticians, mathematicians, and scientists. ". . . a goldmine of knowledge on accelerated life testing principles and practices . . . one of the very few capable of advancing the science of reliability. It definitely belongs in every bookshelf on engineering." –Dev G. Raheja, Quality and Reliability Engineering International ". . . an impressive book. The width and number of topics covered, the practical data sets included, the obvious knowledge and understanding of the author and the extent of published materials reviewed combine to ensure that this will be a book used frequently." –Journal of the Royal Statistical Society A benchmark text in the field, Accelerated Testing: Statistical Models, Test Plans, and Data Analysis offers engineers, scientists, and statisticians a reliable resource on the effective use of accelerated life testing to measure and improve product reliability. From simple data plots to advanced computer programs, the text features a wealth of practical applications and a clear, readable style that makes even complicated physical and statistical concepts uniquely accessible. A detailed index adds to its value as a reference source.

Download or read book Improving Product Reliability written by Mark A. Levin and published by John Wiley & Sons. This book was released on 2003-05-07 with total page 346 pages. Available in PDF, EPUB and Kindle. Book excerpt: The design and manufacture of reliable products is a major challenge for engineers and managers. This book arms technical managers and engineers with the tools to compete effectively through the design and production of reliable technology products.

Download or read book Failure Modes and Mechanisms in Electronic Packages written by P. Singh and published by Springer Science & Business Media. This book was released on 1997-11-30 with total page 398 pages. Available in PDF, EPUB and Kindle. Book excerpt: With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.

Download or read book Methods in Stream Ecology written by F. Richard Hauer and published by Academic Press. This book was released on 2011-04-27 with total page 894 pages. Available in PDF, EPUB and Kindle. Book excerpt: Methods in Stream Ecology, Second Edition, provides a complete series of field and laboratory protocols in stream ecology that are ideal for teaching or conducting research. This updated edition reflects recent advances in the technology associated with ecological assessment of streams, including remote sensing. In addition, the relationship between stream flow and alluviation has been added, and a new chapter on riparian zones is also included. The book features exercises in each chapter; detailed instructions, illustrations, formulae, and data sheets for in-field research for students; and taxanomic keys to common stream invertebrates and algae. With a student-friendly price, this book is key for all students and researchers in stream and freshwater ecology, freshwater biology, marine ecology, and river ecology. This text is also supportive as a supplementary text for courses in watershed ecology/science, hydrology, fluvial geomorphology, and landscape ecology. - Exercises in each chapter - Detailed instructions, illustrations, formulae, and data sheets for in-field research for students - Taxanomic keys to common stream invertebrates and algae - Link from Chapter 22: FISH COMMUNITY COMPOSITION to an interactive program for assessing and modeling fish numbers

Download or read book Practical Reliability Engineering written by Patrick O'Connor and published by Wiley. This book was released on 1997-02-24 with total page 72 pages. Available in PDF, EPUB and Kindle. Book excerpt: This classic textbook/reference contains a complete integration of the processes which influence quality and reliability in product specification, design, test, manufacture and support. Provides a step-by-step explanation of proven techniques for the development and production of reliable engineering equipment as well as details of the highly regarded work of Taguchi and Shainin. New to this edition: over 75 pages of self-assessment questions plus a revised bibliography and references. The book fulfills the requirements of the qualifying examinations in reliability engineering of the Institute of Quality Assurance, UK and the American Society of Quality Control.

Download or read book Guide to Research Techniques in Neuroscience written by Matt Carter and published by Academic Press. This book was released on 2022-03-26 with total page 416 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modern neuroscience research is inherently multidisciplinary, with a wide variety of cutting edge new techniques to explore multiple levels of investigation. This Third Edition of Guide to Research Techniques in Neuroscience provides a comprehensive overview of classical and cutting edge methods including their utility, limitations, and how data are presented in the literature. This book can be used as an introduction to neuroscience techniques for anyone new to the field or as a reference for any neuroscientist while reading papers or attending talks. - Nearly 200 updated full-color illustrations to clearly convey the theory and practice of neuroscience methods - Expands on techniques from previous editions and covers many new techniques including in vivo calcium imaging, fiber photometry, RNA-Seq, brain spheroids, CRISPR-Cas9 genome editing, and more - Clear, straightforward explanations of each technique for anyone new to the field - A broad scope of methods, from noninvasive brain imaging in human subjects, to electrophysiology in animal models, to recombinant DNA technology in test tubes, to transfection of neurons in cell culture - Detailed recommendations on where to find protocols and other resources for specific techniques - "Walk-through" boxes that guide readers through experiments step-by-step

Download or read book Materials and Reliability Handbook for Semiconductor Optical and Electron Devices written by Osamu Ueda and published by Springer Science & Business Media. This book was released on 2012-09-24 with total page 618 pages. Available in PDF, EPUB and Kindle. Book excerpt: Materials and Reliability Handbook for Semiconductor Optical and Electron Devices provides comprehensive coverage of reliability procedures and approaches for electron and photonic devices. These include lasers and high speed electronics used in cell phones, satellites, data transmission systems and displays. Lifetime predictions for compound semiconductor devices are notoriously inaccurate due to the absence of standard protocols. Manufacturers have relied on extrapolation back to room temperature of accelerated testing at elevated temperature. This technique fails for scaled, high current density devices. Device failure is driven by electric field or current mechanisms or low activation energy processes that are masked by other mechanisms at high temperature. The Handbook addresses reliability engineering for III-V devices, including materials and electrical characterization, reliability testing, and electronic characterization. These are used to develop new simulation technologies for device operation and reliability, which allow accurate prediction of reliability as well as the design specifically for improved reliability. The Handbook emphasizes physical mechanisms rather than an electrical definition of reliability. Accelerated aging is useful only if the failure mechanism is known. The Handbook also focuses on voltage and current acceleration stress mechanisms.

Download or read book Fundamentals of Microsystems Packaging written by Rao Tummala and published by McGraw Hill Professional. This book was released on 2001-05-08 with total page 979 pages. Available in PDF, EPUB and Kindle. Book excerpt: LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. You’ll find: *Full coverage of electrical, mechanical, chemical, and materials aspects of each technology *Easy-to-read schematics and block diagrams *Fundamental approaches to all system issues *Examples of all common configurations and technologies—wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others *Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes *Basics of electrical and reliability testing

Download or read book Semiconductor Device Reliability written by A. Christou and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 571 pages. Available in PDF, EPUB and Kindle. Book excerpt: This publication is a compilation of papers presented at the Semiconductor Device Reliabi lity Workshop sponsored by the NATO International Scientific Exchange Program. The Workshop was held in Crete, Greece from June 4 to June 9, 1989. The objective of the Workshop was to review and to further explore advances in the field of semiconductor reliability through invited paper presentations and discussions. The technical emphasis was on quality assurance and reliability of optoelectronic and high speed semiconductor devices. The primary support for the meeting was provided by the Scientific Affairs Division of NATO. We are indebted to NATO for their support and to Dr. Craig Sinclair, who admin isters this program. The chapters of this book follow the format and order of the sessions of the meeting. Thirty-six papers were presented and discussed during the five-day Workshop. In addi tion, two panel sessions were held, with audience participation, where the particularly controversial topics of bum-in and reliability modeling and prediction methods were dis cussed. A brief review of these sessions is presented in this book.

Download or read book Foldable Flex and Thinned Silicon Multichip Packaging Technology written by John W. Balde and published by Springer Science & Business Media. This book was released on 2003-01-31 with total page 382 pages. Available in PDF, EPUB and Kindle. Book excerpt: Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means. Much of the work in this field has not been widely disseminated other than by papers presented at conferences and workshops. This book is organized to report on the developments in this technology, but with special additional material and emphasis. The intent is to do more than report on present state of the art. It is intended as an advocacy book, pointing out the reasons for 3-D assemblies, the reasons for Silicon-in-a-Package multichip modules, and the commercial availability of the techniques. The contributing authors, all leaders in this technical field, explore the needs, reveal the state of development and production, and point to changes in technology that can bring this technology into wider use for more complex applications. It is an advocacy book in this respect - advocacy for the use of a technology that is already mature, and advocacy for exploring ways to make it even more capable for the future. It will also do more than discuss the present; it will point out the deficiencies of the constructions, the needed availability of good flex material, the use of newer flex materials, such as LCP, and the implications from the use of the Integrated Mesh Power Systems to enhance the capability for future designs. Lastly it will discuss the serious problem of heat removal if multiple microprocessors are included.

Download or read book Frontiers in Materials Rising Stars written by Nicola Maria Pugno and published by Frontiers Media SA. This book was released on 2020-04-17 with total page 687 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Frontiers in Materials Editorial Office team are delighted to present the inaugural “Frontiers in Materials: Rising Stars” article collection, showcasing the high-quality work of internationally recognized researchers in the early stages of their independent careers. All Rising Star researchers featured within this collection were individually nominated by the Journal’s Chief Editors in recognition of their potential to influence the future directions in their respective fields. The work presented here highlights the diversity of research performed across the entire breadth of the materials science and engineering field, and presents advances in theory, experiment and methodology with applications to compelling problems. This Editorial features the corresponding author(s) of each paper published within this important collection, ordered by section alphabetically, highlighting them as the great researchers of the future. The Frontiers in Materials Editorial Office team would like to thank each researcher who contributed their work to this collection. We would also like to personally thank our Chief Editors for their exemplary leadership of this article collection; their strong support and passion for this important, community-driven collection has ensured its success and global impact. Laurent Mathey, PhD Journal Development Manager

Download or read book Materials Processing Fundamentals written by Lifeng Zhang and published by Springer. This book was released on 2016-12-01 with total page 315 pages. Available in PDF, EPUB and Kindle. Book excerpt: This collection provides researchers and industry professionals with complete guidance on the synthesis, analysis, design, monitoring, and control of metals, materials, and metallurgical processes and phenomena. Along with the fundamentals, it covers modeling of diverse phenomena in processes involving iron, steel, non-ferrous metals, and composites. It also goes on to examine second phase particles in metals, novel sensors for hostile-environment materials processes, online sampling and analysis techniques, and models for real-time process control and quality monitoring systems.

Download or read book Optoelectronic Devices written by M Razeghi and published by Elsevier. This book was released on 2004 with total page 602 pages. Available in PDF, EPUB and Kindle. Book excerpt: Tremendous progress has been made in the last few years in the growth, doping and processing technologies of the wide bandgap semiconductors. As a result, this class of materials now holds significant promis for semiconductor electronics in a broad range of applications. The principal driver for the current revival of interest in III-V Nitrides is their potential use in high power, high temperature, high frequency and optical devices resistant to radiation damage. This book provides a wide number of optoelectronic applications of III-V nitrides and covers the entire process from growth to devices and applications making it essential reading for those working in the semiconductors or microelectronics. Broad review of optoelectronic applications of III-V nitrides

Download or read book Sapphire written by Elena R. Dobrovinskaya and published by Springer Science & Business Media. This book was released on 2009-04-21 with total page 493 pages. Available in PDF, EPUB and Kindle. Book excerpt: By the second half of the twentieth century, a new branch of materials science had come into being — crystalline materials research. Its appearance is linked to the emergence of advanced technologies primarily based on single crystals (bulk crystals and films). At the turn of the last century, the impending onset of the “ceramic era” was forecasted. It was believed that ceramics would play a role comparable to that of the Stone or Bronze Ages in the history of civilization. Naturally, such an assumption was hypothetical, but it showed that ceramic materials had evoked keen interest among researchers. Although sapphire traditionally has been considered a gem, it has developed into a material typical of the “ceramic era.” Widening the field of sapphire application necessitated essential improvement of its homogeneity and working characteristics and extension of the range of sapphire products, especially those with stipulated properties including a preset structural defect distribution. In the early 1980s, successful attainment of crystals with predetermined char- teristics was attributed to proper choice of the growth method. At present, in view of the fact that the requirements for crystalline products have become more str- gent, such an approach tends to be insufficient. It is clear that one must take into account the physical–chemical processes that take place during the formation of the real crystal structure, i.e., the growth mechanisms and the nature and causes of crystal imperfections.

Download or read book Revolution of Perovskite written by Narayanasamy Sabari Arul and published by Springer Nature. This book was released on 2020-01-03 with total page 324 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume presents advanced synthesis techniques for fabricating Perovskite materials with enhanced properties for applications such as energy storage devices, photovoltaics, electrocatalysis, electronic devices, photocatalysts, sensing, and biomedical instruments. The book attempts to fill a gap in the published literature and provide a detailed reference on Perovskite materials. This book will be of use to graduate students and academic and industrial researchers in the fields of solid-state chemistry, physics, materials science, and chemical engineering.