Download or read book Robust Design of Microelectronics Assemblies Against Mechanical Shock Temperature and Moisture written by E-H Wong and published by Woodhead Publishing. This book was released on 2015-05-23 with total page 477 pages. Available in PDF, EPUB and Kindle. Book excerpt: Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. Discusses how the reliability of packaging components is a prime concern to electronics manufacturers Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques Includes program files and macros for additional study

Download or read book Robust Design of Microelectronics Assemblies Against Mechanical Shock Temperature and Moisture Effects of Temperature Moisture and Mechanical Driving Forces written by and published by . This book was released on with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Influence of Temperature on Microelectronics and System Reliability written by Pradeep Lall and published by CRC Press. This book was released on 2020-07-09 with total page 332 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The

Download or read book High Temperature Electronics written by F. Patrick McCluskey and published by CRC Press. This book was released on 2018-05-04 with total page 354 pages. Available in PDF, EPUB and Kindle. Book excerpt: The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.

Download or read book Automotive Transmissions written by Yong Chen and published by Springer Nature. This book was released on 2020-07-30 with total page 577 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book introduces readers to the theory, design and applications of automotive transmissions. It covers multiple categories, e.g. AT, AMT, CVT, DCT and transmissions for electric vehicles, each of which has its own configuration and characteristics. In turn, the book addresses the effective design of transmission gear ratios, structures and control strategies, and other topics that will be of particular interest to graduate students, researchers and engineers. Moreover, it includes real-world solutions, simulation methods and testing procedures. Based on the author’s extensive first-hand experience in the field, the book allows readers to gain a deeper understanding of vehicle transmissions.

Download or read book Fundamentals of Geoenvironmental Engineering written by Abdel-Mohsen O. Mohamed and published by Butterworth-Heinemann. This book was released on 2017-10-31 with total page 710 pages. Available in PDF, EPUB and Kindle. Book excerpt: Fundamentals of Geoenvironmental Engineering: Understanding Soil, Water, and Pollutant Interaction and Transport examines soil-water-pollutant interaction, including physico-chemical processes that occur when soil is exposed to various contaminants. Soil characteristics relevant to remedial techniques are explored, providing foundations for the correct process selection. Built upon the authors' extensive experience in research and practice, the book updates and expands the content to include current processes and pollutants. The book discusses propagation of soil pollution and soil characteristics relevant to remedial techniques. Practicing geotechnical and environmental engineers can apply the theory and case studies in the book directly to current projects. The book first discusses the stages of economic development and their connections to the sustainability of the environment. Subsequent chapters cover waste and its management, soil systems, soil-water and soil-pollutant interactions, subsurface transport of pollutants, role of groundwater, nano-, micro- and biologic pollutants, soil characteristics that impact pollution diffusion, and potential remediation processes like mechanical, electric, magnetic, hydraulic and dielectric permittivity of soils. Presents a clear understanding of the propagation of pollutants in soils Identifies the physico-chemical processes in soils Covers emerging pollutants (nano-, micro- and biologic contaminants) Features in-depth coverage of hydraulic, electrical, magnetic and dielectric permittivity characteristics of soils and their impact on remedial technologies

Download or read book NUREG CR written by U.S. Nuclear Regulatory Commission and published by . This book was released on 1977 with total page 48 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Semiconductor Packaging written by Andrea Chen and published by CRC Press. This book was released on 2016-04-19 with total page 216 pages. Available in PDF, EPUB and Kindle. Book excerpt: In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.

Download or read book Materials for Energy Efficiency and Thermal Comfort in Buildings written by Matthew R Hall and published by Elsevier. This book was released on 2010-04-21 with total page 761 pages. Available in PDF, EPUB and Kindle. Book excerpt: Almost half of the total energy produced in the developed world is inefficiently used to heat, cool, ventilate and control humidity in buildings, to meet the increasingly high thermal comfort levels demanded by occupants. The utilisation of advanced materials and passive technologies in buildings would substantially reduce the energy demand and improve the environmental impact and carbon footprint of building stock worldwide. Materials for energy efficiency and thermal comfort in buildings critically reviews the advanced building materials applicable for improving the built environment. Part one reviews both fundamental building physics and occupant comfort in buildings, from heat and mass transport, hygrothermal behaviour, and ventilation, on to thermal comfort and health and safety requirements. Part two details the development of advanced materials and sustainable technologies for application in buildings, beginning with a review of lifecycle assessment and environmental profiling of materials. The section moves on to review thermal insulation materials, materials for heat and moisture control, and heat energy storage and passive cooling technologies. Part two concludes with coverage of modern methods of construction, roofing design and technology, and benchmarking of façades for optimised building thermal performance. Finally, Part three reviews the application of advanced materials, design and technologies in a range of existing and new building types, including domestic, commercial and high-performance buildings, and buildings in hot and tropical climates. This book is of particular use to, mechanical, electrical and HVAC engineers, architects and low-energy building practitioners worldwide, as well as to academics and researchers in the fields of building physics, civil and building engineering, and materials science. Explores improving energy efficiency and thermal comfort through material selection and sustainable technologies Documents the development of advanced materials and sustainable technologies for applications in building design and construction Examines fundamental building physics and occupant comfort in buildings featuring heat and mass transport, hygrothermal behaviour and ventilation

Download or read book Performance of Bio based Building Materials written by Dennis Jones and published by Woodhead Publishing. This book was released on 2017-07-07 with total page 652 pages. Available in PDF, EPUB and Kindle. Book excerpt: Performance of Bio-based Building Materials provides guidance on the use of bio-based building materials (BBBM) with respect to their performance. The book focuses on BBBM currently present on the European market. The state-of-the-art is presented regarding material properties, recommended uses, performance expectancies, testing methodology, and related standards. Chapters cover both ‘old and traditional’ BBBM since quite a few of them are experiencing a comeback on the market. Promising developments that could become commercial in the near future are presented as well. The book will be a valuable reference resource for those working in the bio-based materials research community, architects and agencies dealing with sustainable construction, and graduate students in civil engineering. Takes a unique approach to bio-based materials and presents a broad overview of the topics on relevant areas necessary for application and promotion in construction Contains a general description, notable properties related to performance, and applications Presents standards that are structured according to performance types

Download or read book Food Processing Technology written by P.J. Fellows and published by Elsevier. This book was released on 2009-06-22 with total page 932 pages. Available in PDF, EPUB and Kindle. Book excerpt: The first edition of Food processing technology was quickly adopted as the standard text by many food science and technology courses. This completely revised and updated third edition consolidates the position of this textbook as the best single-volume introduction to food manufacturing technologies available. This edition has been updated and extended to include the many developments that have taken place since the second edition was published. In particular, advances in microprocessor control of equipment, ‘minimal’ processing technologies, functional foods, developments in ‘active’ or ‘intelligent’ packaging, and storage and distribution logistics are described. Technologies that relate to cost savings, environmental improvement or enhanced product quality are highlighted. Additionally, sections in each chapter on the impact of processing on food-borne micro-organisms are included for the first time. Introduces a range of processing techniques that are used in food manufacturing Explains the key principles of each process, including the equipment used and the effects of processing on micro-organisms that contaminate foods Describes post-processing operations, including packaging and distribution logistics

Download or read book Workshop Processes Practices and Materials written by Bruce Black and published by Routledge. This book was released on 2010-10-28 with total page 368 pages. Available in PDF, EPUB and Kindle. Book excerpt: Workshop Processes, Practices and Materials is an ideal introduction to workshop processes, practices and materials for entry-level engineers and workshop technicians. With detailed illustrations throughout and simple, clear language, this is a practical introduction to what can be a very complex subject. It has been significantly updated and revised to include new material on adhesives, protective coatings, plastics and current Health and Safety legislation. It covers all the standard topics, including safe practices, measuring equipment, hand and machine tools, materials and joining methods, making it an indispensable handbook for use both in class and the workshop. Its broad coverage makes it a useful reference book for many different courses worldwide.

Download or read book Failure Modes and Mechanisms in Electronic Packages written by P. Singh and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 391 pages. Available in PDF, EPUB and Kindle. Book excerpt: With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.

Download or read book Automotive Mechatronics written by Konrad Reif and published by Springer. This book was released on 2014-08-25 with total page 549 pages. Available in PDF, EPUB and Kindle. Book excerpt: As the complexity of automotive vehicles increases this book presents operational and practical issues of automotive mechatronics. It is a comprehensive introduction to controlled automotive systems and provides detailed information of sensors for travel, angle, engine speed, vehicle speed, acceleration, pressure, temperature, flow, gas concentration etc. The measurement principles of the different sensor groups are explained and examples to show the measurement principles applied in different types.

Download or read book Advanced Materials for Thermal Management of Electronic Packaging written by Xingcun Colin Tong and published by Springer Science & Business Media. This book was released on 2011-01-05 with total page 633 pages. Available in PDF, EPUB and Kindle. Book excerpt: The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.

Download or read book Semiconductor Laser Engineering Reliability and Diagnostics written by Peter W. Epperlein and published by John Wiley & Sons. This book was released on 2013-01-25 with total page 522 pages. Available in PDF, EPUB and Kindle. Book excerpt: This reference book provides a fully integrated novel approach to the development of high-power, single-transverse mode, edge-emitting diode lasers by addressing the complementary topics of device engineering, reliability engineering and device diagnostics in the same book, and thus closes the gap in the current book literature. Diode laser fundamentals are discussed, followed by an elaborate discussion of problem-oriented design guidelines and techniques, and by a systematic treatment of the origins of laser degradation and a thorough exploration of the engineering means to enhance the optical strength of the laser. Stability criteria of critical laser characteristics and key laser robustness factors are discussed along with clear design considerations in the context of reliability engineering approaches and models, and typical programs for reliability tests and laser product qualifications. Novel, advanced diagnostic methods are reviewed to discuss, for the first time in detail in book literature, performance- and reliability-impacting factors such as temperature, stress and material instabilities. Further key features include: practical design guidelines that consider also reliability related effects, key laser robustness factors, basic laser fabrication and packaging issues; detailed discussion of diagnostic investigations of diode lasers, the fundamentals of the applied approaches and techniques, many of them pioneered by the author to be fit-for-purpose and novel in the application; systematic insight into laser degradation modes such as catastrophic optical damage, and a wide range of technologies to increase the optical strength of diode lasers; coverage of basic concepts and techniques of laser reliability engineering with details on a standard commercial high power laser reliability test program. Semiconductor Laser Engineering, Reliability and Diagnostics reflects the extensive expertise of the author in the diode laser field both as a top scientific researcher as well as a key developer of high-power highly reliable devices. With invaluable practical advice, this new reference book is suited to practising researchers in diode laser technologies, and to postgraduate engineering students.

Download or read book Advanced Concrete Technology 4 written by John Newman and published by Elsevier. This book was released on 2003-08-21 with total page 317 pages. Available in PDF, EPUB and Kindle. Book excerpt: Based on the Institute of Concrete Technology's Advanced Concrete Technology Course, these four volumes are a comprehensive educational and reference resource for the concrete materials technologist. An expert international team of authors from research, academia and industry has been brought together to produce this unique series. Each volume deals with a different aspect of the subject: constituent materials, properties, processes and testing and quality. With worked examples, case studies and illustrations throughout, the books will be a key reference for the concrete specialist for years to come. Expert international authorship ensures the series is authoritative Case studies and worked examples help the reader apply their knowledge to practice Comprehensive coverage of the subject gives the reader all the necessary reference material