Download or read book Robust Design of Microelectronics Assemblies Against Mechanical Shock Temperature and Moisture written by E-H Wong and published by Woodhead Publishing. This book was released on 2015-05-23 with total page 477 pages. Available in PDF, EPUB and Kindle. Book excerpt: Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. Discusses how the reliability of packaging components is a prime concern to electronics manufacturers Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques Includes program files and macros for additional study
Download or read book Robust Design of Microelectronics Assemblies Against Mechanical Shock Temperature and Moisture Effects of Temperature Moisture and Mechanical Driving Forces written by and published by . This book was released on with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Cyber Physical Systems Design and Application for Industry 4 0 written by Alla G. Kravets and published by Springer Nature. This book was released on 2021-03-25 with total page 440 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book consists of chapters dedicated to the questions of cyber-physical system design and its usage for the chemical industry and new material design. Also, the contribution of the book covers scientific research and their results for cyber-physical systems design and application in the energy domain and solutions regarding engineering education for cyber-physical systems design. The book offers unique content for researchers and practitioners who are looking for new knowledge and skills in the framework of Industry 4.0 solutions. The book also benefits researchers and practitioners in chemistry and new material design and manufacturing to understand how cyber-physical systems can be applied to increase efficiency and performance. The target audience of the book are practitioners, enterprises representatives, scientists, Ph.D. and master students who perform scientific research or applications of cyber-physical systems in the concept of Industry 4.0.
Download or read book Road To Scientific Success The Inspiring Life Stories Of Prominent Researchers Volume 3 written by Deborah D L Chung and published by World Scientific. This book was released on 2023-05-12 with total page 238 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book is unique in its emphasis on the road to scientific success rather than the science itself. Scientists communicate much on their science through research publications, but they tend to talk much less, if at all, on the challenges encountered on the road to success. Information on the road to scientific success is helpful to people that are considering embarking on the journey on this road or are in the middle of the journey on this road. These people need inspiration and encouragement. Unless the information is recorded, it would be lost.The objectives of this book series are to:
Download or read book Proceedings of the International Symposium on Microelectronics written by and published by . This book was released on 1997 with total page 740 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 1997 International Symposium on Microelectronics written by and published by International Society for Hybrid Microelectronics. This book was released on 1997 with total page 738 pages. Available in PDF, EPUB and Kindle. Book excerpt: Contains the proceedings of IMAPS '97 in Adobe portable document format (PDF).
Download or read book Mechanics of Microelectronics written by G.Q. Zhang and published by Springer Science & Business Media. This book was released on 2006-08-25 with total page 580 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the microelectronics industry essential for current and future development. It aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains important and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.
Download or read book Semiconductor Packaging written by Andrea Chen and published by CRC Press. This book was released on 2016-04-19 with total page 216 pages. Available in PDF, EPUB and Kindle. Book excerpt: In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
Download or read book Workshop Processes Practices and Materials written by Bruce Black and published by Routledge. This book was released on 2010-10-28 with total page 368 pages. Available in PDF, EPUB and Kindle. Book excerpt: Workshop Processes, Practices and Materials is an ideal introduction to workshop processes, practices and materials for entry-level engineers and workshop technicians. With detailed illustrations throughout and simple, clear language, this is a practical introduction to what can be a very complex subject. It has been significantly updated and revised to include new material on adhesives, protective coatings, plastics and current Health and Safety legislation. It covers all the standard topics, including safe practices, measuring equipment, hand and machine tools, materials and joining methods, making it an indispensable handbook for use both in class and the workshop. Its broad coverage makes it a useful reference book for many different courses worldwide.
Download or read book Lead Free Electronic Solders written by KV Subramanian and published by Springer Science & Business Media. This book was released on 2007-06-28 with total page 370 pages. Available in PDF, EPUB and Kindle. Book excerpt: Even though the effect of lead contamination on human health has been known for decades, very little attention has been paid to lead-based solders used in electronics until recently. This comprehensive book examines all the important issues associated with lead-free electronic solder. It collects the work of researchers recognized for their significant scientific contributions in the area.
Download or read book High Temperature Electronics written by F. Patrick McCluskey and published by CRC Press. This book was released on 2018-05-04 with total page 279 pages. Available in PDF, EPUB and Kindle. Book excerpt: The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
Download or read book Automotive Transmissions written by Yong Chen and published by Springer Nature. This book was released on 2020-07-30 with total page 577 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book introduces readers to the theory, design and applications of automotive transmissions. It covers multiple categories, e.g. AT, AMT, CVT, DCT and transmissions for electric vehicles, each of which has its own configuration and characteristics. In turn, the book addresses the effective design of transmission gear ratios, structures and control strategies, and other topics that will be of particular interest to graduate students, researchers and engineers. Moreover, it includes real-world solutions, simulation methods and testing procedures. Based on the author’s extensive first-hand experience in the field, the book allows readers to gain a deeper understanding of vehicle transmissions.
Download or read book Materials and Processes written by Barrie D. Dunn and published by Springer. This book was released on 2015-12-29 with total page 677 pages. Available in PDF, EPUB and Kindle. Book excerpt: The objective of this book is to assist scientists and engineers select the ideal material or manufacturing process for particular applications; these could cover a wide range of fields, from light-weight structures to electronic hardware. The book will help in problem solving as it also presents more than 100 case studies and failure investigations from the space sector that can, by analogy, be applied to other industries. Difficult-to-find material data is included for reference. The sciences of metallic (primarily) and organic materials presented throughout the book demonstrate how they can be applied as an integral part of spacecraft product assurance schemes, which involve quality, material and processes evaluations, and the selection of mechanical and component parts. In this successor edition, which has been revised and updated, engineering problems associated with critical spacecraft hardware and the space environment are highlighted by over 500 illustrations including micrographs and fractographs. Space hardware captured by astronauts and returned to Earth from long durations in space are examined. Information detailed in the Handbook is applicable to general terrestrial applications including consumer electronics as well as high reliability systems associated with aeronautics, medical equipment and ground transportation. This Handbook is also directed to those involved in maximizing the relia bility of new materials and processes for space technology and space engineering. It will be invaluable to engineers concerned with the construction of advanced structures or mechanical and electronic sub-systems.
Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2016-11-18 with total page 974 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Download or read book NUREG CR written by U.S. Nuclear Regulatory Commission and published by . This book was released on 1977 with total page 48 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Solder Joint Reliability written by John H. Lau and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 649 pages. Available in PDF, EPUB and Kindle. Book excerpt: Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.
Download or read book Reliability Engineering written by Kailash C. Kapur and published by John Wiley & Sons. This book was released on 2014-03-21 with total page 528 pages. Available in PDF, EPUB and Kindle. Book excerpt: An Integrated Approach to Product Development Reliability Engineering presents an integrated approach to the design, engineering, and management of reliability activities throughout the life cycle of a product, including concept, research and development, design, manufacturing, assembly, sales, and service. Containing illustrative guides that include worked problems, numerical examples, homework problems, a solutions manual, and class-tested materials, it demonstrates to product development and manufacturing professionals how to distribute key reliability practices throughout an organization. The authors explain how to integrate reliability methods and techniques in the Six Sigma process and Design for Six Sigma (DFSS). They also discuss relationships between warranty and reliability, as well as legal and liability issues. Other topics covered include: Reliability engineering in the 21st Century Probability life distributions for reliability analysis Process control and process capability Failure modes, mechanisms, and effects analysis Health monitoring and prognostics Reliability tests and reliability estimation Reliability Engineering provides a comprehensive list of references on the topics covered in each chapter. It is an invaluable resource for those interested in gaining fundamental knowledge of the practical aspects of reliability in design, manufacturing, and testing. In addition, it is useful for implementation and management of reliability programs.
