Download or read book Reliability of Microtechnology written by Johan Liu and published by Springer Science & Business Media. This book was released on 2011-02-07 with total page 216 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail. The book also includes exercises and detailed solutions at the end of each chapter.

Download or read book Reliability of Microtechnology written by Johan Liu and published by . This book was released on 2011-03-30 with total page 220 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Safety and Reliability Methodology and Applications written by Tomasz Nowakowski and published by CRC Press. This book was released on 2014-09-01 with total page 408 pages. Available in PDF, EPUB and Kindle. Book excerpt: Within the last fifty years the performance requirements for technical objects and systems were supplemented with: customer expectations (quality), abilities to prevent the loss of the object properties in operation time (reliability and maintainability), protection against the effects of undesirable events (safety and security) and the ability to

Download or read book Failures and the Law written by H.P. Rossmanith and published by Routledge. This book was released on 2003-09-02 with total page 584 pages. Available in PDF, EPUB and Kindle. Book excerpt: The interaction between engineering and the law is undergoing dramatic changes. Product liability, laws have been introduced in Japan, patent claims over living organisms have been made in bioengineering and the differing national laws of copyright protection and liability are in the process of harmonisation, especially in the European Union. The pace and complexity of these changes make it essential for technologists, lawyers, engineers and insurance experts to establish a common basis for understanding, co-operation and exchange of expertise. The recently founded International Society for Technology, Law and Insurance aims to foster such co-operation. This volume features 46 selected contributions which address various topical issues and the law. The most important issues relate to engineering risks, quality assurance and assessment and legal implications assiciated with them. Recent failure cases are explained and the technical, legal and insurance-related issues discussed in detail.

Download or read book Microsystems Technology written by Jumana Boussey and published by Elsevier Science & Technology. This book was released on 2003 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Table of contents

Download or read book Testing Reliability and Application of Micro and Nano material Systems written by and published by . This book was released on 2003 with total page 294 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Emerging Nanotechnologies written by and published by . This book was released on 2008 with total page 405 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Lead Free Solders written by Abhijit Kar and published by BoD – Books on Demand. This book was released on 2019-10-02 with total page 96 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides some of the most advanced research observations and in-depth knowledge behind lead-free soldering. Readers will find a description of different cutting-edge techniques used for improving the reliability of interconnects manufacturing. Some of the most unconventional topics covered in this book include solder joint formation for microelectronic devices at room temperature and the possibility of soldering ceramic materials, which is limited due to the poor wettability of ceramic substrates with commercial solders following classical soldering techniques. We also discuss the possibilities of nanoscale preparation of solder joints for bringing down the processing temperature so that it does not affect the packaging technologies. Readers will find that precise, systematic discussion of solder joint formation and its interfacial characterization has been depicted for each technique used in different chapters. This book is of interest to both fundamental researchers and also to practicing scientists and will prove invaluable to all those working in industry and academia.

Download or read book Implications of Emerging Micro and Nanotechnologies written by National Research Council and published by National Academies Press. This book was released on 2003-02-06 with total page 267 pages. Available in PDF, EPUB and Kindle. Book excerpt: Expansion of micro-technology applications and rapid advances in nano-science have generated considerable interest by the Air Force in how these developments will affect the nature of warfare and how it could exploit these trends. The report notes four principal themes emerging from the current technological trends: increased information capability, miniaturization, new materials, and increased functionality. Recommendations about Air Force roles in micro- and nanotechnology research are presented including those areas in which the Air Force should take the lead. The report also provides a number of technical and policy findings and recommendations that are critical for effective development of the Air Force's micro- and nano-science and technology program

Download or read book Interfacial Compatibility in Microelectronics written by Tomi Laurila and published by Springer Science & Business Media. This book was released on 2012-01-13 with total page 221 pages. Available in PDF, EPUB and Kindle. Book excerpt: Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the “traditional” method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced. In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes: solutions to several common reliability issues in microsystem technology, methods to understand and predict failure mechanisms at interfaces between dissimilar materials and an approach to DFR based on deep understanding in materials science, rather than on the use of mechanistic tools, such as FMEA. Interfacial Compatibility in Microelectronics provides a clear and methodical resource for graduates and postgraduates alike.

Download or read book Emerging Nanotechnologies written by Mohammad Tehranipoor and published by Springer Science & Business Media. This book was released on 2007-12-08 with total page 411 pages. Available in PDF, EPUB and Kindle. Book excerpt: Emerging Nanotechnologies: Test, Defect Tolerance and Reliability covers various technologies that have been developing over the last decades such as chemically assembled electronic nanotechnology, Quantum-dot Cellular Automata (QCA), and nanowires and carbon nanotubes. Each of these technologies offers various advantages and disadvantages. Some suffer from high power, some work in very low temperatures and some others need indeterministic bottom-up assembly. These emerging technologies are not considered as a direct replacement for CMOS technology and may require a completely new architecture to achieve their functionality. Emerging Nanotechnologies: Test, Defect Tolerance and Reliability brings all of these issues together in one place for readers and researchers who are interested in this rapidly changing field.

Download or read book Harsh Environment Electronics written by Ahmed Sharif and published by John Wiley & Sons. This book was released on 2019-08-05 with total page 398 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage. Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact. -Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics -Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature -Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications -Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more -A pivotal reference for professionals, engineers, students, and researchers Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.

Download or read book Reliability of MEMS written by Osamu Tabata and published by John Wiley & Sons. This book was released on 2013-03-26 with total page 325 pages. Available in PDF, EPUB and Kindle. Book excerpt: This first book to cover exclusively and in detail the principles, tools and methods for determining the reliability of microelectromechanical materials, components and devices covers both component materials as well as entire MEMS devices. Divided into two major parts, following a general introductory chapter to reliability issues, the first part looks at the mechanical properties of the materials used in MEMS, explaining in detail the necessary measuring technologies -- nanoindenters, bulge methods, bending tests, tensile tests, and others. Part Two treats the actual devices, organized by important device categories such as pressure sensors, inertial sensors, RF MEMS, and optical MEMS.

Download or read book Improving Practice and Performance in Basketball written by Aaron T. Scanlan and published by MDPI. This book was released on 2019-11-18 with total page 106 pages. Available in PDF, EPUB and Kindle. Book excerpt: Despite being one of the most popular sports worldwide, basketball has received limited research attention compared to other team sports. Establishing a strong evidence base with high-quality and impactful research is essential in enhancing decision-making processes to optimize player performance for basketball professionals. Consequently, the book entitled Improving Performance and Practice in Basketball provides a collection of novel research studies to increase the available evidence on various topics with strong translation to practice in basketball. The book includes work by 40 researchers from 16 institutions or professional organizations from 9 countries. In keeping with notable topics in basketball research, the book contains 2 reviews focused on monitoring strategies to detect player fatigue and considerations for travel in National Basketball Association players. In addition, 8 applied studies are also included in the book, focused on workload monitoring, game-related statistics, and the measurement of physical and skill attributes in basketball players. This book also has a strong focus on increasing the evidence available for female basketball players, who have traditionally been under-represented in the literature. The outcomes generated from this book should provide new insights to inform practice in many areas for professionals working in various roles with basketball teams.

Download or read book Component Reliability for Electronic Systems written by Titu I. Băjenescu and published by Artech House. This book was released on 2010 with total page 706 pages. Available in PDF, EPUB and Kindle. Book excerpt: The main reason for the premature breakdown of today's electronic products (computers, cars, tools, appliances, etc.) is the failure of the components used to build these products. Today professionals are looking for effective ways to minimize the degradation of electronic components to help ensure longer-lasting, more technically sound products and systems. This practical book offers engineers specific guidance on how to design more reliable components and build more reliable electronic systems. Professionals learn how to optimize a virtual component prototype, accurately monitor product reliability during the entire production process, and add the burn-in and selection procedures that are the most appropriate for the intended applications. Moreover, the book helps system designers ensure that all components are correctly applied, margins are adequate, wear-out failure modes are prevented during the expected duration of life, and system interfaces cannot lead to failure.

Download or read book Failure Analysis written by Marius Bazu and published by John Wiley & Sons. This book was released on 2011-03-08 with total page 372 pages. Available in PDF, EPUB and Kindle. Book excerpt: Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involved the reasons why failure analysis is an important tool for improving yield and reliability by corrective actions the design stage, highlighting the ‘concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods new challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.

Download or read book Fracture of Nano and Engineering Materials and Structures written by E.E. Gdoutos and published by Springer Science & Business Media. This book was released on 2008-01-08 with total page 1452 pages. Available in PDF, EPUB and Kindle. Book excerpt: The 16th European Conference of Fracture (ECF16) was held in Greece, July, 2006. It focused on all aspects of structural integrity with the objective of improving the safety and performance of engineering structures, components, systems and their associated materials. Emphasis was given to the failure of nanostructured materials and nanostructures including micro- and nano-electromechanical systems (MEMS and NEMS).