Download or read book Recent Advances in Microelectronics Reliability written by Willem Dirk van Driel and published by Springer Nature. This book was released on with total page 405 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Recent Advances in Electrical and Information Technologies for Sustainable Development written by Soumia El Hani and published by Springer. This book was released on 2019-02-08 with total page 208 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book includes the best extended papers which were selected from the 3rd International Conference of Electrical and Information Technologies (ICEIT 2017, Morocco). The book spans two inter-related research domains which shaped modern societies, solved many of their development problems, and contributed to their unprecedented economic growth and social welfare. Selected papers are based on original and high quality research. They were peer reviewed by experts in the field. They are grouped into five parts. Part I deals with Power System and Electronics topics that include Power Electronics & Energy Conversion, Actuators & Micro/Nanotechnology, etc. Part II relates to Control Systems and their applications. Part III concerns the topic of Information Technology that basically includes Smart Grid, Information Security, Cloud Computing Distributed, Big Data, etc. Part IV discusses Telecommunications and Vehicular Technologies topics that include, Green Networking and Communications, Wireless Ad-hoc and Sensor Networks, etc. Part V covers Green Applications and Interdisciplinary topics, that include intelligent and Green Technologies for Transportation Systems, Smart Cities, etc. This book offers a good opportunity for young researchers, novice scholars and whole academic sphere to explore new trends in Electrical and information Technologies.

Download or read book Advances in Microelectronics Approaches in the Millenium written by Ninoslav D. Stojadinović and published by . This book was released on 1997 with total page 120 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Reliability Prediction for Microelectronics written by Joseph B. Bernstein and published by John Wiley & Sons. This book was released on 2024-02-20 with total page 404 pages. Available in PDF, EPUB and Kindle. Book excerpt: RELIABILITY PREDICTION FOR MICROELECTRONICS Wiley Series in Quality & Reliability Engineering REVOLUTIONIZE YOUR APPROACH TO RELIABILITY ASSESSMENT WITH THIS GROUNDBREAKING BOOK Reliability evaluation is a critical aspect of engineering, without which safe performance within desired parameters over the lifespan of machines cannot be guaranteed. With microelectronics in particular, the challenges to evaluating reliability are considerable, and statistical methods for creating microelectronic reliability standards are complex. With nano-scale microelectronic devices increasingly prominent in modern life, it has never been more important to understand the tools available to evaluate reliability. Reliability Prediction for Microelectronics meets this need with a cluster of tools built around principles of reliability physics and the concept of remaining useful life (RUL). It takes as its core subject the ‘physics of failure’, combining a thorough understanding of conventional approaches to reliability evaluation with a keen knowledge of their blind spots. It equips engineers and researchers with the capacity to overcome decades of errant reliability physics and place their work on a sound engineering footing. Reliability Prediction for Microelectronics readers will also find: Focus on the tools required to perform reliability assessments in real operating conditions Detailed discussion of topics including failure foundation, reliability testing, acceleration factor calculation, and more New multi-physics of failure on DSM technologies, including TDDB, EM, HCI, and BTI Reliability Prediction for Microelectronics is ideal for reliability and quality engineers, design engineers, and advanced engineering students looking to understand this crucial area of product design and testing.

Download or read book Reliability Prediction for Microelectronics written by Joseph B. Bernstein and published by John Wiley & Sons. This book was released on 2024-02-13 with total page 404 pages. Available in PDF, EPUB and Kindle. Book excerpt: RELIABILITY PREDICTION FOR MICROELECTRONICS Wiley Series in Quality & Reliability Engineering REVOLUTIONIZE YOUR APPROACH TO RELIABILITY ASSESSMENT WITH THIS GROUNDBREAKING BOOK Reliability evaluation is a critical aspect of engineering, without which safe performance within desired parameters over the lifespan of machines cannot be guaranteed. With microelectronics in particular, the challenges to evaluating reliability are considerable, and statistical methods for creating microelectronic reliability standards are complex. With nano-scale microelectronic devices increasingly prominent in modern life, it has never been more important to understand the tools available to evaluate reliability. Reliability Prediction for Microelectronics meets this need with a cluster of tools built around principles of reliability physics and the concept of remaining useful life (RUL). It takes as its core subject the ‘physics of failure’, combining a thorough understanding of conventional approaches to reliability evaluation with a keen knowledge of their blind spots. It equips engineers and researchers with the capacity to overcome decades of errant reliability physics and place their work on a sound engineering footing. Reliability Prediction for Microelectronics readers will also find: Focus on the tools required to perform reliability assessments in real operating conditions Detailed discussion of topics including failure foundation, reliability testing, acceleration factor calculation, and more New multi-physics of failure on DSM technologies, including TDDB, EM, HCI, and BTI Reliability Prediction for Microelectronics is ideal for reliability and quality engineers, design engineers, and advanced engineering students looking to understand this crucial area of product design and testing.

Download or read book Electrically Conductive Adhesives written by Rajesh Gomatam and published by BRILL. This book was released on 2008-12-23 with total page 434 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is based on two Special Issues of the Journal of Adhesion Science and Technology (JAST vol. 22, no. 8-9 and vol. 22, no. 14) dedicated to the logic of electrically conductive adhesives. The contains a total of 21 papers (reflecting overviews and original research).

Download or read book Advances in Analog Circuits written by Esteban Tlelo-Cuautle and published by BoD – Books on Demand. This book was released on 2011-02-02 with total page 384 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book highlights key design issues and challenges to guarantee the development of successful applications of analog circuits. Researchers around the world share acquired experience and insights to develop advances in analog circuit design, modeling and simulation. The key contributions of the sixteen chapters focus on recent advances in analog circuits to accomplish academic or industrial target specifications.

Download or read book Reliability Yield and Stress Burn In written by Way Kuo and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 407 pages. Available in PDF, EPUB and Kindle. Book excerpt: The international market is very competitive for high-tech manufacturers to day. Achieving competitive quality and reliability for products requires leader ship from the top, good management practices, effective and efficient operation and maintenance systems, and use of appropriate up-to-date engineering de sign tools and methods. Furthermore, manufacturing yield and reliability are interrelated. Manufacturing yield depends on the number of defects found dur ing both the manufacturing process and the warranty period, which in turn determines the reliability. the production of microelectronics has evolved into Since the early 1970's, one of the world's largest manufacturing industries. As a result, an important agenda is the study of reliability issues in fabricating microelectronic products and consequently the systems that employ these products, particularly, the new generation of microelectronics. Such an agenda should include: • the economic impact of employing the microelectronics fabricated by in dustry, • a study of the relationship between reliability and yield, • the progression toward miniaturization and higher reliability, and • the correctness and complexity of new system designs, which include a very significant portion of software.

Download or read book Recent Advances In Data Mining Of Enterprise Data Algorithms And Applications written by Evangelos Triantaphyllou and published by World Scientific. This book was released on 2008-01-15 with total page 816 pages. Available in PDF, EPUB and Kindle. Book excerpt: The main goal of the new field of data mining is the analysis of large and complex datasets. Some very important datasets may be derived from business and industrial activities. This kind of data is known as “enterprise data”. The common characteristic of such datasets is that the analyst wishes to analyze them for the purpose of designing a more cost-effective strategy for optimizing some type of performance measure, such as reducing production time, improving quality, eliminating wastes, or maximizing profit. Data in this category may describe different scheduling scenarios in a manufacturing environment, quality control of some process, fault diagnosis in the operation of a machine or process, risk analysis when issuing credit to applicants, management of supply chains in a manufacturing system, or data for business related decision-making.

Download or read book Dielectric Films for Advanced Microelectronics written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2007-04-04 with total page 508 pages. Available in PDF, EPUB and Kindle. Book excerpt: The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced, high-performance computers, high-definition TV, broadband imaging systems, flat-panel displays, robotic systems, and medical electronics and diagnostics are a few examples of the miniaturized device technologies that depend on the utilization of thin film materials. This book presents an in-depth overview of the novel developments made by the scientific leaders in the area of modern dielectric films for advanced microelectronic applications. It contains clear, concise explanations of material science of dielectric films and their problem for device operation, including high-k, low-k, medium-k dielectric films and also specific features and requirements for dielectric films used in the packaging technology. A broad range of related topics are covered, from physical principles to design, fabrication, characterization, and applications of novel dielectric films.

Download or read book Recent Advances in Experimental Mechanics written by Isaac M. Daniel and published by Springer Science & Business Media. This book was released on 2002-06-30 with total page 834 pages. Available in PDF, EPUB and Kindle. Book excerpt: This state-of-the-art volume covers a wide range of subjects in experimental mechanics including optical methods of stress analysis (photoelasticity, moirè, etc.), composite materials, sandwich construction, fracture mechanics, fatigue and damage, nondestructive evaluation, dynamic problems, foam, materials, fiber optic sensors, speckle metrology, digital image processing, nanotechnology, neutron diffraction and synchrotron radiation methods. Written by leading scientists in the field, the book contains 71 papers presented at the Symposium on "Recent Advances in Experimental Mechanics", which was organized in honor of Professor I.M. Daniel at Virginia Tech, on June 23-28, 2002. The book presents a thorough review of the latest problems of experimental mechanics. It is a vital supplement and reference source for researchers, practicing engineers and students.

Download or read book Microcircuit Reliability Bibliography written by and published by . This book was released on 1978 with total page 412 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Direct Copper Interconnection for Advanced Semiconductor Technology written by Dongkai Shangguan and published by CRC Press. This book was released on 2024-06-28 with total page 463 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.

Download or read book Progress in Adhesion and Adhesives Volume 2 written by K. L. Mittal and published by John Wiley & Sons. This book was released on 2017-06-15 with total page 474 pages. Available in PDF, EPUB and Kindle. Book excerpt: With the ever-increasing amount of research being published it is a Herculean task to be fully conversant with the latest research developments in any field, and the arena of adhesion and adhesives is no exception. Thus, topical review articles provide an alternate and very efficient way to stay abreast of the state-of-the-art in may subjects representing the field of adhesion science and adheisves. Based on the success and the warm reception accorded to the premier volume in this series “Progress in Adhesion and Adhesives” (containing the review articles published in Volume 2 (2014) of the journal Reviews of Adhesion and Adhesives (RAA)), volume 2 comprises 14 review articles published in Volume 4 (2016) of RAA. The subjects of these 14 reviews fall into the following general areas: 1. Surface modification of polymers for a variety of purposes. 2. Adhesion aspects in reinforced composites 3. Thin films/coatings and their adhesion measurement 4. Bioadhesion and bio-implants 5. Adhesives and adhesive joints 6. General adhesion aspects The topics covered include: surface modification of natural fibers for reinforced polymer composites; adhesion of submicrometer thin metals films; surface treatments to modulate bioadhesion; hot-melt adhesives from renewable resources; particulate-polymer composites; functionally graded adhesively bonded joints; fabrication of nano-biodevices; effects of particulates on contact angles , thermal stresses in adhesively bonded joints and ways to mitigate these; laser-assisted electroless metallization of polymer materials; adhesion measurement of coatings on biodevices/implants; cyanoacrylate adhesives; and adhesion of green flame retardant coatings onto polyolefins.

Download or read book Electronics Reliability and Measurement Technology written by Joseph S. Heyman and published by Elsevier. This book was released on 1998-12-31 with total page 145 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book examines electronics reliability and measurement technology. It identifies advances in measurement science and technology for nondestructive evaluation, and it details common measurement trouble spots.

Download or read book Space Transportation Avionics Technology Symposium written by and published by . This book was released on 1990 with total page 860 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book New Advances in Mechanisms Mechanical Transmissions and Robotics written by Erwin-Christian Lovasz and published by Springer Nature. This book was released on 2020-10-14 with total page 569 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume gathers the proceedings of the Joint International Conference of the XIII International Conference on Mechanisms and Mechanical Transmissions (MTM) and the XXIV International Conference on Robotics (Robotics), held in Timişoara, Romania. It addresses the applications of mechanisms and transmissions in several modern technical fields such as mechatronics, biomechanics, machines, micromachines, robotics and apparatus. In doing so, it combines theoretical findings and experimental testing. The book presents peer-reviewed papers written by researchers specialized in mechanism analysis and synthesis, dynamics of mechanisms and machines, mechanical transmissions, biomechanics, precision mechanics, mechatronics, micromechanisms and microactuators, computational and experimental methods, CAD in mechanism and machine design, mechanical design of robot architecture, parallel robots, mobile robots, micro and nano robots, sensors and actuators in robotics, intelligent control systems, biomedical engineering, teleoperation, haptics, and virtual reality.