Download or read book Rapid thermal processing and self aligned silicide technology for VLSI application written by Yen-Hui Ku and published by . This book was released on 1988 with total page 212 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Rapid Thermal Processing written by Richard B. Fair and published by Academic Press. This book was released on 2012-12-02 with total page 441 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is the first definitive book on rapid thermal processing (RTP), an essential namufacturing technology for single-wafer processing in highly controlled environments. Written and edited by nine experts in the field, this book covers a range of topics for academics and engineers alike, moving from basic theory to advanced technology for wafer manufacturing. The book also provides new information on the suitability or RTP for thin film deposition, junction formation, silicides, epitaxy, and in situ processing. Complete discussions on equipment designs and comparisons between RTP and other processing approaches also make this book useful for supplemental information on silicon processing, VLSI processing, and integrated circuit engineering.

Download or read book Reduced Thermal Processing for ULSI written by R.A. Levy and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 444 pages. Available in PDF, EPUB and Kindle. Book excerpt: As feature dimensions of integrated circuits shrink, the associated geometrical constraints on junction depth impose severe restrictions on the thermal budget for processing such devices. Furthermore, due to the relatively low melting point of the first aluminum metallization level, such restrictions extend to the fabrication of multilevel structures that are now essential in increasing packing density of interconnect lines. The fabrication of ultra large scale integrated (ULSI) devices under thermal budget restrictions requires the reassessment of existing and the development of new microelectronic materials and processes. This book addresses three broad but interrelated areas. The first area focuses on the subject of rapid thermal processing (RTP), a technology that allows minimization of processing time while relaxing the constraints on high temperature. Initially developed to limit dopant redistribution, current applications of RTP are shown here to encompass annealing, oxidation, nitridation, silicidation, glass reflow, and contact sintering. In a second but complementary area, advances in equipment design and performance of rapid thermal processing equipment are presented in conjunction with associated issues of temperature measurement and control. Defect mechanisms are assessed together with the resulting properties of rapidly deposited and processed films. The concept of RTP integration for a full CMOS device process is also examined together with its impact on device characteristics.

Download or read book ULSI Science and Technology 1987 written by S. Broydo and published by . This book was released on 1987 with total page 874 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Rapid Thermal Processing and beyond Applications in Semiconductor Processing written by Wielfried Lerch and published by Trans Tech Publications Ltd. This book was released on 2008-03-24 with total page 448 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heat-treatment and thermal annealing are very common processing steps which have been employed during semiconductor manufacturing right from the beginning of integrated circuit technology. In order to minimize undesired diffusion, and other thermal budget-dependent effects, the trend has been to reduce the annealing time sharply by switching from standard furnace batch-processing (involving several hours or even days), to rapid thermal processing involving soaking times of just a few seconds. This transition from thermal equilibrium, to highly non-equilibrium, processing was very challenging and is still a field ripe for further development.

Download or read book ULSI Technology written by C. Y. Chang and published by McGraw-Hill Science, Engineering & Mathematics. This book was released on 1996 with total page 756 pages. Available in PDF, EPUB and Kindle. Book excerpt: "This text follows the tradition of Sze's highly successful pioneering text on VLSI technology and is updated with the latest advances in the field of microelectronic chip fabrication. Since computer chips are foundations of modern electronics, these topics are essential for the next generation of USLI technologies, allowing more transistors to be packaged on a single chip. Contributing to each chapter are industry experts, specializing in topics such as epitaxy with low temperature process, rapid thermal processes, low damage plasma reactive ion etching, fine line litography, cleaning technology, clean room technology, packing and reliability."--

Download or read book 1989 International Symposium on VLSI Technology Systems and Applications written by and published by . This book was released on 1989 with total page 412 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Proceedings of the Symposium on Reduced Temperature Processing for VLSI written by Rafael Reif and published by . This book was released on 1986 with total page 634 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Silicon Components and Processes Self Study written by Badih El-Kareh and published by Springer Nature. This book was released on 2024 with total page 637 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is one of a series of five volumes forming an integrated, self-study course on silicon device physics, modes of operation, characterization, and fabrication. The series is based on many years of the author’s experience in academic and industrial teaching of semiconductors. The books are suitable for both class-teaching and self-study. The authors have designed the content to enable readers to be introduced gradually to semiconductors, in particular silicon components. The presentation includes many illustrations, practical examples, review questions and problems at the end of each chapter. Answers to review questions and solutions to problems will be provided for “self-check”. Complements courses covering silicon device physics, mode of components, characterization, and fabrication; Enables comprehensive, self-study in semiconductors, aimed at practicing engineers or university students; Includes many illustrations, practical examples, review questions and problems at the end of each chapter.

Download or read book ULSI Science and Technology 1989 written by C. M. Osburn and published by . This book was released on 1989 with total page 804 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book BiCMOS Technology and Applications written by Antonio R. Alvarez and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 412 pages. Available in PDF, EPUB and Kindle. Book excerpt: BiCMOS Technology and Applications, Second Edition provides a synthesis of available knowledge about the combination of bipolar and MOS transistors in a common integrated circuit - BiCMOS. In this new edition all chapters have been updated and completely new chapters on emerging topics have been added. In addition, BiCMOS Technology and Applications, Second Edition provides the reader with a knowledge of either CMOS or Bipolar technology/design a reference with which they can make educated decisions regarding the viability of BiCMOS in their own application. BiCMOS Technology and Applications, Second Edition is vital reading for practicing integrated circuit engineers as well as technical managers trying to evaluate business issues related to BiCMOS. As a textbook, this book is also appropriate at the graduate level for a special topics course in BiCMOS. A general knowledge in device physics, processing and circuit design is assumed. Given the division of the book, it lends itself well to a two-part course; one on technology and one on design. This will provide advanced students with a good understanding of tradeoffs between bipolar and MOS devices and circuits.

Download or read book Advances in Rapid Thermal and Integrated Processing written by F. Roozeboom and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 568 pages. Available in PDF, EPUB and Kindle. Book excerpt: Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are discussed at the graduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage.

Download or read book Rapid Thermal and Integrated Processing written by and published by . This book was released on 1991 with total page 534 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Rapid Thermal Annealing Chemical Vapor Deposition and Integrated Processing Volume 146 written by David Hodul and published by . This book was released on 1989-11-03 with total page 544 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Download or read book Metallic Films for Electronic Optical and Magnetic Applications written by Katayun Barmak and published by Woodhead Publishing. This book was released on 2014-02-13 with total page 671 pages. Available in PDF, EPUB and Kindle. Book excerpt: Metallic films play an important role in modern technologies such as integrated circuits, information storage, displays, sensors, and coatings. Metallic Films for Electronic, Optical and Magnetic Applications reviews the structure, processing and properties of metallic films. Part one explores the structure of metallic films using characterization methods such as x-ray diffraction and transmission electron microscopy. This part also encompasses the processing of metallic films, including structure formation during deposition and post-deposition reactions and phase transformations. Chapters in part two focus on the properties of metallic films, including mechanical, electrical, magnetic, optical, and thermal properties. Metallic Films for Electronic, Optical and Magnetic Applications is a technical resource for electronics components manufacturers, scientists, and engineers working in the semiconductor industry, product developers of sensors, displays, and other optoelectronic devices, and academics working in the field. Explores the structure of metallic films using characterization methods such as x-ray diffraction and transmission electron microscopy Discusses processing of metallic films, including structure formation during deposition and post-deposition reactions and phase transformations Focuses on the properties of metallic films, including mechanical, electrical, magnetic, optical, and thermal properties

Download or read book Fundamentals of Semiconductor Processing Technology written by Badih El-Kareh and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 605 pages. Available in PDF, EPUB and Kindle. Book excerpt: The drive toward new semiconductor technologies is intricately related to market demands for cheaper, smaller, faster, and more reliable circuits with lower power consumption. The development of new processing tools and technologies is aimed at optimizing one or more of these requirements. This goal can, however, only be achieved by a concerted effort between scientists, engineers, technicians, and operators in research, development, and manufac turing. It is therefore important that experts in specific disciplines, such as device and circuit design, understand the principle, capabil ities, and limitations of tools and processing technologies. It is also important that those working on specific unit processes, such as lithography or hot processes, be familiar with other unit processes used to manufacture the product. Several excellent books have been published on the subject of process technologies. These texts, however, cover subjects in too much detail, or do not cover topics important to modem tech nologies. This book is written with the need for a "bridge" between different disciplines in mind. It is intended to present to engineers and scientists those parts of modem processing technologies that are of greatest importance to the design and manufacture of semi conductor circuits. The material is presented with sufficient detail to understand and analyze interactions between processing and other semiconductor disciplines, such as design of devices and cir cuits, their electrical parameters, reliability, and yield.

Download or read book Rapid Thermal Processing Volume 52 written by Thomas O. Sedgwick and published by Mrs Proceedings. This book was released on 1986-04-15 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.