Download or read book Nuclear Science Abstracts written by and published by . This book was released on 1974 with total page 1298 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Proceedings of International Conference on Technology and Instrumentation in Particle Physics 2017 written by Zhen-An Liu and published by Springer. This book was released on 2018-08-07 with total page 445 pages. Available in PDF, EPUB and Kindle. Book excerpt: These two volumes present the proceedings of the International Conference on Technology and Instrumentation in Particle Physics 2017 (TIPP2017), which was held in Beijing, China from 22 to 26 May 2017. Gathering selected articles on the basis of their quality and originality, it highlights the latest developments and research trends in detectors and instrumentation for all branches of particle physics, particle astrophysics and closely related fields. This is the second volume, and focuses on the main themes Astrophysics and space instrumentation, Front-end electronics and fast data transmission, Trigger and data acquisition systems, Machine detectors, Interfaces and beam instrumentation, Backend readout structures and embedded systems, Medical imaging, and Security & other applications. The TIPP2017 is the fourth in a series of international conferences on detectors and instrumentation, held under the auspices of the International Union of Pure and Applied Physics (IUPAP). The event brings together experts from the scientific and industrial communities to discuss their current efforts and plan for the future. The conference’s aim is to provide a stimulating atmosphere for scientists and engineers from around the world.

Download or read book In Situ Characterization of Thin Film Growth written by Gertjan Koster and published by Elsevier. This book was released on 2011-10-05 with total page 295 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced techniques for characterizing thin film growth in situ help to develop improved understanding and faster diagnosis of issues with the process. In situ characterization of thin film growth reviews current and developing techniques for characterizing the growth of thin films, covering an important gap in research.Part one covers electron diffraction techniques for in situ study of thin film growth, including chapters on topics such as reflection high-energy electron diffraction (RHEED) and inelastic scattering techniques. Part two focuses on photoemission techniques, with chapters covering ultraviolet photoemission spectroscopy (UPS), X-ray photoelectron spectroscopy (XPS) and in situ spectroscopic ellipsometry for characterization of thin film growth. Finally, part three discusses alternative in situ characterization techniques. Chapters focus on topics such as ion beam surface characterization, real time in situ surface monitoring of thin film growth, deposition vapour monitoring and the use of surface x-ray diffraction for studying epitaxial film growth.With its distinguished editors and international team of contributors, In situ characterization of thin film growth is a standard reference for materials scientists and engineers in the electronics and photonics industries, as well as all those with an academic research interest in this area. - Chapters review electron diffraction techniques, including the methodology for observations and measurements - Discusses the principles and applications of photoemission techniques - Examines alternative in situ characterisation techniques

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Download or read book Index of Conference Proceedings written by British Library. Document Supply Centre and published by . This book was released on 2002 with total page 696 pages. Available in PDF, EPUB and Kindle. Book excerpt:

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Download or read book Flexible Electronic Packaging and Encapsulation Technology written by Hong Meng and published by John Wiley & Sons. This book was released on 2024-03-25 with total page 389 pages. Available in PDF, EPUB and Kindle. Book excerpt: Flexible Electronic Packaging and Encapsulation Technology A systematic introduction to the future of electronic packaging Electronic packaging materials are among the most important components of the broader electronics industry, capable of facilitating heat dissipation, redistributing stress on electronic components, and providing environmental protections for electronic systems. Recent advances in integrated circuits, especially the development of flexible electronic technology, have placed increasingly stringent demands on the capabilities of electronic packaging. These technologies have the potential to reshape our world, and they demand a generation of engineers capable of harnessing that potential. Flexible Electronic Packaging and Encapsulation Technology meets this demand with an introduction to the cutting-edge technologies available to package electronic components, as well as the testing methods and applications that bring these technologies to bear on the industry. These packaging technologies promise to bring lightness, flexibility, and environmental friendliness to the next generation of electronic systems. Flexible Electronic Packaging and Encapsulation Technology readers will also find: Survey of commercial electronic packaging materials and patents for reference purposes Guidelines for designing high-performance packaging materials with novel structures An authorial team of leading researchers in the field Flexible Electronic Packaging and Encapsulation Technology is ideal for materials scientists, electronics engineers, solid state physicists, professionals in the semiconductor industry, and any other researchers or professionals working with electronic systems.

Download or read book System Innovation for a World in Transition written by Artde Donald Kin-Tak Lam and published by CRC Press. This book was released on 2023-12-27 with total page 391 pages. Available in PDF, EPUB and Kindle. Book excerpt: System Innovation for a World in Transition: Applied System Innovation IX, includes the contributions presented at the IEEE 9th International Conference on Applied System Innovation (ICASI 2023, Chiba, Japan, 21-25 April 2023). The conference received more than 600 submitted papers from 12 different countries, whereby roughly one quarter of these papers was selected to present at ICASI 2023. The book aims to provide an integrated communication platform for researchers from a wide range of topics including information technology, communication science, applied mathematics, computer science, advanced material science, and engineering. Hopefully, it will enhance interdisciplinary collaborations between science and engineering technologists in the fields of academics and related industries.

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Download or read book National Institute of Health Bulletin written by and published by . This book was released on 1950 with total page 92 pages. Available in PDF, EPUB and Kindle. Book excerpt:

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