Download or read book Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference EPTC written by EPTC and published by . This book was released on 2016 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Annotation Advanced Packaging Flip chip, multiple array leadframe package, POP, embedded passives and actives on substrates, System in Packaging, etc TSV Wafer Level Packaging Wafer level packaging (Fan in Fan out), embedded chip packaging, 2 5D 3D integration, TSV, Silicon & Glass interposer, RDL, bumping technologies, etc Interconnection Technologies Au Ag Cu Al Wire bond Wedge bond technology, Flip chip & Cu pillar technology, solder alternatives (ICP, ACP, ACF, NCP, ICA), Cu to Cu, Wafer level bonding & die attachment (Pb free) etc Emerging Technologies Packaging technologies for MEMS, biomedical, optoelectronics, Internet of things, photo voltaic, printed electronics, wearable electronics, Photonics, LED, etc Materials and Substrates Leadframes Including all that polymer and solder materials, and Substrates Interposer Leadframes PCB etc Processes and Automation Equipments new process development as well as equipment automation development Electrical M.
Download or read book Semiconductor Advanced Packaging written by John H. Lau and published by Springer Nature. This book was released on 2021-05-17 with total page 513 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Download or read book Electronics Packaging Technology Conference written by and published by Springer. This book was released on 2004 with total page 804 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Chiplet Design and Heterogeneous Integration Packaging written by John H. Lau and published by Springer Nature. This book was released on 2023-03-27 with total page 542 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Download or read book Electronic Enclosures Housings and Packages written by Frank Suli and published by Woodhead Publishing. This book was released on 2018-11-15 with total page 490 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and potential future directions. Introduces the concepts of materials recycling and sustainability to electronic enclosures Provides thorough coverage of all technical aspects relating to the design and manufacturing of electronic packaging Includes practical information on environmental considerations, shielding, standardization, materials selection, and more
Download or read book Embedded and Fan Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces written by Beth Keser and published by John Wiley & Sons. This book was released on 2021-12-29 with total page 324 pages. Available in PDF, EPUB and Kindle. Book excerpt: Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches. The book begins with a market analysis of the latest technology trends in Fan-Out and Wafer Level Packaging before moving on to a cost analysis of these solutions. The contributors discuss the new package types for advanced application spaces being created by companies like TSMC, Deca Technologies, and ASE Group. Finally, emerging technologies from academia are explored. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces is an indispensable resource for microelectronic package engineers, managers, and decision makers working with OEMs and IDMs. It is also a must-read for professors and graduate students working in microelectronics packaging research.
Download or read book Nanostructure Based Sensors for Gas Sensing from Devices to Systems written by Sabrina Grassini and published by MDPI. This book was released on 2019-10-29 with total page 86 pages. Available in PDF, EPUB and Kindle. Book excerpt: The development of solid state gas sensors based on microtransducers and nanostructured sensing materials is the key point in the design of portable measurement systems able to reach sensing and identification performance comparable with analytical ones. In such a context several efforts must be spent of course in the development of the sensing material, but also in the choice of the transducer mechanism and its structure, in the electrical characterization of the performance and in the design of suitable measurement setups. This call for papers invites researchers worldwide to report about their novel results on the most recent advances and overview in design and measurements for applications in gas sensors, along with their relevant features and technological aspects. Original research papers are welcome (but not limited) on all aspects that focus on the most recent advances in: (i) basic principles and modeling of gas and VOCs sensors; (ii) new gas sensor principles and technologies; (iii) Characterization and measurements methodologies; (iv) transduction and sampling systems; (vi) package optimization; (vi) gas sensor based systems and applications.
Download or read book Semiconductor Power Devices written by Josef Lutz and published by Springer. This book was released on 2018-02-16 with total page 723 pages. Available in PDF, EPUB and Kindle. Book excerpt: Halbleiter-Leistungsbauelemente sind das Kernstück der Leistungselektronik. Sie bestimmen die Leistungsfähigkeit und machen neuartige und verlustarme Schaltungen erst möglich. In dem Band wird neben den Halbleiter-Leistungsbauelementen selbst auch die Aufbau- und Verbindungstechnik behandelt: von den physikalischen Grundlagen und der Herstellungstechnologie über einzelne Bauelemente bis zu thermomechanischen Problemen, Zerstörungsmechanismen und Störungseffekten. Die 2., überarbeitete Auflage berücksichtigt technische Neuerungen und Entwicklungen.
Download or read book Nanotechnology Based E Noses written by Ram K. Gupta and published by Elsevier. This book was released on 2023-01-12 with total page 487 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nanotechnology-based E-Noses reviews advances in nanomaterials and their modification for use in e-sensors. "E-noses" or "electronic sensors" are emerging as advanced technologies for the fast detection of chemicals, gases, and explosives. The concept behind the "e-nose" is similar to the capability of humans and dogs in detecting materials based on odors. Nanomaterials can be used for e-nose technologies but their properties must be modified to make them effective sensors. The sensing capability and performance of these materials depend on several factors, such as morphology, dopants, microadditives, design of sensors, phase, and structure of the nanomaterials. Theoretical understanding of nanomaterials and technologies for improving sensors with better detection limits are covered. The most relevant nanomaterials, their synthesis strategies, and the relationship between properties and device performance are provided. Current state-of-the-art progress in nanotechnology device fabrication along with directions for future applications and challenges are discussed. Covers fundamentals of nanomaterials for electronic sensing applications, including material synthesis and property optimization strategies to improve material performance Reviews emerging relevant nanomaterials including 1D, 2D and 3D nanomaterials for use in e-nose technologies Discusses nanotechnology-based e-noses and their wide range of applications in the detection of chemicals, gases, explosives, and more
Download or read book Electronics Packaging Technology Conference written by and published by . This book was released on 2003 with total page 825 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings of 3rd Electronics Packaging Technology Conference EPTC 2000 written by Thiam Beng Lim and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 2000 with total page 492 pages. Available in PDF, EPUB and Kindle. Book excerpt: Topics covered by this title include: packaging materials; packaging trends; thermal design and modelling; solder joint metallurgy; process and reliability modelling; thermal characterization; materials characterization techniques; and assembly/manufacturing technologies.
Download or read book Proceedings of 2nd Electronics Packaging Technology Conference written by Andrew A. O. Tay and published by . This book was released on 1998 with total page 380 pages. Available in PDF, EPUB and Kindle. Book excerpt: Annotation EPTC '98 provides a forum for package development engineers, scientists & researchers to present their findings & innovations, & to exchange ideas in electronic packaging technology. The organizers aim was to establish EPTC as a major electronic packaging conference in the South East Asian region where the bulk of the world's electronic packaging activities is taking place. Partial Contents: Chip Scale Packaging & its Impact on PCB Substrate Technology; Electrical Design of High Performance Packages; Thermal Management of Electronic Packages & Systems; Flip Chip Technology.
Download or read book 2016 IEEE 37th International Electronics Manufacturing Technology IEMT 18th Electronics Materials and Packaging EMAP Conference written by and published by . This book was released on 2016 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Annotation It aims to provide good coverage of technological developments in all areas of electronics packaging, from design to manufacturing and operation It is a major forum, providing opportunities to network and meet leading experts, in addition to exchange of up to date knowledge in the field.
Download or read book IEEE 15th Electronics Packaging Technology Conference written by and published by . This book was released on 2013 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings of 6th Electronics Packaging Technology Conference EPTC 2004 written by and published by . This book was released on 2004 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings of 3rd Electronic Packaging Technology Conference written by and published by . This book was released on 2001 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2022 IEEE 24th Electronics Packaging Technology Conference EPTC written by and published by . This book was released on 2023 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
