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Download or read book The RF in RFID written by Daniel Dobkin and published by Elsevier. This book was released on 2007-10-25 with total page 505 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book includes a survey of all RFID fundamentals and practices in the first part of the book while the second part focuses on UHF passive technology. This coverage of UHF technology and its components including tags, readers, and antennas is essential to commercial implementation in supply chain logistics and security. Readers of this book should have an electrical engineering background but have not yet dealt with RFID. To this end, Dr. Dobkin is very careful to illustrate all concepts and detail his explanations meticulously. In this way he brings the reader along organically showing him/her what to expect, develop, and use while implementing an RFID system. - This technology is happening NOW at major chain stores such as Wal-Mart and Target - RFID revenues are estimated to soar to about $7 billion by 2008
Download or read book Index of Conference Proceedings written by British Library. Document Supply Centre and published by . This book was released on 2003 with total page 870 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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Download or read book Advanced Flip Chip Packaging written by Ho-Ming Tong and published by Springer Science & Business Media. This book was released on 2013-03-20 with total page 562 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Download or read book Annual IEEE Semiconductor Thermal Measurement and Management Symposium written by and published by . This book was released on 1999 with total page 324 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings of 3rd Electronics Packaging Technology Conference EPTC 2000 written by Thiam Beng Lim and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 2000 with total page 492 pages. Available in PDF, EPUB and Kindle. Book excerpt: Topics covered by this title include: packaging materials; packaging trends; thermal design and modelling; solder joint metallurgy; process and reliability modelling; thermal characterization; materials characterization techniques; and assembly/manufacturing technologies.
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