Download or read book Power Integrity for Electrical and Computer Engineers written by J. Ted Dibene, II and published by John Wiley & Sons. This book was released on 2019-09-24 with total page 560 pages. Available in PDF, EPUB and Kindle. Book excerpt: A professional guide to the fundamentals of power integrity analysis with an emphasis on silicon level power integrity Power Integrity for Electrical and Computer Engineers embraces the most recent changes in the field, offers a comprehensive introduction to the discipline of power integrity, and provides an overview of the fundamental principles. Written by noted experts on the topic, the book goes beyond most other resources to focus on the detailed aspects of silicon and optimization techniques in order to broaden the field of study. This important book offers coverage of a wide range of topics including signal analysis, EM concepts for PI, frequency domain analysis for PI, numerical methods (overview) for PI, and silicon device PI modeling. Power Integrity for Electrical and Computer Engineers examine platform technologies, system considerations, power conversion, system level modeling, and optimization methodologies. To reinforce the material presented, the authors include example problems. This important book: • Includes coverage on convergence, accuracy, and error analysis and explains how these can be used to analyze power integrity problems • Contains information for modeling the power converter from the PDN to the load in a full system level model • Explores areas of device level modeling of silicon as related to power integrity • Contains example word problems that are related to an individual chapter’s subject Written for electrical and computer engineers and academics, Power Integrity for Electrical and Computer Engineers is an authoritative guide to the fundamentals of power integrity and explores the topics of power integrity analysis, power integrity analytics, silicon level power integrity, and optimization techniques.

Download or read book Fundamentals of Power Integrity for Computer Platforms and Systems written by Joseph T. DiBene, II and published by John Wiley & Sons. This book was released on 2014-05-16 with total page 279 pages. Available in PDF, EPUB and Kindle. Book excerpt: An all-encompassing text that focuses on the fundamentals of power integrity Power integrity is the study of power distribution from the source to the load and the system level issues that can occur across it. For computer systems, these issues can range from inside the silicon to across the board and may egress into other parts of the platform, including thermal, EMI, and mechanical. With a focus on computer systems and silicon level power delivery, this book sheds light on the fundamentals of power integrity, utilizing the author’s extensive background in the power integrity industry and unique experience in silicon power architecture, design, and development. Aimed at engineers interested in learning the essential and advanced topics of the field, this book offers important chapter coverage of fundamentals in power distribution, power integrity analysis basics, system-level power integrity considerations, power conversion in computer systems, chip-level power, and more. Fundamentals of Power Integrity for Computer Platforms and Systems: Introduces readers to both the field of power integrity and to platform power conversion Provides a unique focus on computer systems and silicon level power delivery unavailable elsewhere Offers detailed analysis of common problems in the industry Reviews electromagnetic field and circuit representation Includes a detailed bibliography of references at the end of each chapter Works out multiple example problems within each chapter Including additional appendixes of tables and formulas, Fundamentals of Power Integrity for Computer Platforms and Systems is an ideal introductory text for engineers of power integrity as well as those in the chip design industry, specifically physical design and packaging.

Download or read book Power Integrity Modeling and Design for Semiconductors and Systems written by Madhavan Swaminathan and published by Pearson Education. This book was released on 2007-11-19 with total page 599 pages. Available in PDF, EPUB and Kindle. Book excerpt: The First Comprehensive, Example-Rich Guide to Power Integrity Modeling Professionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems. Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the art. Using realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise. The authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications. Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applications. The authors Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists. It will also be valuable to developers building software that helps to analyze high-speed systems.

Download or read book Signal Integrity written by Samuel H. Russ and published by Springer Nature. This book was released on 2022-01-03 with total page 241 pages. Available in PDF, EPUB and Kindle. Book excerpt: This fully updated and expanded textbook covers designing working systems at very high frequencies. The updated book includes new chapters on Circuit Board Layout Process and Circuit-Board Attacks and Security and more in-depth material on all the original chapters. As with the first edition, this book combines an intuitive, physics-based approach to electromagnetics with a focus on solving realistic problems. The book emphasizes an intuitive approach to electromagnetics, and then uses this foundation to show the reader how both physical phenomena can cause signals to propagate incorrectly; and how to solve commonly encountered issues. Emphasis is placed on real problems that the author has encountered in his professional career, integrating problem-solving strategies and real signal-integrity case studies throughout the presentation. Students are challenged to think about managing complex design projects and implementing successful engineering and manufacturing processes. For the new edition, the author designed a circuit board that illustrates many of the principles in the book, created instructor materials including PowerPoint slides, a homework bank, and a test bank, and created materials that departments can use for ABET assessment.

Download or read book High Speed Circuit Board Signal Integrity Second Edition written by Stephen C. Thierauf and published by Artech House. This book was released on 2017-04-30 with total page 321 pages. Available in PDF, EPUB and Kindle. Book excerpt: This thoroughly updated leading-edge circuit design resource offers the knowledge needed to quickly pinpoint transmission problems that can compromise the entire circuit design. This new edition demonstrates how to apply EM theory to solve signal integrity problems with a practical application-oriented approach. Discussing both design and debug issues at gigabit per second data rates, the book serves as a practical reference for projects involving high-speed serial signaling on printed wiring boards. Step-by-step, this book goes from reviewing the essentials of linear circuit theory, to examining practical issues of pulse propagation along lossless and lossy transmission lines. It provides detailed guidelines for crosstalk, attenuation, power supply decoupling, and layer stackup tradeoffs (including pad/antipad tradeoffs). Other key topics include the construction of etched conductors, analysis of return paths and split planes, microstrip and stripline characteristics, and SMT capacitors. Filled with on-the-job-proven examples, this hands-on reference is the book that engineers can turn to time and again to design out and troubleshoot circuit signal loss and impedance problems.

Download or read book Power Integrity Modeling and Design for Semiconductors and Systems written by Madhavan Swaminathan and published by . This book was released on 2007 with total page 496 pages. Available in PDF, EPUB and Kindle. Book excerpt: The First Comprehensive, Example-Rich Guide to Power Integrity Modeling Professionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems. Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the art. Using realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise. The authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications. Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applications. The authors Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists. It will also be valuable to developers building software that helps to analyze high-speed systems.

Download or read book Power Integrity for I O Interfaces written by Vishram S. Pandit and published by Pearson Education. This book was released on 2010-10-13 with total page 466 pages. Available in PDF, EPUB and Kindle. Book excerpt: Foreword by Joungho Kim The Hands-On Guide to Power Integrity in Advanced Applications, from Three Industry Experts In this book, three industry experts introduce state-of-the-art power integrity design techniques for today’s most advanced digital systems, with real-life, system-level examples. They introduce a powerful approach to unifying power and signal integrity design that can identify signal impediments earlier, reducing cost and improving reliability. After introducing high-speed, single-ended and differential I/O interfaces, the authors describe on-chip, package, and PCB power distribution networks (PDNs) and signal networks, carefully reviewing their interactions. Next, they walk through end-to-end PDN and signal network design in frequency domain, addressing crucial parameters such as self and transfer impedance. They thoroughly address modeling and characterization of on-chip components of PDNs and signal networks, evaluation of power-to-signal coupling coefficients, analysis of Simultaneous Switching Output (SSO) noise, and many other topics. Coverage includes The exponentially growing challenge of I/O power integrity in high-speed digital systems PDN noise analysis and its timing impact for single-ended and differential interfaces Concurrent design and co-simulation techniques for evaluating all power integrity effects on signal integrity Time domain gauges for designing and optimizing components and systems Power/signal integrity interaction mechanisms, including power noise coupling onto signal trace and noise amplification through signal resonance Performance impact due to Inter Symbol Interference (ISI), crosstalk, and SSO noise, as well as their interactions Validation techniques, including low impedance VNA measurements, power noise measurements, and characterization of power-to-signal coupling effects Power Integrity for I/O Interfaces will be an indispensable resource for everyone concerned with power integrity in cutting-edge digital designs, including system design and hardware engineers, signal and power integrity engineers, graduate students, and researchers.

Download or read book High speed Circuit Board Signal Integrity written by Stephen C. Thierauf and published by Artech House. This book was released on 2004 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt: This leading-edge circuit design resource offers the knowledge needed to quickly pinpoint transmission problems that can compromise circuit design. Discusses both design and debug issues at gigabit per second data rates.

Download or read book Transient Signals on Transmission Lines written by Andrew Peterson and published by Springer Nature. This book was released on 2023-12-05 with total page 224 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides an introduction to transmission line effects in the time domain. Fundamentals including time of flight, impedance discontinuities, proper termination schemes, nonlinear and reactive loads, and crosstalk are considered. Required prerequisite knowledge is limited to conventional circuit theory. The material is tutorial for electrical and computer engineers on the topic of transient signals on transmission lines. Emphasis has been placed on aspects of the subject that have application to signal integrity and high-speed digital circuit design issues, including proper termination schemes to avoid impedance discontinuities, reactive and nonlinear loads, and an introduction to crosstalk. The coverage focuses on the very important topic of transmission line transients which have been de-emphasized in most current textbooks. This book is prepared to supplement traditional texts for advanced students studying electromagnetics and for a vast array of practicing electrical engineers, computer engineers and material scientists with interests in signal integrity and high-speed digital design. In this second edition, examples and new problems have been added throughout. A new chapter on differential transmission lines has also been incorporated

Download or read book Power Integrity written by Steven M. Sandler and published by McGraw Hill Professional. This book was released on 2014-07-29 with total page 352 pages. Available in PDF, EPUB and Kindle. Book excerpt: PROVEN TECHNIQUES FOR GENERATING HIGH-FIDELITY MEASUREMENTS Power Integrity: Measuring, Optimizing, and Troubleshooting Power Related Parameters in Electronics Systems provides field-tested techniques for producing high-fidelity measurements using the appropriate equipment. The book thoroughly discusses measurement guidelines, test instrument selection and use, connecting the equipment to the device being tested, and interpreting the acquired data. The latest electronics technologies and their impact on measurement are discussed. Detailed photographs, screenshots, schematics, and equations are included throughout this practical guide. Learn how to accurately measure: Impedance Stability Power supply rejection ratio (PSRR) Reverse transfer and crosstalk Step load response Ripple and noise Edges High-frequency impedance

Download or read book The Foundations of Signal Integrity written by Paul G. Huray and published by John Wiley & Sons. This book was released on 2009-10-22 with total page 363 pages. Available in PDF, EPUB and Kindle. Book excerpt: The first book to focus on the electromagnetic basis of signal integrity The Foundations of Signal Integrity is the first of its kind—a reference that examines the physical foundation of system integrity based on electromagnetic theory derived from Maxwell's Equations. Drawing upon the cutting-edge research of Professor Paul Huray's team of industrial engineers and graduate students, it develops the physical theory of wave propagation using methods of solid state and high-energy physics, mathematics, chemistry, and electrical engineering before addressing its application to modern high-speed systems. Coverage includes: All the necessary electromagnetic theory needed for a complete understanding of signal integrity Techniques for obtaining analytic solutions to Maxwell's Equations for ideal materials and boundary conditions Plane electromagnetic waves Plane waves in compound media Transmission lines and waveguides Ideal models vs. real-world systems Complex permittivity of propagating media Surface roughness Advanced signal integrity Signal integrity simulations Problem sets for each chapter With its thorough coverage of this relatively new discipline, the book serves as an ideal textbook for senior undergraduate and junior graduate students, as well as a resource for practicing engineers in this burgeoning field. At the end of each section, it typically stimulates the reader with open-ended questions that might lead to future theses or dissertation research.

Download or read book Advanced Signal Integrity for High Speed Digital Designs written by Stephen H. Hall and published by John Wiley & Sons. This book was released on 2011-09-20 with total page 608 pages. Available in PDF, EPUB and Kindle. Book excerpt: A synergistic approach to signal integrity for high-speed digital design This book is designed to provide contemporary readers with an understanding of the emerging high-speed signal integrity issues that are creating roadblocks in digital design. Written by the foremost experts on the subject, it leverages concepts and techniques from non-related fields such as applied physics and microwave engineering and applies them to high-speed digital design—creating the optimal combination between theory and practical applications. Following an introduction to the importance of signal integrity, chapter coverage includes: Electromagnetic fundamentals for signal integrity Transmission line fundamentals Crosstalk Non-ideal conductor models, including surface roughness and frequency-dependent inductance Frequency-dependent properties of dielectrics Differential signaling Mathematical requirements of physical channels S-parameters for digital engineers Non-ideal return paths and via resonance I/O circuits and models Equalization Modeling and budgeting of timing jitter and noise System analysis using response surface modeling Each chapter includes many figures and numerous examples to help readers relate the concepts to everyday design and concludes with problems for readers to test their understanding of the material. Advanced Signal Integrity for High-Speed Digital Designs is suitable as a textbook for graduate-level courses on signal integrity, for programs taught in industry for professional engineers, and as a reference for the high-speed digital designer.

Download or read book Electrical Modeling and Design for 3D System Integration written by Er-Ping Li and published by John Wiley & Sons. This book was released on 2012-04-10 with total page 394 pages. Available in PDF, EPUB and Kindle. Book excerpt: New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures. Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through: The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards An equivalent circuit model of through-silicon vias Metal-oxide-semiconductor capacitance effects of through-silicon vias Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.

Download or read book Noise Coupling in Integrated Circuits written by Cosmin Iorga and published by Noisecoupling.com. This book was released on 2008 with total page 271 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Power Integrity for I O Interfaces written by Vishram S. Pandit and published by . This book was released on 2010 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Foreword by Joungho Kim The Hands-On Guide to Power Integrity in Advanced Applications, from Three Industry Experts In this book, three industry experts introduce state-of-the-art power integrity design techniques for today's most advanced digital systems, with real-life, system-level examples. They introduce a powerful approach to unifying power and signal integrity design that can identify signal impediments earlier, reducing cost and improving reliability. After introducing high-speed, single-ended and differential I/O interfaces, the authors describe on-chip, package, and PCB power distribution networks (PDNs) and signal networks, carefully reviewing their interactions. Next, they walk through end-to-end PDN and signal network design in frequency domain, addressing crucial parameters such as self and transfer impedance. They thoroughly address modeling and characterization of on-chip components of PDNs and signal networks, evaluation of power-to-signal coupling coefficients, analysis of Simultaneous Switching Output (SSO) noise, and many other topics. Coverage includes • The exponentially growing challenge of I/O power integrity in high-speed digital systems • PDN noise analysis and its timing impact for single-ended and differential interfaces • Concurrent design and co-simulation techniques for evaluating all power integrity effects on signal integrity • Time domain gauges for designing and optimizing components and systems • Power/signal integrity interaction mechanisms, including power noise coupling onto signal trace and noise amplification through signal resonance • Performance impact due to Inter Symbol Interference (ISI), crosstalk, and SSO noise, as well as their interactions • Validation techniques, including low impedance VNA measurements, power noise measurements, and characterization of power-to-signal coupling effects Power Integrity for I/O Interfaces will be an indispensable resource for everyone concerned with power integrity in cutting-edge digital designs, including system design and hardware engineers, signal and power integrity engineers, graduate students, and researchers.

Download or read book Signal Integrity written by Eric Bogatin and published by Prentice Hall Professional. This book was released on 2004 with total page 612 pages. Available in PDF, EPUB and Kindle. Book excerpt: This thorough review of the fundamental principles associated with signal integrity provides engineering principles behind signal integrity effects, and applies this understanding to solving problems.

Download or read book Synthesis of Power Distribution to Manage Signal Integrity in Mixed Signal ICs written by Balsha R. Stanisic and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 221 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the early days of VLSI, the design of the power distribution for an integrated cir cuit was rather simple. Power distribution --the design of the geometric topology for the network of wires that connect the various power supplies, the widths of the indi vidual segments for each of these wires, the number and location of the power I/O pins around the periphery of the chip --was simple because the chips were simpler. Few available wiring layers forced floorplans that allowed simple, planar (non-over lapping) power networks. Lower speeds and circuit density made the choice of the wire widths easier: we made them just fat enough to avoid resistive voltage drops due to switching currents in the supply network. And we just didn't need enormous num bers of power and ground pins on the package for the chips to work. It's not so simple any more. Increased integration has forced us to focus on reliability concerns such as metal elec tromigration, which affects wire sizing decisions in the power network. Extra metal layers have allowed more flexibility in the topological layout of the power networks.