Download or read book 2002 7th International Symposium on Plasma and Process Induced Damage written by and published by . This book was released on 2002 with total page 194 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Plasma Etching Processes for Sub quarter Micron Devices written by G. S. Mathad and published by The Electrochemical Society. This book was released on 2000 with total page 396 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Plasma Charging Damage written by Kin P. Cheung and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 354 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the 50 years since the invention of transistor, silicon integrated circuit (IC) technology has made astonishing advances. A key factor that makes these advances possible is the ability to have precise control on material properties and physical dimensions. The introduction of plasma processing in pattern transfer and in thin film deposition is a critical enabling advance among other things. In state of the art silicon Ie manufacturing process, plasma is used in more than 20 different critical steps. Plasma is sometimes called the fourth state of matter (other than gas, liquid and solid). It is a mixture of ions (positive and negative), electrons and neutrals in a quasi-neutral gaseous steady state very far from equilibrium, sustained by an energy source that balances the loss of charged particles. It is a very harsh environment for the delicate ICs. Highly energetic particles such as ions, electrons and photons bombard the surface of the wafer continuously. These bombardments can cause all kinds of damage to the silicon devices that make up the integrated circuits.

Download or read book Semiconductor Process Reliability in Practice written by Zhenghao Gan and published by McGraw Hill Professional. This book was released on 2012-10-10 with total page 624 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proven processes for ensuring semiconductor device reliability Co-written by experts in the field, Semiconductor Process Reliability in Practice contains detailed descriptions and analyses of reliability and qualification for semiconductor device manufacturing and discusses the underlying physics and theory. The book covers initial specification definition, test structure design, analysis of test structure data, and final qualification of the process. Real-world examples of test structure designs to qualify front-end-of-line devices and back-end-of-line interconnects are provided in this practical, comprehensive guide. Coverage includes: Basic device physics Process flow for MOS manufacturing Measurements useful for device reliability characterization Hot carrier injection Gate-oxide integrity (GOI) and time-dependent dielectric breakdown (TDDB) Negative bias temperature instability Plasma-induced damage Electrostatic discharge protection of integrated circuits Electromigration Stress migration Intermetal dielectric breakdown

Download or read book Index of Conference Proceedings written by British Library. Document Supply Centre and published by . This book was released on 2003 with total page 870 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Publications in Engineering written by and published by . This book was released on 2002 with total page 636 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Proceedings of the 4th International Symposium on Plasma and Energy Conversion written by Dong Dai and published by Springer Nature. This book was released on 2023-05-23 with total page 544 pages. Available in PDF, EPUB and Kindle. Book excerpt: These proceedings highlight the fundamental researches and up-to-data developments on energy conversion and high-voltage application by means of low temperature and atmospheric pressure plasma. In recent years, plasma-assisted energy conversion gains increasing attention as an alternative to thermal-catalysis or electro-catalysis. These proceedings discuss and exchange cutting-edge scientific innovations and technological advances in fields like plasma-enabled synthesis of chemicals and fuels, plasma-enabled the environmental clean-up, plasma-enabled catalysis treatment, in-situ probing of plasma-catalyst interactions and its high-voltage applications, which show great potentials in industrial demands like CO2 hydrogenation, CH4 reforming and nitrogen fixation, plasma deposition, chemical synthesis, VOC abatement and high-voltage insulation. This collection of papers presents the main applications of plasma-induced energy conversion and high-voltage discharge in the form of separate chapters, including cutting-edge studies on conversion technology, complex mechanism simulation, in-situ detection and converged applications by artificial intelligence. These proceedings are suitable for researchers engaged in fields like plasma-catalysis, discharge diagnosis and modelling, chemical modelling and high-voltage applications. The major topics covered in the conference proceedings are: 1) Advanced plasma-catalysis conversion technology; 2) Advanced in-situ discharge diagnosis technology; 3) Advanced in-situ plasma-catalysis characterization; 4) Multi-scale or innovative modelling technology; 5) High-voltage discharge and application.

Download or read book Proceedings of the International Symposium on the Physical Failure Analysis of Integrated Circuits written by and published by . This book was released on 2004 with total page 398 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Feature Profile Evolution in Plasma Processing Using On wafer Monitoring System written by Seiji Samukawa and published by Springer Science & Business Media. This book was released on 2014-01-28 with total page 46 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides for the first time a good understanding of the etching profile technologies that do not disturb the plasma. Three types of sensors are introduced: on-wafer UV sensors, on-wafer charge-up sensors and on-wafer sheath-shape sensors in the plasma processing and prediction system of real etching profiles based on monitoring data. Readers are made familiar with these sensors, which can measure real plasma process surface conditions such as defect generations due to UV-irradiation, ion flight direction due to charge-up voltage in high-aspect ratio structures and ion sheath conditions at the plasma/surface interface. The plasma etching profile realistically predicted by a computer simulation based on output data from these sensors is described.

Download or read book Proceedings of the Electrochemical Society Symposium on Diagnostic Techniques for Semiconductor Materials and Devices written by P. Rai-Choudhury and published by The Electrochemical Society. This book was released on 1997 with total page 496 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Plasma Processing XIV written by G. S. Mathad and published by . This book was released on 2002 with total page 342 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Silicon Nitride and Silicon Dioxide Thin Insulating Films VII written by Electrochemical Society. Meeting and published by The Electrochemical Society. This book was released on 2003 with total page 652 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book In line Methods and Monitors for Process and Yield Improvement written by Sergio Ajuria and published by SPIE-International Society for Optical Engineering. This book was released on 1999 with total page 352 pages. Available in PDF, EPUB and Kindle. Book excerpt: These conference proceedings consist of 47 papers addressing a variety of issues concerning in-line methods and monitors for process and yield improvement.

Download or read book Silicon Nitride and Silicon Dioxide Thin Insulating Films written by and published by . This book was released on 1999 with total page 306 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book The Physics and Chemistry of SiO2 and the Si SiO2 Interface 4 2000 written by Hisham Z. Massoud and published by . This book was released on 2000 with total page 562 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Proceedings of the 9th International Symposium on the Physical Failure Analysis of Integrated Circuits written by and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 2002 with total page 306 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Silicon Nitride Silicon Dioxide Thin Insulating Films and Other Emerging Diele c trics VIII written by Ram Ekwal Sah and published by The Electrochemical Society. This book was released on 2005 with total page 606 pages. Available in PDF, EPUB and Kindle. Book excerpt: