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Book Plasma Etching and Reactive Ion Etching

Download or read book Plasma Etching and Reactive Ion Etching written by J. W. Coburn and published by . This book was released on 1982 with total page 104 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Dry Etching for Microelectronics

Download or read book Dry Etching for Microelectronics written by R.A. Powell and published by Elsevier. This book was released on 2012-12-02 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume collects together for the first time a series of in-depth, critical reviews of important topics in dry etching, such as dry processing of III-V compound semiconductors, dry etching of refractory metal silicides and dry etching aluminium and aluminium alloys. This topical format provides the reader with more specialised information and references than found in a general review article. In addition, it presents a broad perspective which would otherwise have to be gained by reading a large number of individual research papers. An additional important and unique feature of this book is the inclusion of an extensive literature review of dry processing, compiled by search of computerized data bases. A subject index allows ready access to the key points raised in each of the chapters.

Book Encyclopedia of Microfluidics and Nanofluidics

Download or read book Encyclopedia of Microfluidics and Nanofluidics written by Dongqing Li and published by Springer Science & Business Media. This book was released on 2008-08-06 with total page 2242 pages. Available in PDF, EPUB and Kindle. Book excerpt: Covering all aspects of transport phenomena on the nano- and micro-scale, this encyclopedia features over 750 entries in three alphabetically-arranged volumes including the most up-to-date research, insights, and applied techniques across all areas. Coverage includes electrical double-layers, optofluidics, DNC lab-on-a-chip, nanosensors, and more.

Book Atomic Layer Processing

Download or read book Atomic Layer Processing written by Thorsten Lill and published by John Wiley & Sons. This book was released on 2021-06-28 with total page 306 pages. Available in PDF, EPUB and Kindle. Book excerpt: Learn about fundamental and advanced topics in etching with this practical guide Atomic Layer Processing: Semiconductor Dry Etching Technology delivers a hands-on, one-stop resource for understanding etching technologies and their applications. The distinguished scientist, executive, and author offers readers in-depth information on the various etching technologies used in the semiconductor industry, including thermal, isotropic atomic layer, radical, ion-assisted, and reactive ion etching. The book begins with a brief history of etching technology and the role it has played in the information technology revolution, along with a collection of commonly used terminology in the industry. It then moves on to discuss a variety of different etching techniques, before concluding with discussions of the fundamentals of etching reactor design and newly emerging topics in the field such as the role played by artificial intelligence in the technology. Atomic Layer Processing includes a wide variety of other topics as well, all of which contribute to the author's goal of providing the reader with an atomic-level understanding of dry etching technology sufficient to develop specific solutions for existing and emerging semiconductor technologies. Readers will benefit from: A complete discussion of the fundamentals of how to remove atoms from various surfaces An examination of emerging etching technologies, including laser and electron beam assisted etching A treatment of process control in etching technology and the role played by artificial intelligence Analyses of a wide variety of etching methods, including thermal or vapor etching, isotropic atomic layer etching, radical etching, directional atomic layer etching, and more Perfect for materials scientists, semiconductor physicists, and surface chemists, Atomic Layer Processing will also earn a place in the libraries of engineering scientists in industry and academia, as well as anyone involved with the manufacture of semiconductor technology. The author's close involvement with corporate research & development and academic research allows the book to offer a uniquely multifaceted approach to the subject.

Book Dry Etching Technology for Semiconductors

Download or read book Dry Etching Technology for Semiconductors written by Kazuo Nojiri and published by Springer. This book was released on 2014-10-25 with total page 126 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits. The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes. The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning etc.

Book Plasma Processing

Download or read book Plasma Processing written by R. G. Frieser and published by . This book was released on 1981 with total page 380 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Plasma Etching

Download or read book Plasma Etching written by M. Sugawara and published by OUP Oxford. This book was released on 1998-05-28 with total page 362 pages. Available in PDF, EPUB and Kindle. Book excerpt: The focus of this book is the remarkable advances in understanding of low pressure RF (radio frequency) glow discharges. A basic analytical theory and plasma physics are explained. Plasma diagnostics are also covered before the practicalities of etcher use are explored.

Book Glow Discharge Processes

Download or read book Glow Discharge Processes written by Brian Chapman and published by Wiley-Interscience. This book was released on 1980 with total page 434 pages. Available in PDF, EPUB and Kindle. Book excerpt: Develops detailed understanding of the deposition and etching of materials by sputtering discharge, and of etching of materials by chemically active discharge. Treats glow discharge at several levels from basic phenomena to industrial applications--practical techniques diligently related to fundamentals. Subjects range from voltage, distributions encountered in plasma etching systems to plasma-electron interactions that contribute to sustaining the discharge.

Book Introduction to Microfabrication

Download or read book Introduction to Microfabrication written by Sami Franssila and published by John Wiley & Sons. This book was released on 2005-01-28 with total page 424 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microfabrication is the key technology behind integrated circuits,microsensors, photonic crystals, ink jet printers, solar cells andflat panel displays. Microsystems can be complex, but the basicmicrostructures and processes of microfabrication are fairlysimple. Introduction to Microfabrication shows how the commonmicrofabrication concepts can be applied over and over again tocreate devices with a wide variety of structures andfunctions. Featuring: * A comprehensive presentation of basic fabrication processes * An emphasis on materials and microstructures, rather than devicephysics * In-depth discussion on process integration showing how processes,materials and devices interact * A wealth of examples of both conceptual and real devices Introduction to Microfabrication includes 250 homework problems forstudents to familiarise themselves with micro-scale materials,dimensions, measurements, costs and scaling trends. Both researchand manufacturing topics are covered, with an emphasis on silicon,which is the workhorse of microfabrication. This book will serve as an excellent first text for electricalengineers, chemists, physicists and materials scientists who wishto learn about microstructures and microfabrication techniques,whether in MEMS, microelectronics or emerging applications.

Book Plasma Etching of the Group III Nitrides

Download or read book Plasma Etching of the Group III Nitrides written by and published by . This book was released on 1996 with total page 3 pages. Available in PDF, EPUB and Kindle. Book excerpt: In reactive ion etching (RIE) of GaN, the ion bombardment can damage the material, so it is necessary to develop plasma etch processes. This paper reports etching of GaN in an ECR (electron cyclotron resonance) etch system using both the ECR/RIE mode and the RIE-only mode. Group III (Ga, In, Al) nitride ECR etching is reviewed as a function of plasma chemistry, power, temperature, and pressure; as the ECR microwave power increased, the ion density and etch rates increased, with the etch rate increasing the most for InN. GaN etch rates> 6500 Å/min have been observed in the ECR/RIE mode. 2 figs, 6 refs.

Book Investigation of Reactive Ion Etching Induced Damage in Silicon Trench Etching

Download or read book Investigation of Reactive Ion Etching Induced Damage in Silicon Trench Etching written by Ronald Paul Reade and published by . This book was released on 1988 with total page 168 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Fabrication and Design of Resonant Microdevices

Download or read book Fabrication and Design of Resonant Microdevices written by Behraad Bahreyni and published by William Andrew. This book was released on 2008-10-20 with total page 234 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses the main issues of fabrication and design, and applications of micromachined resonant devices, including techniques commonly used for processing the output signal of resonant micro-electro-mechanical systems (MEMS). Concepts of resonance are introduced, with an overview of fabrication techniques for micromachined devices – important to understand as design options will depend on how the device will be fabricated. Also explained: excitation and signal detection methods; an analytic model of device behavior (a valuable design tool); numerical simulation techniques; issues of damping and noise for resonant MEMS; electronic interfacing; packaging issues; and numerous examples of resonant MEMS from academia and industry. Offers numerous academic and industrial examples of resonant MEMS Provides an analytic model of device behaviour Explains two-port systems in detail Devotes ample space to excitation and signal detection methods Covers issues of damping and noise for resonant MEMS, two topics of particular importance for high-Q devices

Book Silicon Micromachining

    Book Details:
  • Author : Miko Elwenspoek
  • Publisher : Cambridge University Press
  • Release : 2004-08-19
  • ISBN : 9780521607674
  • Pages : 424 pages

Download or read book Silicon Micromachining written by Miko Elwenspoek and published by Cambridge University Press. This book was released on 2004-08-19 with total page 424 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive overview of the key techniques used in the fabrication of micron-scale structures in silicon; for graduate students and researchers.

Book Principles of Plasma Discharges and Materials Processing

Download or read book Principles of Plasma Discharges and Materials Processing written by Michael A. Lieberman and published by John Wiley & Sons. This book was released on 2005-04-08 with total page 795 pages. Available in PDF, EPUB and Kindle. Book excerpt: A Thorough Update of the Industry Classic on Principles of Plasma Processing The first edition of Principles of Plasma Discharges and Materials Processing, published over a decade ago, was lauded for its complete treatment of both basic plasma physics and industrial plasma processing, quickly becoming the primary reference for students and professionals. The Second Edition has been carefully updated and revised to reflect recent developments in the field and to further clarify the presentation of basic principles. Along with in-depth coverage of the fundamentals of plasma physics and chemistry, the authors apply basic theory to plasma discharges, including calculations of plasma parameters and the scaling of plasma parameters with control parameters. New and expanded topics include: * Updated cross sections * Diffusion and diffusion solutions * Generalized Bohm criteria * Expanded treatment of dc sheaths * Langmuir probes in time-varying fields * Electronegative discharges * Pulsed power discharges * Dual frequency discharges * High-density rf sheaths and ion energy distributions * Hysteresis and instabilities * Helicon discharges * Hollow cathode discharges * Ionized physical vapor deposition * Differential substrate charging With new chapters on dusty plasmas and the kinetic theory of discharges, graduate students and researchers in the field of plasma processing should find this new edition more valuable than ever.

Book Direct Alcohol Fuel Cells for Portable Applications

Download or read book Direct Alcohol Fuel Cells for Portable Applications written by Alexandra M. F. R. Pinto and published by Academic Press. This book was released on 2018-09-08 with total page 353 pages. Available in PDF, EPUB and Kindle. Book excerpt: Direct Alcohol Fuel Cells for Portable Applications: Fundamentals, Engineering and Advances presents the fundamental concepts, technological advances and challenges in developing, modeling and deploying fuel cells and fuel cell systems for portable devices, including micro and mini fuel cells. The authors review the fundamental science of direct alcohol fuel cells, covering, in detail, thermodynamics, electrode kinetics and electrocatalysis of charge-transfer reactions, mass and heat transfer phenomena, and basic modeling aspects. In addition, the book examines other fuels in DAFCs, such as formic acid, ethylene glycol and glycerol, along with technological aspects and applications, including case studies and cost analysis. Researchers, engineering professionals, fuel cell developers, policymakers and senior graduate students will find this a valuable resource. The book’s comprehensive coverage of fundamentals is especially useful for graduate students, advanced undergraduate students and those new to the field. Provides a comprehensive understanding of the fundamentals of DAFCs and their basic components, design and performance Presents current and complete information on the state-of-the-art of DAFC technology and its most relevant challenges for commercial deployment Includes practical application examples, problems and case studies Covers the use of other fuels, such as formic acid, ethylene glycol and glycerol

Book Plasma Processing of Materials

Download or read book Plasma Processing of Materials written by National Research Council and published by National Academies Press. This book was released on 1991-02-01 with total page 88 pages. Available in PDF, EPUB and Kindle. Book excerpt: Plasma processing of materials is a critical technology to several of the largest manufacturing industries in the worldâ€"electronics, aerospace, automotive, steel, biomedical, and toxic waste management. This book describes the relationship between plasma processes and the many industrial applications, examines in detail plasma processing in the electronics industry, highlights the scientific foundation underlying this technology, and discusses education issues in this multidisciplinary field. The committee recommends a coordinated, focused, and well-funded research program in this area that involves the university, federal laboratory, and industrial sectors of the community. It also points out that because plasma processing is an integral part of the infrastructure of so many American industries, it is important for both the economy and the national security that America maintain a strong leadership role in this technology.

Book Inductively coupled Plasma Reactive Ion Etching  ICP RIE  with HBR and Other Etch Chemistries of SI SIGE based Resonant Interband Tunnel Diodes Grown by Low Temperature Molecular Beam Epitaxy  LT MBE

Download or read book Inductively coupled Plasma Reactive Ion Etching ICP RIE with HBR and Other Etch Chemistries of SI SIGE based Resonant Interband Tunnel Diodes Grown by Low Temperature Molecular Beam Epitaxy LT MBE written by Si-Young Park and published by . This book was released on 2006 with total page 156 pages. Available in PDF, EPUB and Kindle. Book excerpt: Abstract: The International Technology Roadmap for Semiconductors (ITRS) forecasts that current semiconductor technology based on the mainstream silicon CMOS platform is approaching its scaling of limit. One emerging technology which may augment CMOS and extend its operational lifetime is tunneling devices together with transistors. Tunnel diode based circuits have superior performance regarding high speed operation concurrently with low power consumption. Si-based resonant interband tunnel diodes (RITD) developed by this research group that are grown epitaxially using low temperature molecular beam epitaxy (LT-MBE), now enable monolithic integration with Si CMOS and SiGe technology. This thesis focuses on the study of the plasma damage from inductively- coupled plasma reactive ion etching (ICP-RIE) processes using several different process gases, various ICP powers and substrate bias powers compared to wet etching techniques on Si-based diodes grown using low temperature molecular beam epitaxial (LT-MBE). Of particular interest and promise is an HBr etch chemistry that provides hydrogen passivation while etching. The minimization from incident ion damage and residual surface contamination during dry plasma etching is one of the key issues in modern VLSI manufacturing, especially as transistors/devices are scaled to below 50 nm lengths. Many researchers, therefore, are still developing many advanced techniques to reduce and minimize plasma damage created by dry plasma etching process.