Download or read book Photonics Packaging Integration and Interconnects IX written by and published by . This book was released on 2008 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Photonics Packaging Integration and Interconnects IX written by Alexei L. Glebov and published by Society of Photo Optical. This book was released on 2009 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: Includes Proceedings Vol. 7821
Download or read book Photonics Packaging Integration and Interconnects written by and published by . This book was released on 2007 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Photonics Packaging Integration and Interconnects VII written by Allen M. Earman and published by Society of Photo Optical. This book was released on 2007 with total page 274 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.
Download or read book Photonics Packaging Integration and Interconnects VIII written by Alexei L. Glebov and published by Society of Photo Optical. This book was released on 2008-01-01 with total page 364 pages. Available in PDF, EPUB and Kindle. Book excerpt: Includes Proceedings Vol. 7821
Download or read book High Speed Photonics Interconnects written by Lukas Chrostowski and published by CRC Press. This book was released on 2017-12-19 with total page 227 pages. Available in PDF, EPUB and Kindle. Book excerpt: Dramatic increases in processing power have rapidly scaled on-chip aggregate bandwidths into the Tb/s range. This necessitates a corresponding increase in the amount of data communicated between chips, so as not to limit overall system performance. To meet the increasing demand for interchip communication bandwidth, researchers are investigating the use of high-speed optical interconnect architectures. Unlike their electrical counterparts, optical interconnects offer high bandwidth and negligible frequency-dependent loss, making possible per-channel data rates of more than 10 Gb/s. High-Speed Photonics Interconnects explores some of the groundbreaking technologies and applications that are based on photonics interconnects. From the Evolution of High-Speed I/O Circuits to the Latest in Photonics Interconnects Packaging and Lasers Featuring contributions by experts from academia and industry, the book brings together in one volume cutting-edge research on various aspects of high-speed photonics interconnects. Contributors delve into a wide range of technologies, from the evolution of high-speed input/output (I/O) circuits to recent trends in photonics interconnects packaging. The book discusses the challenges associated with scaling I/O data rates and current design techniques. It also describes the major high-speed components, channel properties, and performance metrics. The book exposes readers to a myriad of applications enabled by photonics interconnects technology. Learn about Optical Interconnect Technologies Suitable for High-Density Integration with CMOS Chips This richly illustrated work details how optical interchip communication links have the potential to fully leverage increased data rates provided through complementary metal-oxide semiconductor (CMOS) technology scaling at suitable power-efficiency levels. Keeping the mathematics to a minimum, it gives engineers, researchers, graduate students, and entrepreneurs a comprehensive overview of the dynamic landscape of high-speed photonics interconnects.
Download or read book Advanced Electronics and Photonics Packaging Materials and Processing written by and published by . This book was released on 2015 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 3D Printing of Optical Components written by Andreas Heinrich and published by Springer Nature. This book was released on 2020-11-21 with total page 307 pages. Available in PDF, EPUB and Kindle. Book excerpt: This edited volume reviews the current state of the art in the additive manufacturing of optical componentry, exploring key principles, materials, processes and applications. A short introduction lets readers familiarize themselves with the fundamental principles of the 3D printing method. This is followed by a chapter on commonly-used and emerging materials for printing of optical components, and subsequent chapters are dedicated to specific topics and case studies. The high potential of additive manufactured optical components is presented based on different manufacturing techniques and accompanied with extensive examples – from nanooptics to large scale optics – and taking research and industrial perspectives. Readers are provided with an extensive overview of the new possibilities brought about by this alternative method for optical components manufacture. Finally, the limitations of the method with respect to manufacturing techniques, materials and optical properties of the generated objects are discussed. With contributions from experts in academia and industry, this work will appeal to a wide readership, from undergraduate students through engineers to researchers interested in modern methods of manufacturing optical components.
Download or read book Photonics Packaging and Integration written by and published by . This book was released on 2003 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book VCSELs written by Rainer Michalzik and published by Springer. This book was released on 2012-10-16 with total page 562 pages. Available in PDF, EPUB and Kindle. Book excerpt: The huge progress which has been achieved in the field is covered here, in the first comprehensive monograph on vertical-cavity surface-emitting lasers (VCSELs) since eight years. Apart from chapters reviewing the research field and the laser fundamentals, there are comprehensive updates on red and blue emitting VCSELs, telecommunication VCSELs, optical transceivers, and parallel-optical links for computer interconnects. Entirely new contributions are made to the fields of vectorial three-dimensional optical modeling, single-mode VCSELs, polarization control, polarization dynamics, very-high-speed design, high-power emission, use of high-contrast gratings, GaInNAsSb long-wavelength VCSELs, optical video links, VCSELs for optical mice and sensing, as well as VCSEL-based laser printing. The book appeals to researchers, optical engineers and graduate students.
Download or read book Coupled Data Communication Techniques for High Performance and Low Power Computing written by Ron Ho and published by Springer Science & Business Media. This book was released on 2010-06-03 with total page 214 pages. Available in PDF, EPUB and Kindle. Book excerpt: Wafer-scale integration has long been the dream of system designers. Instead of chopping a wafer into a few hundred or a few thousand chips, one would just connect the circuits on the entire wafer. What an enormous capability wafer-scale integration would offer: all those millions of circuits connected by high-speed on-chip wires. Unfortunately, the best known optical systems can provide suitably ?ne resolution only over an area much smaller than a whole wafer. There is no known way to pattern a whole wafer with transistors and wires small enough for modern circuits. Statistical defects present a ?rmer barrier to wafer-scale integration. Flaws appear regularly in integrated circuits; the larger the circuit area, the more probable there is a ?aw. If such ?aws were the result only of dust one might reduce their numbers, but ?aws are also the inevitable result of small scale. Each feature on a modern integrated circuit is carved out by only a small number of photons in the lithographic process. Each transistor gets its electrical properties from only a small number of impurity atoms in its tiny area. Inevitably, the quantized nature of light and the atomic nature of matter produce statistical variations in both the number of photons de?ning each tiny shape and the number of atoms providing the electrical behavior of tiny transistors. No known way exists to eliminate such statistical variation, nor may any be possible.
Download or read book Optoelectronic Interconnects VII Photonics Packaging and Integration II written by Michael R. Feldman and published by SPIE-International Society for Optical Engineering. This book was released on 2000 with total page 440 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book VCSELs for Cesium Based Miniaturized Atomic Clocks written by Ahmed Al-Samaneh and published by BoD – Books on Demand. This book was released on 2015-09-23 with total page 218 pages. Available in PDF, EPUB and Kindle. Book excerpt: Frequency standards or clocks provide time references for a wide range of applications such as synchronization of communication networks, remote sensing and global positioning. Over the last couple of decades, demands on the data rates of many communication systems have substantially increased, imposing more restricted requirements on the stability of their timing devices. At the same time applications have become more mobile, increasing the demand for small and low-power clocks. Atomic clocks have provided the most stable frequency references for more than 50 years. However, the size and power requirements of microwave-cavity-based atomic clocks prohibit them from being portable and battery-operated. Hence, research on miniaturized atomic clocks (MACs) has been initiated by various research groups. A European research project on MACs, funded by the European commission started in 2008. This dissertation reports on the achievements within the European research project in the development of suitable lasers for such atomic clocks. Vertical-cavity surface-emitting lasers (VCSELs) are compelling light sources for MACs because of their low power consumption, high modulation bandwidth, and favorable beam characteristics. VCSELs must feature polarization-stable single-mode emission. Additionally, they must provide narrow linewidth emission at a center wavelength of about 894.6nm and be well suited for harmonic modulation at about 4.6GHz in order to employ coherent population trapping effect at the cesium D1 line. The polarization orientation of the emitted light of a standard VCSEL is a priori unknown. Polarization control is achieved by etching a shallow surface grating in the top Bragg mirror. For the purpose of integration with the clock microsystem, flip-chip-bondable VCSEL designs are realized. Such designs facilitate a straightforward mounting and make the electrical contacts high-frequency compatible.
Download or read book Photonic Network on Chip Design written by Keren Bergman and published by Springer Science & Business Media. This book was released on 2013-08-13 with total page 220 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a comprehensive synthesis of the theory and practice of photonic devices for networks-on-chip. It outlines the issues in designing photonic network-on-chip architectures for future many-core high performance chip multiprocessors. The discussion is built from the bottom up: starting with the design and implementation of key photonic devices and building blocks, reviewing networking and network-on-chip theory and existing research, and finishing with describing various architectures, their characteristics, and the impact they will have on a computing system. After acquainting the reader with all the issues in the design space, the discussion concludes with design automation techniques, supplemented by provided software.
Download or read book Optical Fiber Telecommunications Volume VIA written by Ivan Kaminow and published by Academic Press. This book was released on 2013-05-03 with total page 795 pages. Available in PDF, EPUB and Kindle. Book excerpt: Optical Fiber Telecommunications VI (A&B) is the sixth in a series that has chronicled the progress in the R&D of lightwave communications since the early 1970s. Written by active authorities from academia and industry, this edition brings a fresh look to many essential topics, including devices, subsystems, systems and networks. A central theme is the enabling of high-bandwidth communications in a cost-effective manner for the development of customer applications. These volumes are an ideal reference for R&D engineers and managers, optical systems implementers, university researchers and students, network operators, and investors. Volume A is devoted to components and subsystems, including photonic integrated circuits, multicore and few-mode fibers, photonic crystals, silicon photonics, signal processing, and optical interconnections.
Download or read book International Symposium on Advances in Interconnection and Packaging 5 9 November 1990 Boston Massachusetts Book 2 Microelectronic Interconnects and written by Alfred P. DeFonzo and published by . This book was released on 1991-04 with total page 582 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Optoelectronic Interconnects Integrated Circuits and Packaging written by Louay A. Eldada and published by SPIE-International Society for Optical Engineering. This book was released on 2002 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt:
