Download or read book Phenomenological Reliability Modeling of Plastic Encapsulated Microcircuits written by Nikhil Kelkar and published by . This book was released on 1996 with total page 118 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Reliability of Microtechnology written by Johan Liu and published by Springer Science & Business Media. This book was released on 2011-02-07 with total page 216 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail. The book also includes exercises and detailed solutions at the end of each chapter.
Download or read book The International Journal of Microcircuits and Electronic Packaging written by and published by . This book was released on 1996 with total page 442 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microelectronics Packaging Handbook written by R.R. Tummala and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 1060 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
Download or read book Plastic Encapsulated Microcircuit Reliability and Cost Effectiveness Study written by and published by . This book was released on 1996 with total page 15 pages. Available in PDF, EPUB and Kindle. Book excerpt: This study evaluates the reliability and cost-effectiveness of using commercial plastic-encapsulated microcircuits (PEM) in a typical military system, with a view to increasing their acceptability in military applications. The cost comparison indicates an average 6-fold decrease in cost when commercial devices are used. Assurance testing did not reveal any special problems with commercial parts. Thus, if commercial PEM were proven to be sufficiently reliable for an intended military application, large cost savings would be gained by using them instead of hermetic packages. The 4.5 sigma enhanced inspection program and the process-control methods suggested here would enhance the manufacturing yield of the PLGR (precision lightweight global positioning system receiver) by encouraging improvements in the manufacturing process while simultaneously cutting the cost of a 100% rescreen to qualify the final product. Neither the requirements assurance tests (including the step-stress test-analyze-and-fix test), nor the reliability demonstration test, nor the operational test, showed more failures than are typical for any new development, and no problems unique to PEM were observed. Thus, the use of PEM did not lead to any special problems that caused PLGR-use specifications to be violated.
Download or read book Proceedings written by and published by . This book was released on 1997 with total page 336 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advances in Electronic Packaging written by and published by . This book was released on 1997 with total page 1316 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Encyclopedia of Materials written by K. H. J. Buschow and published by . This book was released on 2001 with total page 1008 pages. Available in PDF, EPUB and Kindle. Book excerpt: Accompanyind CR-ROM conrtains The Encyclopedia of Materials Science and Technology on a web access disc.
Download or read book Influence of Rapid Altitude Cycling on the Reliability of Plastic Encapsulated Microcircuits written by Casey James O'Connor and published by . This book was released on 2002 with total page 322 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Product Reliability Maintainability and Supportability Handbook written by Michael Pecht and published by CRC Press. This book was released on 1995-05-04 with total page 450 pages. Available in PDF, EPUB and Kindle. Book excerpt: This unique publication addresses the role of reliability, maintainability, and supportability in the life-cycle of a product, in the context of product effectiveness and worth. It emphasizes all aspects of producing an effective electrical or mechanical system. This is the only handbook available on this subject and the only book that is this comprehensive and informative. The Product Reliability, Maintainability, and Supportability Handbook examines the logistics, cost, and the physics of failure-topics never before found in a single volume on reliability. It describes the factors that affect product effectiveness and worth: performance, reliability, design effectiveness and margin for error, availability, affordability, use effectiveness, and logistic effectiveness. The handbook contains 13 in-depth chapters, opening with an introduction on product effectiveness and worth and concluding with reliability and maintainability data that can be combined with performance data to assess overall effectiveness of the product. The pages are filled with valuable information that can be easily and quickly put to practical use. Basic principles of the mathematical theory of probability and necessary background are provided. Concepts and basic theory of reliability in terms of probability and statistical inference are also given. Techniques for deriving probabilistic models from observational data as well as reliability models and associated validation techniques are detailed. Software and software reliability, quality, and safety are all covered, including the development life-cycle process and mechanisms by which software errors are introduced. The book presents design guidelines and techniques and the requirements for materials, manufacturing, and assembly. Learn how to analyze the reliability of redundant and fault-tolerant products. Use the methods for modeling and analyzing failures of repairable products that normally exhibit wearout characteristics. The Product Reliability, Maintainability, and Supportability Handbook also provides reliability improvement techniques to improve the competitiveness of existing products. The book includes helpful summaries and numerous problem sections to reinforce and test learned information. This reference source is the guide that professionals and technical managers should turn to when they need a comprehensive and detailed overview of everything that goes into producing systems and products that meet customer needs in an effective and timely manner.
Download or read book Electrical Electronics Abstracts written by and published by . This book was released on 1995 with total page 1576 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Moisture Sensitivity of Plastic Packages of IC Devices written by X.J. Fan and published by Springer Science & Business Media. This book was released on 2010-07-23 with total page 573 pages. Available in PDF, EPUB and Kindle. Book excerpt: Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.
Download or read book Micro and Opto Electronic Materials and Structures Physics Mechanics Design Reliability Packaging written by Ephraim Suhir and published by Springer Science & Business Media. This book was released on 2007-05-26 with total page 1471 pages. Available in PDF, EPUB and Kindle. Book excerpt: This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
Download or read book Plastic Encapsulated Microelectronics written by Michael Pecht and published by Wiley-Interscience. This book was released on 1995-02-20 with total page 520 pages. Available in PDF, EPUB and Kindle. Book excerpt: Until now, professionals in search of detailed information about the latest developments in PEM design and production have had to waste valuable time browsing through countless professional journals, monographs, and databases.
Download or read book Digital Integrated Circuit Design written by Hubert Kaeslin and published by Cambridge University Press. This book was released on 2008-04-28 with total page 878 pages. Available in PDF, EPUB and Kindle. Book excerpt: This practical, tool-independent guide to designing digital circuits takes a unique, top-down approach, reflecting the nature of the design process in industry. Starting with architecture design, the book comprehensively explains the why and how of digital circuit design, using the physics designers need to know, and no more.
Download or read book Fiber Optics Engineering written by Mohammad Azadeh and published by Springer Science & Business Media. This book was released on 2009-08-05 with total page 378 pages. Available in PDF, EPUB and Kindle. Book excerpt: Within the past few decades, information technologies have been evolving at a tremendous rate, causing profound changes to our world and our ways of life. In particular, fiber optics has been playing an increasingly crucial role within the telecommunication revolution. Not only most long-distance links are fiber based, but optical fibers are increasingly approaching the individual end users, providing wide bandwidth links to support all kinds of data-intensive applications such as video, voice, and data services. As an engineering discipline, fiber optics is both fascinating and challenging. Fiber optics is an area that incorporates elements from a wide range of techno- gies including optics, microelectronics, quantum electronics, semiconductors, and networking. As a result of rapid changes in almost all of these areas, fiber optics is a fast evolving field. Therefore, the need for up-to-date texts that address this growing field from an interdisciplinary perspective persists. This book presents an overview of fiber optics from a practical, engineering perspective. Therefore, in addition to topics such as lasers, detectors, and optical fibers, several topics related to electronic circuits that generate, detect, and process the optical signals are covered. In other words, this book attempts to present fiber optics not so much in terms of a field of “optics” but more from the perspective of an engineering field within “optoelectronics.
Download or read book Die Attach Materials for High Temperature Applications in Microelectronics Packaging written by Kim S. Siow and published by Springer. This book was released on 2019-01-29 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.
