Download or read book Ninth International Symposium on Quality Electronic Design written by International Symposium on Quality Electronic Design and published by . This book was released on 2008 with total page 885 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings of the Twenty Third International Symposium on Quality Electronic Design written by and published by . This book was released on 2022 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2008 9th International Symposium on Quality Electronic Design written by IEEE Staff and published by IEEE. This book was released on 2008-12-10 with total page 851 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Special Section 6th International Symposium on Quality Electronic Design ISQED written by Daniela De Venuto and published by . This book was released on 2007 with total page 203 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book International Symposium on Quality Electronic Design written by and published by IEEE Computer Society Press. This book was released on 2002 with total page 584 pages. Available in PDF, EPUB and Kindle. Book excerpt: Annotation Fifty-one papers and 21 posters from the March 2002 symposium report current research in deep submicron integrated circuit design and development. The sessions address interconnect extraction and modeling, design for process variations, metrics, power and noise management, verification, signal integrity, and low power design techniques. Some of the topics are transition aware global signaling (TAGS), the interoperability of EDA tools for sequential logic synthesis, statistical methods for the determination of process corners, power supply noise suppression via clock skew scheduling, and the relation between SAT and BDDs for equivalence checking. No subject index. Annotation copyrighted by Book News Inc., Portland, OR.
Download or read book VLSI Design and Test written by Brajesh Kumar Kaushik and published by Springer. This book was released on 2017-12-21 with total page 815 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the refereed proceedings of the 21st International Symposium on VLSI Design and Test, VDAT 2017, held in Roorkee, India, in June/July 2017. The 48 full papers presented together with 27 short papers were carefully reviewed and selected from 246 submissions. The papers were organized in topical sections named: digital design; analog/mixed signal; VLSI testing; devices and technology; VLSI architectures; emerging technologies and memory; system design; low power design and test; RF circuits; architecture and CAD; and design verification.
Download or read book Physical Design for 3D Integrated Circuits written by Aida Todri-Sanial and published by CRC Press. This book was released on 2017-12-19 with total page 529 pages. Available in PDF, EPUB and Kindle. Book excerpt: Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
Download or read book Advanced Packaging written by and published by . This book was released on 2008-01 with total page 40 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.
Download or read book VLSI Noise Processing Circuits Theoretical Bases and Implementations written by Hongjiang Song and published by Lulu.com. This book was released on with total page 390 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book High Speed and Lower Power Technologies written by Jung Han Choi and published by CRC Press. This book was released on 2018-09-03 with total page 348 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explores up-to-date research trends and achievements on low-power and high-speed technologies in both electronics and optics. It offers unique insight into low-power and high-speed approaches ranging from devices, ICs, sub-systems and networks that can be exploited for future mobile devices, 5G networks, Internet of Things (IoT), and data centers. It collects heterogeneous topics in place to catch and predict future research directions of devices, circuits, subsystems, and networks for low-power and higher-speed technologies. Even it handles about artificial intelligence (AI) showing examples how AI technology can be combined with concurrent electronics. Written by top international experts in both industry and academia, the book discusses new devices, such as Si-on-chip laser, interconnections using graphenes, machine learning combined with CMOS technology, progresses of SiGe devices for higher-speed electronices for optic, co-design low-power and high-speed circuits for optical interconnect, low-power network-on-chip (NoC) router, X-ray quantum counting, and a design of low-power power amplifiers. Covers modern high-speed and low-power electronics and photonics. Discusses novel nano-devices, electronics & photonic sub-systems for high-speed and low-power systems, and many other emerging technologies like Si photonic technology, Si-on-chip laser, low-power driver for optic device, and network-on-chip router. Includes practical applications and recent results with respect to emerging low-power systems. Addresses the future perspective of silicon photonics as a low-power interconnections and communication applications.
Download or read book Power Electronic Packaging written by Yong Liu and published by Springer Science & Business Media. This book was released on 2012-02-15 with total page 606 pages. Available in PDF, EPUB and Kindle. Book excerpt: Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
Download or read book Wafer Level Chip Scale Packaging written by Shichun Qu and published by Springer. This book was released on 2014-09-10 with total page 336 pages. Available in PDF, EPUB and Kindle. Book excerpt: Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.
Download or read book Proceedings of Ninth International Congress on Information and Communication Technology written by Xin-She Yang and published by Springer Nature. This book was released on with total page 670 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Frequency Measurement Technology written by Ignacio Llamas-Garro and published by Artech House. This book was released on 2017-12-31 with total page 222 pages. Available in PDF, EPUB and Kindle. Book excerpt: This unique first-of-its-kind resource provides practical coverage of the design and implementation of frequency measurement receivers, which aid in identifying unknown signals. The technologies used in frequency measurement interferometry-based on-delay lines and filters are explored in this book. Practitioners also find concrete examples of microwave photonics implementations. The designs and concepts that cover conventional photonic instantaneous frequency measurement (IFM) circuits are explained. This book provides details on new designs for microwave photonic circuits and reconfigurable frequency measurement (RFM) circuits using diodes and MicroElectroMechanical Systems (MEMS). This book explains the many diverse applications of frequency measurement that are used in defense, radar, and communications. The instrumentation used to perform frequency measurements is explained, including the use of block analysis for network and spectrum analyzers and calibration techniques. Readers learn the advantages of using frequency measurement based on microwave/RF techniques, including immunity to electromagnetic interference, low loss, compatibility with fiber signal distribution, and parallel processing signals. Moreover, readers gain insight into the future of frequency measurement receivers. The book examines both the underpinnings and the implementation of frequency measurement receivers using many diverse technological platforms.
Download or read book Handbook of Energy Aware and Green Computing Two Volume Set written by Ishfaq Ahmad and published by CRC Press. This book was released on 2016-02-03 with total page 1284 pages. Available in PDF, EPUB and Kindle. Book excerpt: Implementing energy-efficient CPUs and peripherals as well as reducing resource consumption have become emerging trends in computing. As computers increase in speed and power, their energy issues become more and more prevalent. The need to develop and promote environmentally friendly computer technologies and systems has also come to the forefront
Download or read book ISLPED 03 written by and published by . This book was released on 2003 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Low Power Semiconductor Devices and Processes for Emerging Applications in Communications Computing and Sensing written by Sumeet Walia and published by CRC Press. This book was released on 2018-08-06 with total page 380 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book addresses the need to investigate new approaches to lower energy requirement in multiple application areas and serves as a guide into emerging circuit technologies. It explores revolutionary device concepts, sensors, and associated circuits and architectures that will greatly extend the practical engineering limits of energy-efficient computation. The book responds to the need to develop disruptive new system architectures and semiconductor processes aimed at achieving the highest level of computational energy efficiency for general purpose computing systems. Discusses unique technologies and material only available in specialized journal and conferences. Covers emerging materials and device structures, such as ultra-low power technologies, nanoelectronics, and microsystem manufacturing. Explores semiconductor processing and manufacturing, device design, and performance. Contains practical applications in the engineering field, as well as graduate studies. Written by international experts from both academia and industry.
