Download or read book Natural Convection Immersion Cooling of an Array of Vertically Oriented Heated Protrusions in an Enclosure Filled with a Dielectric Liquid Effects of Enclosure Width Prandtl Number and Component Orientation written by Scott T. Matthews and published by . This book was released on 1991 with total page 97 pages. Available in PDF, EPUB and Kindle. Book excerpt: The natural convection heat transfer characteristics of a 3x3 array of vertically oriented heated protrusions, immersed in a dielectric liquid, were investigated. Aluminum blocks, 24mm x 8mm x 6mm, were used to simulate 20 pin dual in-line packages. Surface temperature measurements of the components were made by imbedding copper-constantan thermocouples below the surface of each component face. A constant heat flux was provided to each component using an Inconel foil heating element. Power supplied to each component varied from 0.115W to 2.90W. The aluminum blocks were mounted on a plexiglass substrate to form a 3x3 array of simulated electronic components. The circuit board containing the components was placed in a rectangular, plexiglass enclosure with inner dimensions: L = 203.2mm H = 152.0mm W = 82.6mm, and a wall thickness of 25.4mm. The upper boundary was maintained at 10 C, while all other exterior surfaces were insulated. The chamber width, measured from the surface of the circuit board to the opposite, inner wall of the enclosure, was varied from 42mm to 7mm by inserting plexiglass spacers into the enclosure. Two dielectric liquids, FC-75 and FC-43, were used as working fluids. Non dimensional data from this study was combined with the data obtained for a horizontal component orientation, to develop an empirical correlation which predicts the Nusselt number as a function of Rayleigh number, Prandtl number, component orientation and chamber width. This correlation was found to be accurate to within 11% of the original curve fit data.
Download or read book Natural Convection Immersion Cooling of an Array of Vertically Oriented Heated Protrusions in an Enclosure Filled with a Dielectric Liquid Effects of Enclosure Width Prandtl Number and Component Orientation written by and published by . This book was released on 1991 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: The natural convection heat transfer characteristics of a 3x3 array of vertically oriented heated protrusions, immersed in a dielectric liquid, were investigated. Aluminum blocks, 24mm x 8mm x 6mm, were used to simulate 20 pin dual in-line packages. Surface temperature measurements of the components were made by imbedding copper-constantan thermocouples below the surface of each component face. A constant heat flux was provided to each component using an Inconel foil heating element. Power supplied to each component varied from 0.115W to 2.90W. The aluminum blocks were mounted on a plexiglass substrate to form a 3x3 array of simulated electronic components. The circuit board containing the components was placed in a rectangular, plexiglass enclosure with inner dimensions: L = 203.2mm H = 152.0mm W = 82.6mm, and a wall thickness of 25.4mm. The upper boundary was maintained at 10 C, while all other exterior surfaces were insulated. The chamber width, measured from the surface of the circuit board to the opposite, inner wall of the enclosure, was varied from 42mm to 7mm by inserting plexiglass spacers into the enclosure. Two dielectric liquids, FC-75 and FC-43, were used as working fluids. Non dimensional data from this study was combined with the data obtained for a horizontal component orientation, to develop an empirical correlation which predicts the Nusselt number as a function of Rayleigh number, Prandtl number, component orientation and chamber width. This correlation was found to be accurate to within 11% of the original curve fit data.
Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1992-11 with total page 652 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Natural Convection Immersion Cooling of an Array of Heated Protrusions in an Enclosure Filled with Dielectric Liquid written by Erol Aytar and published by . This book was released on 1991 with total page 161 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Natural Convection Cooling of a 3 by 3 Array of Rectangular Protrusions in an Enclosure Filled with Dielectric Liquid written by Edgardo I. Torres and published by . This book was released on 1988 with total page 138 pages. Available in PDF, EPUB and Kindle. Book excerpt: An experimental investigation of natural convection immersion cooling of two configurations of discrete heat sources in an enclosure filled with Fluorinert FC-75 has been conducted. A three by three array of rectangular protrusions was employed. In the first study, using the same equipment set-up of Benedict, the influence of changing the enclosure bottom surface boundary condition of flow patterns and heat transfer characteristics was examined. Both insulated and uniform temperature boundary conditions were considered. In the second set of experiments, a new chamber with the protrusions oriented vertically was assembled and effects of component orientation on the heat transfer characteristics were examined. In addition, timewise variations of temperature in several locations were measured an interpreted a different power levels. Theses. Keywords: Direct Immersion, Natural Convection Cooling, Dielectric Liquid Protrusions, Enclosure, Simulated Circuit Board, Strip Heaters, Flow Visualization, Convective Heat Transfer. (MJM).
Download or read book Heat Transfer Enhancement in Electronics Cooling written by American Society of Mechanical Engineers. Winter Annual Meeting and published by American Society of Mechanical Engineers. This book was released on 1991 with total page 80 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Natural Convection Form an Array of Rectangular Protrusions in an Enclosure Filled with Dielectric Fluid Effects of Boundary Conditions Fluid Prandtl Number and Selective Powering written by Mark E. Powell and published by . This book was released on 1989 with total page 101 pages. Available in PDF, EPUB and Kindle. Book excerpt: An experimental investigation has been conducted to further examine Natural Convection Immersion Cooling of a three by three array of heated protrusions in a rectangular chamber filled with dielectric fluid. Each rectangular protrusion geometrically modelled a 20 pin dual inline package. Input power to each component varied from 0.1 to 3.0 W. The purpose of this study was to examine the effects of the following parameters for the range of power levels selected: 1) Top and bottom boundary temperatures; 2) Selective powering of components; 3) Changes in the fluid Prandtl number. The data were obtained as component surface temperatures. These were subsequently presented in terms of appropriate non-dimensional parameters. As part of the overall investigation, flow visualization results are also presented for selected conditions. Keywords: Theses; Direct immersion; Natural convection cooling; Dielectric liquid protrusions; Enclosure; Simulated circuit board; Convective heat transfer. (JHD).
Download or read book Government Reports Annual Index written by and published by . This book was released on 1992 with total page 1232 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book An Advanced Study of Natural Convection Immersion Cooling of a 3 X 3 Array of Simulated Components in an Enclosure Filled with Dielectric Liquid written by Terry J. Benedict and published by . This book was released on 1988 with total page 113 pages. Available in PDF, EPUB and Kindle. Book excerpt: An experimental study has been conducted to examine the three dimensional natural convection heat transfer from an array of simulated electronic components immersed in a chamber filled with Fluorinert FC-75, a commercially available dielectric liquid. The top and bottom walls of the chamber were maintained at uniform temperature while all other surfaces were insulated. The simulated components were in the form of a 3 x 3 array of discrete protruding aluminum blocks, each with geometrical dimensions of a 20 Pin Dual-inline-Package. The components were electrically powered resulting in a range of energy dissipation levels from 0.1 to 3.1 watts. Flow visualization in steady state was accomplished using Magnesium particles illuminated by a Helium Neon laser plane. Component surface temperature measurements allowed determination of the heat transfer characteristics. Timewise fluctuations of temperature at several locations were measured with increasing power levels. Keywords: Computer programs, Electronic cooling, Protruding heat sources, Flow visualization, Convective heat transfer, Immersion cooling, Dielectric liquids, Theses. (jhd).
Download or read book An Advanced Study of Natural Convection Immersion Cooling of a 3 X 3 Array of Simulated Components in an Enclosure Filled with Dielectric Liquid written by and published by . This book was released on 1988 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: An experimental study has been conducted to examine the three dimensional natural convection heat transfer from an array of simulated electronic components immersed in a chamber filled with Fluorinert FC-75, a commercially available dielectric liquid. The top and bottom walls of the chamber were maintained at uniform temperature while all other surfaces were insulated. The simulated components were in the form of a 3 x 3 array of discrete protruding aluminum blocks, each with geometrical dimensions of a 20 Pin Dual-inline-Package. The components were electrically powered resulting in a range of energy dissipation levels from 0.1 to 3.1 watts. Flow visualization in steady state was accomplished using Magnesium particles illuminated by a Helium Neon laser plane. Component surface temperature measurements allowed determination of the heat transfer characteristics. Timewise fluctuations of temperature at several locations were measured with increasing power levels. Keywords: Computer programs, Electronic cooling, Protruding heat sources, Flow visualization, Convective heat transfer, Immersion cooling, Dielectric liquids, Theses. (jhd).
Download or read book Natural Convection Heat Transfer Studies of Simulated and Actual Electronic Components Using Dielectric Liquids for Immersion Cooling written by Ronald G. Thompson and published by . This book was released on 1992 with total page 104 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Government Reports Announcements Index written by and published by . This book was released on 1992 with total page 1246 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Natural Convection from an Array of Rectangular Protrusions in an Enclosure Filled with Dielectric Fluid written by Mark E. Powell and published by . This book was released on 1989 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Natural Convection Immersion Cooling of an Array of Simulated Chips in an Enclosure Filled with Dielectric Liquid written by Turgay Pamuk and published by . This book was released on 1987 with total page 71 pages. Available in PDF, EPUB and Kindle. Book excerpt: An experimental natural convection heat transfer study of a simulated electronic circuit board has been conducted. The board has an array of 9 simulated chips, each dissipating up to 2.5 Watts. The board is immersed in FC75, a fluorocarbon liquid, in an enclosure whose top and bottom surfaces are constant temperature heat sinks. The experimental data have been expressed in terms of relevant dimensionless heat transfer parameters such as Nusselt and Rayleigh numbers. The trend is that, the chips located higher in the enclosure have lower heat transfer rates. Otherwise the chips in the same row behave in a similar way which implies a quasi-two dimensionality. Keywords: Electronic cooling.
Download or read book Experiments on Liquid Immersion Natural Convection Cooling of Leadless Chip Carriers Mounted on Ceramic Substrate written by Rufino A. Paje and published by . This book was released on 1989 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: An experimental investigation of natural convection heat transfer from a commercially available semiconductor device package is presented. The package was centrally mounted on a ceramic substrate. The package-substrate assembly formed one surface of a dielectric-filled cubical enclosure of aspect ratio one. The top surface of the enclosure was maintained at prescribed temperature. Surface temperature measurements were made at various locations on the substrate, the package lid, as well as the chip center. These measurements are reported for three dielectric fluids and three enclosures top surface temperatures, both with the substrate oriented horizontally as well as vertically. The results indicate that the maximum input power without exceeding a chip junction temperature of 80 C is 2.58 watts with FC-75 as the cooling fluid and the upper boundary maintained at 15 C. This is significantly larger than the maximum of 1.21 watts allowable with the natural convection air cooling. Keywords: Theses; Heat transfer; Heat conductance; Leadless chip carriers; Liquid immersion; Cooling natural convection. (kt).
Download or read book A Study of Natural Convection Cooling of Multiple Discrete Heat Sources in a Vertical Channel written by Thomas D. Willson and published by . This book was released on 1988 with total page 147 pages. Available in PDF, EPUB and Kindle. Book excerpt: Natural convection liquid cooling of simulated electronic components in a vertical channel was investigated. The test surface contained a single column of eight rectangular, protruding heated elements, each simulating a 20 pin dual-in-line package. Temperature measurements and flow visualization were performed for a number of power dissipation levels and channel widths. Collectively, this information was used in interpreting the flow and transport characteristics. A correlation to predict the heat transfer rates was developed based on the component surface temperatures. Optimum channel widths were determined from these surface temperature measurements for the range of power levels investigated. Temperature distributions in the fluid were measured using a traversing thermocouple probe. Keywords include: Natural convection; Immersion cooling; Protruding heat sources; Vertical channel; and Flow visualization, Theses. (RH).
Download or read book Natural Convection Cooling of Vertical Plates in an Enclosure written by Axel Destremau and published by . This book was released on 1991 with total page 160 pages. Available in PDF, EPUB and Kindle. Book excerpt:
