Download or read book Modelling sic and Analysis of High speed Sources and Serial Links for Signal Integrity written by Siming Pan and published by . This book was released on 2010 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: "As the computer and electronics industry moves towards higher data rates, signal integrity and electromagnetic interference (EMI) problems always present challenges for designers for high-speed data communication systems. To characterize the entire link path between transmitters and receivers, accurate models for sources, passive link path (such as traces, vias, connectors, etc), and terminations should be built before simulations either in frequency or time domain. Due to the imperfection of model, data corrections are preferred before time-domain simulations to ensure stability. Moreover, data obtained from models should be compared with measurement results to judge the level of agreement for validations. This thesis presents a new approach to model via structures to help design signal link path while maintaining a low insertion loss and minimizing crosstalk, borrowing the concepts from the transmission line theories. For the models of sources, a dipole model is proposed to represent integrated circuit (IC) radiation emissions while a circuit model for I/O current source is proposed for IC conductive emissions. Passivity and causality are two important properties for passive networks. This thesis also presents detailed algorithm to check passivity and causality for networks with arbitrary port numbers. Data corrections in term of passivity and causality enforcement are applied based on matrix perturbation theory. Last but not least, Feature Selective Validation (FSV) technique is expanded in this thesis to quantify the comparisons of data sets and provide quantitative standard for data optimization"--Abstract, leaf iii

Download or read book High Speed Signaling written by Kyung Suk (Dan) Oh and published by Prentice Hall. This book was released on 2011-10-07 with total page 608 pages. Available in PDF, EPUB and Kindle. Book excerpt: New System-Level Techniques for Optimizing Signal/Power Integrity in High-Speed Interfaces--from Pioneering Innovators at Rambus, Stanford, Berkeley, and MIT As data communication rates accelerate well into the multi-gigahertz range, ensuring signal integrity both on- and off-chip has become crucial. Signal integrity can no longer be addressed solely through improvements in package or board-level design: Diverse engineering teams must work together closely from the earliest design stages to identify the best system-level solutions. In High-Speed Signaling, several of the field’s most respected practitioners and researchers introduce cutting-edge modeling, simulation, and optimization techniques for meeting this challenge. Edited by pioneering experts Drs. Dan Oh and Chuck Yuan, these contributors explain why noise and jitter are no longer separable, demonstrate how to model their increasingly complex interactions, and thoroughly introduce a new simulation methodology for predicting link-level performance with unprecedented accuracy. The authors address signal integrity from architecture through high-volume production, thoroughly discussing design, implementation, and verification. Coverage includes New advances in passive-channel modeling, power-supply noise and jitter modeling, and system margin prediction Methodologies for balancing system voltage and timing budgets to improve system robustness in high-volume manufacturing Practical, stable formulae for converting key network parameters Improved solutions for difficult problems in the broadband modeling of interconnects Equalization techniques for optimizing channel performance Important new insights into the relationships between jitter and clocking topologies New on-chip measurement techniques for in-situ link performance testing Trends and future directions in signal integrity engineering High-Speed Signaling thoroughly introduces new techniques pioneered at Rambus and other leading high-tech companies and universities: approaches that have never before been presented with this much practical detail. It will be invaluable to everyone concerned with signal integrity, including signal and power integrity engineers, high-speed I/O circuit designers, and system-level board design engineers.

Download or read book High Speed Serial Link written by Moises Cases and published by Wiley. This book was released on 2025-07-08 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the high speed serial (HSS) system design as it relates to electronic system design engineers, electronic packaging engineers and to signal and power integrity engineers. The book covers basic concepts input/output (I/O) signalling including trends, protocols, basic signal and power integrity concepts, an overview of current HSS system design and specifications, channel loss components, typical HSS topologies, electrical modelling methodology and techniques, link simulation techniques, link analysis and optimization, and link measurement parameters and techniques. It includes practical design examples and recommendations, as well as typical measurement parameter values and failure analysis.

Download or read book Jitter Noise and Signal Integrity at High Speed written by Mike Peng Li and published by Pearson Education. This book was released on 2007-11-19 with total page 443 pages. Available in PDF, EPUB and Kindle. Book excerpt: State-of-the-art JNB and SI Problem-Solving: Theory, Analysis, Methods, and Applications Jitter, noise, and bit error (JNB) and signal integrity (SI) have become today‘s greatest challenges in high-speed digital design. Now, there’s a comprehensive and up-to-date guide to overcoming these challenges, direct from Dr. Mike Peng Li, cochair of the PCI Express jitter standard committee. One of the field’s most respected experts, Li has brought together the latest theory, analysis, methods, and practical applications, demonstrating how to solve difficult JNB and SI problems in both link components and complete systems. Li introduces the fundamental terminology, definitions, and concepts associated with JNB and SI, as well as their sources and root causes. He guides readers from basic math, statistics, circuit and system models all the way through final applications. Emphasizing clock and serial data communications applications, he covers JNB and SI simulation, modeling, diagnostics, debugging, compliance testing, and much more.

Download or read book High Speed Signaling written by Kyung Suk Oh and published by . This book was released on 2011 with total page 528 pages. Available in PDF, EPUB and Kindle. Book excerpt: New System-Level Techniques for Optimizing Signal/Power Integrity in High-Speed Interfaces--from Pioneering Innovators at Rambus, Stanford, Berkeley, and MIT As data communication rates accelerate well into the multi-gigahertz range, ensuring signal integrity both on- and off-chip has become crucial. Signal integrity can no longer be addressed solely through improvements in package or board-level design: Diverse engineering teams must work together closely from the earliest design stages to identify the best system-level solutions. In High-Speed Signaling, several of the field's most respected practitioners and researchers introduce cutting-edge modeling, simulation, and optimization techniques for meeting this challenge. Edited by pioneering experts Drs. Dan Oh and Chuck Yuan, these contributors explain why noise and jitter are no longer separable, demonstrate how to model their increasingly complex interactions, and thoroughly introduce a new simulation methodology for predicting link-level performance with unprecedented accuracy. The authors address signal integrity from architecture through high-volume production, thoroughly discussing design, implementation, and verification. Coverage includes New advances in passive-channel modeling, power-supply noise and jitter modeling, and system margin prediction Methodologies for balancing system voltage and timing budgets to improve system robustness in high-volume manufacturing Practical, stable formulae for converting key network parameters Improved solutions for difficult problems in the broadband modeling of interconnects Equalization techniques for optimizing channel performance Important new insights into the relationships between jitter and clocking topologies New on-chip measurement techniques for in-situ link performance testing Trends and future directions in signal integrity engineering High-Speed Signaling thoroughly introduces new techniques pioneered at Rambus and other leading high-tech companies and universities: approaches that have never before been presented with this much practical detail. It will be invaluable to everyone concerned with signal integrity, including signal and power integrity engineers, high-speed I/O circuit designers, and system-level board design engineers.

Download or read book Signal and Power Integrity Simplified written by Eric Bogatin and published by Prentice Hall. This book was released on 2017-12-05 with total page 1169 pages. Available in PDF, EPUB and Kindle. Book excerpt: The #1 Practical Guide to Signal Integrity Design—with Revised Content and New Questions and Problems! This book brings together up-to-the-minute techniques for finding, fixing, and avoiding signal integrity problems in your design. Drawing on his work teaching several thousand engineers and graduate students, world-renowned expert Eric Bogatin systematically presents the root causes of all six families of signal integrity, power integrity, and electromagnetic compatibility problems. Bogatin reviews essential principles needed to understand these problems, and shows how to use best design practices and techniques to prevent or address them early in the design cycle. To help test and reinforce your understanding, this new edition adds questions and problems throughout. Bogatin also presents more examples using free tools, plus new content on high-speed serial links, reflecting input from 130+ of his graduate students. • A fully up-to-date introduction to signal integrity and physical design • New questions and problems designed for both students and professional engineers • How design and technology selection can make or break power distribution network performance • Exploration of key concepts, such as plane impedance, spreading inductance, decoupling capacitors, and capacitor loop inductance • Practical techniques for analyzing resistance, capacitance, inductance, and impedance • Using QUCS to predict waveforms as voltage sources are affected by interconnect impedances • Identifying reflections and crosstalk with free animation tools • Solving signal integrity problems via rules of thumb, analytic approximation, numerical simulation, and measurement • Understanding how interconnect physical design impacts signal integrity • Managing differential pairs and losses • Harnessing the full power of S-parameters in high-speed serial link applications • Designing high-speed serial links associated with differential pairs and lossy lines—including new coverage of eye diagrams • Ensuring power integrity throughout the entire power distribution path • Realistic design guidelines for improving signal integrity, and much more For professionals and students at all levels of experience, this book emphasizes intuitive understanding, practical tools, and engineering discipline, rather than theoretical derivation or mathematical rigor. It has earned a well-deserved reputation as the #1 resource for getting signal integrity designs right—first time, every time.

Download or read book Digital Signal Integrity written by Brian Young and published by Prentice Hall. This book was released on 2001 with total page 570 pages. Available in PDF, EPUB and Kindle. Book excerpt: State-of-the-art techniques for predicting and achieving target performance levels Theory, practice, general signal integrity issues, and leading-edge experimental techniques Model and simulate high-speed digital systems for maximum performance Maximizing the performance of digital systems means optimizing their high-speed interconnections. Digital Signal Integrity gives engineers all the theory and practical methods they need to accurately model and simulate those interconnections and predict real-world performance. Whether you're modeling microprocessors, memories, DSPs, or ASICs, these techniques will get you to market faster with greater reliability. Coverage includes: In-depth reviews of inductance, capacitance, resistance, single and multiconductor transmission lines, generalized termination schemes, crosstalk, differential signaling, and other modeling/simulation issues Multiconductor interconnects: packages, sockets, connectors and buses Modal decomposition: understanding the outputs generated by commercial modeling software Layer peeling with time-domain reflectometry: its power and limitations Experimental techniques for characterizing interconnect parasitics In Digital Signal Integrity, Motorola senior engineer Brian Young presents broad coverage of modeling from data obtained through electromagnetic simulation, transmission line theory, frequency and time-domain modeling, analog circuit simulation, digital signaling, and architecture. Young offers a strong mathematical foundation for every technique, as well as over 100 end-of-chapter problems. If you're stretching the performance envelope, you must be able to rely on your models and simulations. With this book, you can.

Download or read book High speed Circuit Board Signal Integrity written by Stephen C. Thierauf and published by Artech House Publishers. This book was released on 2017 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This thoroughly updated leading-edge circuit design resource offers the knowledge needed to quickly pinpoint transmission problems that can compromise the entire circuit design. This new edition demonstrates how to apply EM theory to solve signal integrity problems with a practical application-oriented approach. Discussing both design and debug issues at gigabit per second data rates, the book serves as a practical reference for projects involving high-speed serial signaling on printed wiring boards.Step-by-step, this book goes from reviewing the essentials of linear circuit theory, to examining practical issues of pulse propagation along lossless and lossy transmission lines. It provides detailed guidelines for crosstalk, attenuation, power supply decoupling, and layer stackup tradeoffs (including pad/antipad tradeoffs). Other key topics include the construction of etched conductors, analysis of return paths and split planes, microstrip and stripline characteristics, and SMT capacitors. Filled with on-the-job-proven examples, this hands-on reference is the book that engineers can turn to time and again to design out and troubleshoot circuit signal loss and impedance problems.

Download or read book Signal Integrity SI the Analysis of SI Faults on High Speed Digital Interconnects written by Amardeep Singh Chhina and published by . This book was released on 2006 with total page 190 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Modeling and Optimization for High speed Links and 3D IC written by Wei Yao and published by . This book was released on 2012 with total page 121 pages. Available in PDF, EPUB and Kindle. Book excerpt: The advance of modern integrated circuit (IC) processes has supported increasing date rates on chip-to-chip communications in many consumer and professional applications, such as multimedia and optical networking. Serial links have successfully evolved and achieved the bit-rate of several tens of Gb/s per channel by applying new generations of IC process and advanced circuit techniques. However, as process technologies further scale down, severe process variations significantly impact the performance of high speed serial links and makes today's circuit designs have to be optimized not only for nominal performance but also for a reasonable yield. On the other hand, three-dimensional (3D) IC provides a smaller form factor, higher performance, and lower power consumption than conventional 2D integration by stacking multiple dies vertically. Through-silicon-via (TSV) enables the vertical connectivity between stacked dies or interposer and is a key technology for 3D IC. However, electrical signaling over TSVs presents a unique set of design challenges and thus requires accurate modeling and detailed signal and power integrity analysis. In this research, the bottlenecks in TSV modeling, variation-aware circuit optimization and efficient performance evaluation for high bit-rate applications are analyzed, and solutions are presented. A simple yet accurate pair-based model for multi-port TSV networks (e.g., coupled TSV array) is proposed by decomposing the network into a number of TSV pairs and then applying circuit models for each TSV pair. This methodology is first verified against full-wave electromagnetic (EM) simulation for up to 20GHz and subsequently employed for a variety of examples of signal and power integrity analysis. For high speed serial links, an optimization framework is proposed for the joint design time and post-silicon tuning optimization for digitally tuned analog circuits, and can be used to maximize the yield in serial link transmitter design and the phase-locked-loop (PLL) design subject to the area and power constraints. Moreover, an efficient mathematical method is proposed to capture the worst-case data-dependent jitter and noise without lengthy simulations. These modeling and optimization methodologies can be applied to accurately explore the chip-to-chip integration and signaling schemes at early design stage in today's and tomorrow's 3D IC and high speed serial link design.

Download or read book Science Abstracts written by and published by . This book was released on 1995 with total page 1360 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Static Timing Analysis for Nanometer Designs written by J. Bhasker and published by Springer Science & Business Media. This book was released on 2009-04-03 with total page 588 pages. Available in PDF, EPUB and Kindle. Book excerpt: iming, timing, timing! That is the main concern of a digital designer charged with designing a semiconductor chip. What is it, how is it T described, and how does one verify it? The design team of a large digital design may spend months architecting and iterating the design to achieve the required timing target. Besides functional verification, the t- ing closure is the major milestone which dictates when a chip can be - leased to the semiconductor foundry for fabrication. This book addresses the timing verification using static timing analysis for nanometer designs. The book has originated from many years of our working in the area of timing verification for complex nanometer designs. We have come across many design engineers trying to learn the background and various aspects of static timing analysis. Unfortunately, there is no book currently ava- able that can be used by a working engineer to get acquainted with the - tails of static timing analysis. The chip designers lack a central reference for information on timing, that covers the basics to the advanced timing veri- cation procedures and techniques.

Download or read book Signal and Power Integrity simplified written by Eric Bogatin and published by Pearson Education. This book was released on 2010 with total page 793 pages. Available in PDF, EPUB and Kindle. Book excerpt: With the inclusion of the two new hot topics in signal integrity, power integrity and high speed serial links, this book will be the most up to date complete guide to understanding and designing for signal integrity.

Download or read book Research Development written by and published by . This book was released on 2003-07 with total page 612 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Strengthening Forensic Science in the United States written by National Research Council and published by National Academies Press. This book was released on 2009-07-29 with total page 348 pages. Available in PDF, EPUB and Kindle. Book excerpt: Scores of talented and dedicated people serve the forensic science community, performing vitally important work. However, they are often constrained by lack of adequate resources, sound policies, and national support. It is clear that change and advancements, both systematic and scientific, are needed in a number of forensic science disciplines to ensure the reliability of work, establish enforceable standards, and promote best practices with consistent application. Strengthening Forensic Science in the United States: A Path Forward provides a detailed plan for addressing these needs and suggests the creation of a new government entity, the National Institute of Forensic Science, to establish and enforce standards within the forensic science community. The benefits of improving and regulating the forensic science disciplines are clear: assisting law enforcement officials, enhancing homeland security, and reducing the risk of wrongful conviction and exoneration. Strengthening Forensic Science in the United States gives a full account of what is needed to advance the forensic science disciplines, including upgrading of systems and organizational structures, better training, widespread adoption of uniform and enforceable best practices, and mandatory certification and accreditation programs. While this book provides an essential call-to-action for congress and policy makers, it also serves as a vital tool for law enforcement agencies, criminal prosecutors and attorneys, and forensic science educators.

Download or read book Sensitivity Analysis in Practice written by Andrea Saltelli and published by John Wiley & Sons. This book was released on 2004-07-16 with total page 232 pages. Available in PDF, EPUB and Kindle. Book excerpt: Sensitivity analysis should be considered a pre-requisite for statistical model building in any scientific discipline where modelling takes place. For a non-expert, choosing the method of analysis for their model is complex, and depends on a number of factors. This book guides the non-expert through their problem in order to enable them to choose and apply the most appropriate method. It offers a review of the state-of-the-art in sensitivity analysis, and is suitable for a wide range of practitioners. It is focussed on the use of SIMLAB – a widely distributed freely-available sensitivity analysis software package developed by the authors – for solving problems in sensitivity analysis of statistical models. Other key features: Provides an accessible overview of the current most widely used methods for sensitivity analysis. Opens with a detailed worked example to explain the motivation behind the book. Includes a range of examples to help illustrate the concepts discussed. Focuses on implementation of the methods in the software SIMLAB - a freely-available sensitivity analysis software package developed by the authors. Contains a large number of references to sources for further reading. Authored by the leading authorities on sensitivity analysis.

Download or read book MOSFET Models for SPICE Simulation written by William Liu and published by Wiley-IEEE Press. This book was released on 2001-02-21 with total page 608 pages. Available in PDF, EPUB and Kindle. Book excerpt: An expert guide to understanding and making optimum use of BSIM Used by more chip designers worldwide than any other comparable model, the Berkeley Short-Channel IGFET Model (BSIM) has, over the past few years, established itself as the de facto standard MOSFET SPICE model for circuit simulation and CMOS technology development. Yet, until now, there have been no independent expert guides or tutorials to supplement the various BSIM manuals currently available. Written by a noted expert in the field, this book fills that gap in the literature by providing a comprehensive guide to understanding and making optimal use of BSIM3 and BSIM4. Drawing upon his extensive experience designing with BSIM, William Liu provides a brief history of the model, discusses the various advantages of BSIM over other models, and explores the reasons why BSIM3 has been adopted by the majority of circuit manufacturers. He then provides engineers with the detailed practical information and guidance they need to master all of BSIM's features. He: Summarizes key BSIM3 components Represents the BSIM3 model with equivalent circuits for various operating conditions Provides a comprehensive glossary of modeling terminology Lists alphabetically BSIM3 parameters along with their meanings and relevant equations Explores BSIM3's flaws and provides improvement suggestions Describes all of BSIM4's improvements and new features Provides useful SPICE files, which are available online at the Wiley ftp site