Download or read book Developments in Strategic Materials and Computational Design III Volume 33 Issue 10 written by Waltraud M. Kriven and published by John Wiley & Sons. This book was released on 2012-11-29 with total page 216 pages. Available in PDF, EPUB and Kindle. Book excerpt: Exploring the latest findings, new materials, and applications, this issue keeps readers current with some of the most important developments in strategic materials and the computational design of ceramics and composites. It features select contributions from one symposium and three focused sessions that took place in January 2012 during the 36th International Conference and Exposition on Advanced Ceramics and Composites (ICACC). This issue represents one of nine CESP issues published from the 36th ICACC meeting.
Download or read book Proceedings of the Fourth International Symposium of Process Physics and Modeling in Semiconductor Technology written by G. R. Srinivasan and published by The Electrochemical Society. This book was released on 1996 with total page 546 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Simulation of Semiconductor Devices and Processes written by Siegfried Selberherr and published by Springer. This book was released on 1993 with total page 532 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Fundamentals of Semiconductor Processing Technology written by Badih El-Kareh and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 605 pages. Available in PDF, EPUB and Kindle. Book excerpt: The drive toward new semiconductor technologies is intricately related to market demands for cheaper, smaller, faster, and more reliable circuits with lower power consumption. The development of new processing tools and technologies is aimed at optimizing one or more of these requirements. This goal can, however, only be achieved by a concerted effort between scientists, engineers, technicians, and operators in research, development, and manufac turing. It is therefore important that experts in specific disciplines, such as device and circuit design, understand the principle, capabil ities, and limitations of tools and processing technologies. It is also important that those working on specific unit processes, such as lithography or hot processes, be familiar with other unit processes used to manufacture the product. Several excellent books have been published on the subject of process technologies. These texts, however, cover subjects in too much detail, or do not cover topics important to modem tech nologies. This book is written with the need for a "bridge" between different disciplines in mind. It is intended to present to engineers and scientists those parts of modem processing technologies that are of greatest importance to the design and manufacture of semi conductor circuits. The material is presented with sufficient detail to understand and analyze interactions between processing and other semiconductor disciplines, such as design of devices and cir cuits, their electrical parameters, reliability, and yield.
Download or read book 3 Dimensional Process Simulation written by J. Lorenz and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 207 pages. Available in PDF, EPUB and Kindle. Book excerpt: Whereas two-dimensional semiconductor process simulation has achieved a certain degree of maturity, three-dimensional process simulation is a newly emerging field in which most efforts are dedicated to necessary basic developments. Research in this area is promoted by the growing demand to obtain reliable information on device geometries and dopant distributions needed for three-dimensional device simulation, and challenged by the great algorithmic problems caused by moving interfaces and by the requirement to limit computation times and memory requirements. A workshop (Erlangen, September 5, 1995) provided a forum to discuss the industrial needs, technical problems, and solutions being developed in the field of three-dimensional semiconductor process simulation. Invited presentations from leading semiconductor companies and research Centers of Excellence from Japan, the USA, and Europe outlined novel numerical algorithms, physical models, and applications in this rapidly emerging field.
Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1994 with total page 728 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Mechanical Properties and Performance of Engineering Ceramics and Composites VI Volume 32 Issue 2 written by Dileep Singh and published by John Wiley & Sons. This book was released on 2011-11-11 with total page 322 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a collection of papers from The American Ceramic Society's 35th International Conference on Advanced Ceramics and Composites, held in Daytona Beach, Florida, January 23-28, 2011. This issue includes papers presented in the Mechanical Behavior and Performance of Ceramics & Composites Symposium on topics such as processing-microstructure properties correlations; fracture mechanics, modeling and testing; tribological properties; applications; and processing.
Download or read book Mechanics and Control of Solids and Structures written by Vladimir A. Polyanskiy and published by Springer Nature. This book was released on 2022-04-22 with total page 646 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a collection of papers prepared by the researches of the Institute for Problems in Mechanical Engineering of the Russian Academy of Sciences (IPME RAS) on the occasion of the 30th anniversary of the establishment of the Institute. The IPME RAS is one of the leading research institutes of the Russian Academy of Sciences and consists of 18 research units (laboratories). The chapters cover the main research directions of the institute, including nano-,micro-, meso- and macro- mechanics and materials, with ,special emphasis on the problems of strength of materials and service life of structures.
Download or read book Contributions to Advanced Dynamics and Continuum Mechanics written by Holm Altenbach and published by Springer. This book was released on 2019-05-31 with total page 280 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book celebrates the 65th birthday of Prof. Alexander K. Belyaev—a well-known expert in the field of Dynamics of Mechanical Systems. In addition to reflecting Prof. Belyaev’s contributions, the papers gathered here address a range of current problems in Dynamics and Continuum Mechanics. All contributions were prepared by his friends and colleagues, and chiefly focus on theory and applications.
Download or read book Handbook of Semiconductor Manufacturing Technology written by Yoshio Nishi and published by CRC Press. This book was released on 2017-12-19 with total page 1720 pages. Available in PDF, EPUB and Kindle. Book excerpt: Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Download or read book Modeling and Numerical Simulation of Materials Behavior and Evolution Volume 731 written by Antonios Zavaliangos and published by . This book was released on 2002-08-09 with total page 344 pages. Available in PDF, EPUB and Kindle. Book excerpt: In recent years, numerical simulation and modeling of materials coupling multiple-length scales has received much attention. While challenges remain, significant advances have been made. An equally important area of materials modeling, one that has received much less attention, is the integration of multiple physical phenomena for simulation of complex materials behavior. This volume offers a review of current capabilities in materials modeling and simulation that (1) bridge length scales and time scales and (2) couple a variety of physical phenomena to either provide insight into fundamental aspects of materials structure or predict materials behavior. By bringing together the materials modeling community from around the world, the volume provides a current snapshot of the field. Topics include: multiscale modeling; mechanical properties; transport phenomena; phase transformations; microstructure and its evolution; atomistic modeling; and materials structure and properties.
Download or read book Generalized Models and Non classical Approaches in Complex Materials 1 written by Holm Altenbach and published by Springer. This book was released on 2018-03-24 with total page 799 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is the first of 2 special volumes dedicated to the memory of Gérard Maugin. Including 40 papers that reflect his vast field of scientific activity, the contributions discuss non-standard methods (generalized model) to demonstrate the wide range of subjects that were covered by this exceptional scientific leader. The topics range from micromechanical basics to engineering applications, focusing on new models and applications of well-known models to new problems. They include micro–macro aspects, computational endeavors, options for identifying constitutive equations, and old problems with incorrect or non-satisfying solutions based on the classical continua assumptions.
Download or read book Proceedings of the Second International Symposium on Process Physics and Modeling in Semiconductor Technology written by G. R. Srinivasan and published by . This book was released on 1991 with total page 826 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microelectronics Manufacturing Diagnostics Handbook written by Abraham Landzberg and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 663 pages. Available in PDF, EPUB and Kindle. Book excerpt: The world of microelectronics is filled with cusses measurement systems, manufacturing many success stories. From the use of semi control techniques, test, diagnostics, and fail ure analysis. It discusses methods for modeling conductors for powerful desktop computers to their use in maintaining optimum engine per and reducing defects, and for preventing de formance in modem automobiles, they have fects in the first place. The approach described, clearly improved our daily lives. The broad while geared to the microelectronics world, has useability of the technology is enabled, how applicability to any manufacturing process of similar complexity. The authors comprise some ever, only by the progress made in reducing their cost and improving their reliability. De of the best scientific minds in the world, and fect reduction receives a significant focus in our are practitioners of the art. The information modem manufacturing world, and high-quality captured here is world class. I know you will diagnostics is the key step in that process. find the material to be an excellent reference in of product failures enables step func Analysis your application. tion improvements in yield and reliability. which works to reduce cost and open up new Dr. Paul R. Low applications and technologies. IBM Vice President and This book describes the process ofdefect re of Technology Products General Manager duction in the microelectronics world.
Download or read book The Physics and Chemistry of SiO2 and the Si SiO2 Interface 2 written by B.E. Deal and published by Springer Science & Business Media. This book was released on 2013-11-09 with total page 505 pages. Available in PDF, EPUB and Kindle. Book excerpt: The first international symposium on the subject "The Physics and Chemistry of Si02 and the Si-Si02 Interface," organized in association with the Electrochemical Society, Inc. , was held in Atlanta, Georgia on May 15- 20, 1988. This symposium contained sixty papers and was so successful that the sponsoring divisions decided to schedule it on a regular basis every four years. Thus, the second symposium on "The Physics and Chemistry of Si02 and the Si02 Interface was held May 18-21, 1992 in St. Louis, Missouri, again sponsored by the Electronics and Dielectrics Science and Technology Divisions of The Electrochemical Society. This volume contains manuscripts of most of the fifty nine papers presented at the 1992 symposium, and is divided into eight chapters - approximating the organization of the symposium. Each chapter is preceded with an introduction by the session organizers. It is appropriate to provide a general assessment of the current status and understanding of the physics and chemistry of Si02 and the Si02 interface before proceeding with a brief overview of the individual chapters. Semiconductor devices have continued to scale down in both horizontal and vertical dimensions. This has resulted in thinner gate and field oxides as well as much closer spacing of individual device features. As a result, surface condition, native oxide composition, and cleaning and impurity effects now provide a much more significant contribution to the properties of oxides and their interfaces.
Download or read book Mechanical Properties and Performance of Engineering Ceramics and Composites VII Volume 33 Issue 2 written by Dileep Singh and published by John Wiley & Sons. This book was released on 2012-11-28 with total page 340 pages. Available in PDF, EPUB and Kindle. Book excerpt: This collection of 33 papers deals with mechanical behaviors associated with systems ranging from diamond reinforced silicon carbide to rare earth pyrosilicates. Presented at The Mechanical Behavior and Performance of Ceramics & Composites Symposium in January 2012 during the 36th International Conference on Advanced Ceramics and Composites (ICACC), it offers researchers from around the world the opportunity to explore new and emerging issues in all aspects of the field.
Download or read book Bibliography of Agriculture written by and published by . This book was released on 1975 with total page 1922 pages. Available in PDF, EPUB and Kindle. Book excerpt:
