Download or read book Modeling and Design Optimization of Multi GHz IC Interconnects written by Xuejue Huang and published by . This book was released on 2002 with total page 268 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Activity aware Modeling and Design Optimization of On chip Signal Interconnects written by Krishnan Sundaresan and published by . This book was released on 2006 with total page 460 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book 3D Interconnect Architectures for Heterogeneous Technologies written by Lennart Bamberg and published by Springer Nature. This book was released on 2022-06-27 with total page 403 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrow’s 3D-integrated circuits, an extensive set of optimization methods (for power, performance, area, and yield), as well as an open-source optimization and simulation framework for fast exploration of novel designs.

Download or read book Nano CMOS Design for Manufacturability written by Ban P. Wong and published by John Wiley & Sons. This book was released on 2008-12-29 with total page 408 pages. Available in PDF, EPUB and Kindle. Book excerpt: Discover innovative tools that pave the way from circuit and physical design to fabrication processing Nano-CMOS Design for Manufacturability examines the challenges that design engineers face in the nano-scaled era, such as exacerbated effects and the proven design for manufacturability (DFM) methodology in the midst of increasing variability and design process interactions. In addition to discussing the difficulties brought on by the continued dimensional scaling in conformance with Moore's law, the authors also tackle complex issues in the design process to overcome the difficulties, including the use of a functional first silicon to support a predictable product ramp. Moreover, they introduce several emerging concepts, including stress proximity effects, contour-based extraction, and design process interactions. This book is the sequel to Nano-CMOS Circuit and Physical Design, taking design to technology nodes beyond 65nm geometries. It is divided into three parts: Part One, Newly Exacerbated Effects, introduces the newly exacerbated effects that require designers' attention, beginning with a discussion of the lithography aspects of DFM, followed by the impact of layout on transistor performance Part Two, Design Solutions, examines how to mitigate the impact of process effects, discussing the methodology needed to make sub-wavelength patterning technology work in manufacturing, as well as design solutions to deal with signal, power integrity, WELL, stress proximity effects, and process variability Part Three, The Road to DFM, describes new tools needed to support DFM efforts, including an auto-correction tool capable of fixing the layout of cells with multiple optimization goals, followed by a look ahead into the future of DFM Throughout the book, real-world examples simplify complex concepts, helping readers see how they can successfully handle projects on Nano-CMOS nodes. It provides a bridge that allows engineers to go from physical and circuit design to fabrication processing and, in short, make designs that are not only functional, but that also meet power and performance goals within the design schedule.

Download or read book Interconnect Centric Design for Advanced SOC and NOC written by Jari Nurmi and published by Springer Science & Business Media. This book was released on 2004-07-20 with total page 474 pages. Available in PDF, EPUB and Kindle. Book excerpt: In Interconnect-centric Design for Advanced SoC and NoC, we have tried to create a comprehensive understanding about on-chip interconnect characteristics, design methodologies, layered views on different abstraction levels and finally about applying the interconnect-centric design in system-on-chip design. Traditionally, on-chip communication design has been done using rather ad-hoc and informal approaches that fail to meet some of the challenges posed by next-generation SOC designs, such as performance and throughput, power and energy, reliability, predictability, synchronization, and management of concurrency. To address these challenges, it is critical to take a global view of the communication problem, and decompose it along lines that make it more tractable. We believe that a layered approach similar to that defined by the communication networks community should also be used for on-chip communication design. The design issues are handled on physical and circuit layer, logic and architecture layer, and from system design methodology and tools point of view. Formal communication modeling and refinement is used to bridge the communication layers, and network-centric modeling of multiprocessor on-chip networks and socket-based design will serve the development of platforms for SoC and NoC integration. Interconnect-centric Design for Advanced SoC and NoC is concluded by two application examples: interconnect and memory organization in SoCs for advanced set-top boxes and TV, and a case study in NoC platform design for more generic applications.

Download or read book Development Validation and Application of Semi Analytical Interconnect Models for Efficient Simulation of Multilayer Substrates written by Renato Rimolo-Donadio and published by Logos Verlag Berlin GmbH. This book was released on 2011 with total page 226 pages. Available in PDF, EPUB and Kindle. Book excerpt: This thesis deals with the development of semi-analytical models for the electrical behavior of vias and traces in chip packages and printed circuit boards. A framework for automated simulation of multilayer structures is also proposed. The validation and evaluation of the models are thoroughly addressed with several test structures and application studies. It is shown that the models can provide good results up to 40 GHz, whereas the numerical efficiency is at least two orders of magnitude higher in comparison to general-purpose numerical methods.

Download or read book Interconnect Analysis and Synthesis written by Chung-Kuan Cheng and published by Wiley-Interscience. This book was released on 2000 with total page 288 pages. Available in PDF, EPUB and Kindle. Book excerpt: State-of-the-art methods and current perspectives on interconnect The irrepressible march toward smaller and faster integrated circuits has made interconnect a hot topic for semiconductor research. The effects of wire size, topology construction, and network design on system performance and reliability have all been thoroughly investigated in recent years. Interconnect Analysis and Synthesis provides CAD researchers and engineers with powerful, state-of-the-art tools for the analysis, design, and optimization of interconnect. It brings together a wealth of information previously scattered throughout the literature, explaining in depth available analysis techniques and presenting a range of CAD algorithms for synthesizing and optimizing interconnect. Along with examples and results from the semiconductor industry and 150 illustrations, this practical work features: Models for interconnect as well as devices and the impact of scaling trends Modern analysis techniques, from matrix reduction and moment matching to transmission-line analysis An overview of the effects of inductance on on-chip interconnect Flexible CAD algorithms that can be generalized for different needs, from buffer insertion to wire sizing to routing topology Emphasis on realistic problem formulations, addressing key design tradeoffs such as those between area and performance

Download or read book Modeling and Design of Network on Chip Interconnects written by Anastasia Barger and published by . This book was released on 2006 with total page 174 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Modeling Analysis and Optimization of Network on Chip Communication Architectures written by Umit Y. Ogras and published by Springer Science & Business Media. This book was released on 2013-03-12 with total page 182 pages. Available in PDF, EPUB and Kindle. Book excerpt: Traditionally, design space exploration for Systems-on-Chip (SoCs) has focused on the computational aspects of the problem at hand. However, as the number of components on a single chip and their performance continue to increase, the communication architecture plays a major role in the area, performance and energy consumption of the overall system. As a result, a shift from computation-based to communication-based design becomes mandatory. Towards this end, network-on-chip (NoC) communication architectures have emerged recently as a promising alternative to classical bus and point-to-point communication architectures. In this dissertation, we study outstanding research problems related to modeling, analysis and optimization of NoC communication architectures. More precisely, we present novel design methodologies, software tools and FPGA prototypes to aid the design of application-specific NoCs.

Download or read book Interconnect Technologies for Integrated Circuits and Flexible Electronics written by Yash Agrawal and published by Springer Nature. This book was released on 2023-10-17 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt: This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.

Download or read book Modeling and Optimization of Interconnects and Package for Signal and Power Integrity written by Jun Chen and published by . This book was released on 2006 with total page 290 pages. Available in PDF, EPUB and Kindle. Book excerpt: We further study the decoupling capacitor optimization problem for the power integrity of packages. We develop an incremental noise computation method based on FFT over incremental impedance matrix evaluation, and then use the simulated annealing algorithm to minimize the total cost of decoupling capacitors under the constraints of a noise bound. Compared to the existing impedance based approaches, our algorithm reduces the decoupling capacitor cost by 3x and is also more than 10x faster.

Download or read book Integrated Circuit and System Design Power and Timing Modeling Optimization and Simulation written by Jorge Juan Chico and published by Springer. This book was released on 2003-10-02 with total page 647 pages. Available in PDF, EPUB and Kindle. Book excerpt: Welcome to the proceedings of PATMOS 2003. This was the 13th in a series of international workshops held in several locations in Europe. Over the years, PATMOS has gained recognition as one of the major European events devoted to power and timing aspects of integrated circuit and system design. Despite its signi?cant growth and development, PATMOS can still be considered as a very informal forum, featuring high-level scienti?c presentations together with open discussions and panel sessions in a free and relaxed environment. This year, PATMOS took place in Turin, Italy, organized by the Politecnico di Torino, with technical co-sponsorship from the IEEE Circuits and Systems Society and the generous support of the European Commission, as well as that of several industrial sponsors, including BullDAST, Cadence, Mentor Graphics, STMicroelectronics, and Synopsys. The objective of the PATMOS workshop is to provide a forum to discuss and investigate the emerging problems in methodologies and tools for the design of new generations of integrated circuits and systems. A major emphasis of the technical program is on speed and low-power aspects, with particular regard to modeling, characterization, design, and architectures.

Download or read book Dissertation Abstracts International written by and published by . This book was released on 2008 with total page 886 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Nano CMOS Circuit and Physical Design written by Ban Wong and published by John Wiley & Sons. This book was released on 2005-04-08 with total page 413 pages. Available in PDF, EPUB and Kindle. Book excerpt: Based on the authors' expansive collection of notes taken over the years, Nano-CMOS Circuit and Physical Design bridges the gap between physical and circuit design and fabrication processing, manufacturability, and yield. This innovative book covers: process technology, including sub-wavelength optical lithography; impact of process scaling on circuit and physical implementation and low power with leaky transistors; and DFM, yield, and the impact of physical implementation.

Download or read book Interconnect Noise Optimization in Nanometer Technologies written by Mohamed Elgamel and published by Springer Science & Business Media. This book was released on 2006-03-20 with total page 145 pages. Available in PDF, EPUB and Kindle. Book excerpt: Presents a range of CAD algorithms and techniques for synthesizing and optimizing interconnect Provides insight & intuition into layout analysis and optimization for interconnect in high speed, high complexity integrated circuits

Download or read book Masters Theses in the Pure and Applied Sciences written by Wade H. Shafer and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 426 pages. Available in PDF, EPUB and Kindle. Book excerpt: Masters Theses in the Pure and Applied Sciences was first conceived, published, and disseminated by the Center for Information and Numerical Data Analysis and Synthesis (CINDAS)* at Purdue University in 1957, starting its coverage of theses with the academic year 1955. Beginning with Volume 13, the printing and dis semination phases of the activity were transferred to University Microfilms/Xerox of Ann Arbor, Michigan, with the thought that such an arrangement would be more beneficial to the academic and general scientific and technical community. After five years of this joint undertaking we had concluded that it was in the interest of all concerned if the printing and distribution of the volumes were handled by an international publishing house to assure improved service and broader dissemination. Hence, starting with Volume 18, Masters Theses in the Pure and Applied Sciences has been disseminated on a worldwide basis by Plenum Publishing Corporation of New York, and in the same year the coverage was broadened to include Canadian universities. All back issues can also be ordered from Plenum. We have reported in Volume 38 (thesis year 1993) a total of 13,787 thesis titles from 22 Canadian and 164 United States universities. We are sure that this broader base for these titles reported will greatly enhance the value of this impor tant annual reference work. While Volume 38 reports theses submitted in 1993, on occasion, certain uni versities do report theses submitted in previous years but not reported at the time.

Download or read book Designing Embedded Processors written by Jörg Henkel and published by Springer Science & Business Media. This book was released on 2007-07-27 with total page 551 pages. Available in PDF, EPUB and Kindle. Book excerpt: To the hard-pressed systems designer this book will come as a godsend. It is a hands-on guide to the many ways in which processor-based systems are designed to allow low power devices. Covering a huge range of topics, and co-authored by some of the field’s top practitioners, the book provides a good starting point for engineers in the area, and to research students embarking upon work on embedded systems and architectures.