Download or read book Microwave measurement based IC Interconnect Characterization Modeling and Simulation for High Speed VLSI Circuit Design written by Yungseon Eo and published by . This book was released on 1993 with total page 460 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Compact Models and Measurement Techniques for High Speed Interconnects written by Rohit Sharma and published by Springer Science & Business Media. This book was released on 2012-02-17 with total page 81 pages. Available in PDF, EPUB and Kindle. Book excerpt: Compact Models and Measurement Techniques for High-Speed Interconnects provides detailed analysis of issues related to high-speed interconnects from the perspective of modeling approaches and measurement techniques. Particular focus is laid on the unified approach (variational method combined with the transverse transmission line technique) to develop efficient compact models for planar interconnects. This book will give a qualitative summary of the various reported modeling techniques and approaches and will help researchers and graduate students with deeper insights into interconnect models in particular and interconnect in general. Time domain and frequency domain measurement techniques and simulation methodology are also explained in this book.

Download or read book Advances in Monolithic Microwave Integrated Circuits for Wireless Systems Modeling and Design Technologies written by Marzuki, Arjuna and published by IGI Global. This book was released on 2011-08-31 with total page 380 pages. Available in PDF, EPUB and Kindle. Book excerpt: Monolithic Microwave Integrated Circuit (MMIC) is an electronic device that is widely used in all high frequency wireless systems. In developing MMIC as a product, understanding analysis and design techniques, modeling, measurement methodology, and current trends are essential.Advances in Monolithic Microwave Integrated Circuits for Wireless Systems: Modeling and Design Technologies is a central source of knowledge on MMIC development, containing research on theory, design, and practical approaches to integrated circuit devices. This book is of interest to researchers in industry and academia working in the areas of circuit design, integrated circuits, and RF and microwave, as well as anyone with an interest in monolithic wireless device development.

Download or read book On Chip Inductance in High Speed Integrated Circuits written by Yehea I. Ismail and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt: The appropriate interconnect model has changed several times over the past two decades due to the application of aggressive technology scaling. New, more accurate interconnect models are required to manage the changing physical characteristics of integrated circuits. Currently, RC models are used to analyze high resistance nets while capacitive models are used for less resistive interconnect. However, on-chip inductance is becoming more important with integrated circuits operating at higher frequencies, since the inductive impedance is proportional to the frequency. The operating frequencies of integrated circuits have increased dramatically over the past decade and are expected to maintain the same rate of increase over the next decade, approaching 10 GHz by the year 2012. Also, wide wires are frequently encountered in important global nets, such as clock distribution networks and in upper metal layers, and performance requirements are pushing the introduction of new materials for low resistance interconnect, such as copper interconnect already used in many commercial CMOS technologies. On-Chip Inductance in High Speed Integrated Circuits deals with the design and analysis of integrated circuits with a specific focus on on-chip inductance effects. It has been described throughout this book that inductance can have a tangible effect on current high speed integrated circuits. For example, neglecting inductance and using an RC interconnect model in a production 0.25 mum CMOS technology can cause large errors (over 35%) in estimates of the propagation delay of on-chip interconnect. It has also been shown that including inductance in the repeater insertion design process as compared to using an RC model improves the overall repeater solution in terms of area, power, and delay with average savings of 40.8%, 15.6%, and 6.7%, respectively. On-Chip Inductance in High Speed Integrated Circuits is full of design and analysis techniques for RLC interconnect. These techniques are compared to techniques traditionally used for RC interconnect design to emphasize the effect of inductance. emOn-Chip Inductance in High Speed Integrated Circuits will be of interest to researchers in the area of high frequency interconnect, noise, and high performance integrated circuit design.

Download or read book High speed Interconnect Design Characterization and Applications written by Jinsook Kim and published by . This book was released on 2006 with total page 322 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book IC Interconnect Analysis written by Mustafa Celik and published by Springer. This book was released on 2013-03-23 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt: As integrated circuit (IC) feature sizes scaled below a quarter of a micron, thereby defining the deep submicron (DSM) era, there began a gradual shift in the impact on performance due to the metal interconnections among the active circuit components. Once viewed as merely parasitics in terms of their relevance to the overall circuit behavior, the interconnect can now have a dominant impact on the IC area and performance. Beginning in the late 1980's there was significant research toward better modeling and characterization of the resistance, capacitance and ultimately the inductance of on-chip interconnect. IC Interconnect Analysis covers the state-of-the-art methods for modeling and analyzing IC interconnect based on the past fifteen years of research. This is done at a level suitable for most practitioners who work in the semiconductor and electronic design automation fields, but also includes significant depth for the research professionals who will ultimately extend this work into other areas and applications. IC Interconnect Analysis begins with an in-depth coverage of delay metrics, including the ubiquitous Elmore delay and its many variations. This is followed by an outline of moment matching methods, calculating moments efficiently, and Krylov subspace methods for model order reduction. The final two chapters describe how to interface these reduced-order models to circuit simulators and gate-level timing analyzers respectively. IC Interconnect Analysis is written for CAD tool developers, IC designers and graduate students.

Download or read book Characterization of Vertical Interconnects in 3 D Monolithic Microwave Integrated Circuits 3 D MMIC written by and published by . This book was released on 2003 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: In this research, a unique fabrication technology to build high-aspect-ratio via interconnects in 3D MMIC multilayer integration was developed from a combination of microelectronic and traditional MEMS microfabrication technologies. Based on these techniques, a set of test structures have been successfully fabricated to facilitate the vertical interconnect characterization. Fully cured polyimide thin films possess favorable electric and mechanical properties for the 3D MMIC applications. Using quarter wavelength T-junction resonator structure, polyimide was characterized for its microwave properties. High-frequency characterization of polyimide thin films was obtained in a wide frequency range. Experimental results have shown the feasibility of this method. In order to correctly evaluate the conductor loss in thin planar transmission lines, a modified conductor loss model was derived from conventional Wheeler's incremental inductance rule to account for the field penetration as the physical strip thickness approaches the skin depth or even smaller. The closed-form formulas or simplified equations have been developed for microstrip and stripline with wide strip cases, and for general coplanar waveguide including SCPWG line. Meanwhile, experimental results verified the validity of the modified conductor loss model in evaluating the losses in thin transmission lines. It has been shown that as the conductor thickness becomes approximately greater than four times of the skin depth, both conventional Wheeler's rule and its modified model agree with each other very well on the conductor loss estimation. Experimental results have revealed that at RF frequency, e.g. X band (8-12 GHz), the vertical interconnection discontinuities may contribute significantly to the insertion loss and the phase change. With the advanced conductor loss models for evaluating the characteristics in the test structures, lumped-element equivalent circuit models can be derived from the via module measurement results. These models are of great practical importance in a complex circuit design.

Download or read book Electrical Characterization and Circuit Modeling of Interconnections and Packages for High Speed Circuits by Time Domain Measurements written by Jyh-ming Jong and published by . This book was released on 1995 with total page 254 pages. Available in PDF, EPUB and Kindle. Book excerpt: With edge rates of high speed digital devices pushing into the sub-nano second range, interconnections with the associated packages play a major role in determining the speed, size and performance of digital circuits and systems. The purpose of this study is to develop experimental techniques based on time domain peeling algorithms (dynamic deconvolution) for accurate electrical characterization and circuit modeling of general interconnection structures. This thesis describes the basic principles and computational procedure of these time domain peeling algorithms, accompanied by many illustrations and examples of practical interconnection structures in high speed electronic packages. These include general single (isolated) interconnections with nonuniform cross section, general uniformly/ nonuniformly coupled interconnection structures with discontinuities, power/ ground systems with the associated parallel plane structures, resistive lossy interconnections in thin film single and multi-chip modules, and multilayer high-pin-count packages. It is shown that the distributed circuit models consisting of cascaded transmission line sections lead to an accurate evaluation of the time domain response of high speed interconnection structures. These distributed models are synthesized from the time domain reflection and transmission (TDRIT) measurements, and the impedance profiles of the distributed model are extracted by using scattering matrix-based peeling algorithms By direct time domain integration or frequency domain optimization, the distributed circuit model can also be used to construct the lumped element circuit model as well as the proposed hybrid element model consisting of transmission lines and lumped elements. The hybrid model is intended to combine the efficiency of the lumped element model with the accuracy of the distributed circuit model leading to efficient accurate simulation of circuits in general CAD tools. The accuracy of these circuit models is also confirmed by comparing the simulated data with the measured data for the test fixtures on printed circuit boards (PCBs) and chip-to-chip level interconnections. The techniques developed in this thesis can help to assure the signal fidelity of high speed circuits in the early design stage by incorporating interconnect models into integrated circuit design and simulation.

Download or read book Electromagnetic Compatibility Modeling for Integrated Circuits written by Kuan Hsiang Nick Huang and published by Open Dissertation Press. This book was released on 2017-01-27 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: This dissertation, "Electromagnetic Compatibility Modeling for Integrated Circuits" by Kuan Hsiang, Nick, Huang, 黃冠翔, was obtained from The University of Hong Kong (Pokfulam, Hong Kong) and is being sold pursuant to Creative Commons: Attribution 3.0 Hong Kong License. The content of this dissertation has not been altered in any way. We have altered the formatting in order to facilitate the ease of printing and reading of the dissertation. All rights not granted by the above license are retained by the author. Abstract: The integrated circuit (IC) packaging electromagnetic compatibility (EMC)/signal integrity (SI)/power integrity (PI) problems have been broadly attested. But IC packaging electromagnetic interference (EMI) was seldom addressed. Because the electromagnetic emission from IC packagings becomes more critical as the data rate of digital system continues increasing. Its working mechanism and modeling technology are very important. In this thesis, EM emission behaviors of IC packaging are systematically studied for the first time. It was never seen from other literatures. The fundamental principles and properties of electromagnetic radiations caused by heat sinks, vias, traces, and pin maps in IC packaging structures are carefully investigated and modeled. Both theoretical analysis based on first principles and simulated results based on numerical full wave solvers are provided to find out critical impact factors to IC packaging EMI. This work establishes basic modeling components for comprehensive radiation studies. It directly benefits fundamental understandings and guideline development for the optimization of the packaging EMI reduction. Some measurement results are also included to support concluded characterizations and analysis. A summary for IC packaging EMI design rules is discussed in details to conclude the derived design guidelines. Second, a novel data pattern based electromagnetic superposition method is developed to model the IC packaging electromagnetic emission. It employs the equivalence principle to obtain the electromagnetic field response over a broad spectrum. Then it uses the linear property of the passive parasitic system to superimpose the contribution of different signals on the packaging. As a result, with certain pre-calculations, it is convenient to compute the electromagnetic emission efficiently from different signals with various signal pattern combinations, which benefits identifying the worst case scenario. The proposed method can be implemented between different tools for specific purposes. In addition, data reconstruction can be evaluated through the phase shift, and it benefits identifying the EMI of any pulse bit pattern. This work offers great convenience for the post-processing, and allows the flexibility of real digital pulse signals. It provides a basic modeling framework for comprehensive radiation studies for IC packaging and PCB EMI reductions. Third, the performance of IC interconnects has been stretched tremendously in recently years by high speed IC systems. Their EM emission and SI modelings have to consider the existence of I/O active devices, such as buffers and drivers. The I/O model is difficult to obtain due to the IP protection and limited information. We proposed to use the X-parameter to model the IC interconnect system. Based on the PHD formalism, X-parameter models provide an accurate frequency-domain method under large-signal operating points to characterize their nonlinear behaviors. Starting from modeling the CMOS inverter, the whole link modeling primarily based on X-parameter for the pulse digital signals was presented. I/O modeling can also be investigated by the proposed new method to understand the impedance effects at high speed serial links. It is the first complete examination of the X-parameter to IC interconnect SI analysis. The nonlinear I/O property represented by IBIS models is also investigated to model

Download or read book 3D Modeling and Integration of Current and Future Interconnect Technologies written by Abdul Hamid Bin Yousuf and published by . This book was released on 2021 with total page 139 pages. Available in PDF, EPUB and Kindle. Book excerpt: To ensure maximum circuit reliability it is very important to estimate the circuit performance and signal integrity in the circuit design phase. A full phase simulation for performance estimation of a large-scale circuit not only require a massive computational resource but also need a lot of time to produce acceptable results. The estimation of performance/signal integrity of sub-nanometer circuits mostly depends on the interconnect capacitance. So, an accurate model for interconnect capacitance can be used in the circuit CAD (computer-aided design) tools for circuit performance estimation before circuit fabrication which reduces the computational resource requirement as well as the time constraints. We propose a new capacitance models for interconnect lines in multilevel interconnect structures by geometrically modeling the electrical flux lines of the interconnect lines. Closed-form equations have been derived analytically for ground and coupling capacitance. First, the capacitance model for a single line is developed, and then the new model is used to derive expressions for the capacitance of a line surrounded by neighboring lines in the same and the adjacent layers above and below. These expressions are simple, and the calculated results are within 10% of Ansys Q3D extracted values. Through silicon via (TSV) is one of the key components of the emerging 3D ICs. However, increasing number of TSVs in smaller silicon area leads to some severe negative impacts on the performance of the 3D IC. Growing signal integrity issues in TSVs is one of the major challenges of 3D integration. In this paper, different materials for the cores of the vias and the interposers are investigated to find the best possible combination that can reduce crosstalk and other losses like return loss and insertion loss in the TSVs. We have explored glass and silicon as interposer materials. The simulation results indicate that glass is the best option as interposer material although silicon interposer has some distinct advantages. For via cores three materials - copper (Cu), tungsten (W) and Cu-W bimetal are considered. From the analysis it can concluded that W would be better for high frequency applications due to lower transmission coefficient. Cu offers higher conductivity, but it has larger thermal expansion coefficient mismatch with silicon. The performance of Cu-W bimetal via would be in between Cu and W. However, W has a thermal expansion coefficient close to silicon. Therefore, bimetal Cu-W based TSV with W as the outer layer would be a suitable option for high frequency 3D IC. Here, we performed the analysis in terms of return loss, transmission coefficient and crosstalk in the vias. Signal speed in current digital systems depends mainly on the delay of interconnects. To overcome this delay problem and keep up with Moore’s law, 3D integrated circuit (vertical integration of multiple dies) with through-silicon via (TSV) has been introduced to ensure much smaller interconnect lengths, and lower delay and power consumption compared to conventional 2D IC technology. Like 2D circuit, the estimation of 3D circuit performance depends on different electrical parameters (capacitance, resistance, inductance) of the TSV. So, accurate modeling of the electrical parameters of the TSV is essential for the design and analysis of 3D ICs. We propose a set of new models to estimate the capacitance, resistance, and inductance of a Cu-filled TSV. The proposed analytical models are derived from the physical shape and the size of the TSV. The modeling approach is comprehensive and includes both the cylindrical and tapered TSVs as well as the bumps. On-chip integration of inductors has always been very challenging. However, for sub- 14nm on-chip applications, large area overhead imposed by the on-chip capacitors and inductors has become a more severe concern. To overcome this issue and ensure power integrity, a novel 3D Through-Silicon-Via (TSV) based inductor design is presented. The proposed TSV based inductor has the potential to achieve both high density and high performance. A new design of a Voltage Controlled Oscillator (VCO) utilizing the TSV based inductor is also presented. The implementation of the VCO is intended to study the feasibility, performance, and real-world application of the proposed TSV based inductor.

Download or read book Design Modeling Simulation and Measurement of IC and Package Structures for Noise Management and Power Distribution in High performance Electronic Systems written by Jr. Woods and published by . This book was released on 2003 with total page 544 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Layout Optimization in VLSI Design written by Bing Lu and published by Springer Science & Business Media. This book was released on 2013-06-29 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt: Introduction The exponential scaling of feature sizes in semiconductor technologies has side-effects on layout optimization, related to effects such as inter connect delay, noise and crosstalk, signal integrity, parasitics effects, and power dissipation, that invalidate the assumptions that form the basis of previous design methodologies and tools. This book is intended to sample the most important, contemporary, and advanced layout opti mization problems emerging with the advent of very deep submicron technologies in semiconductor processing. We hope that it will stimulate more people to perform research that leads to advances in the design and development of more efficient, effective, and elegant algorithms and design tools. Organization of the Book The book is organized as follows. A multi-stage simulated annealing algorithm that integrates floorplanning and interconnect planning is pre sented in Chapter 1. To reduce the run time, different interconnect plan ning approaches are applied in different ranges of temperatures. Chapter 2 introduces a new design methodology - the interconnect-centric design methodology and its centerpiece, interconnect planning, which consists of physical hierarchy generation, floorplanning with interconnect planning, and interconnect architecture planning. Chapter 3 investigates a net-cut minimization based placement tool, Dragon, which integrates the state of the art partitioning and placement techniques.

Download or read book Dissertation Abstracts International written by and published by . This book was released on 2007 with total page 1044 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Solid State Circuits Technologies written by Jacobus Swart and published by BoD – Books on Demand. This book was released on 2010-01-01 with total page 476 pages. Available in PDF, EPUB and Kindle. Book excerpt: The evolution of solid-state circuit technology has a long history within a relatively short period of time. This technology has lead to the modern information society that connects us and tools, a large market, and many types of products and applications. The solid-state circuit technology continuously evolves via breakthroughs and improvements every year. This book is devoted to review and present novel approaches for some of the main issues involved in this exciting and vigorous technology. The book is composed of 22 chapters, written by authors coming from 30 different institutions located in 12 different countries throughout the Americas, Asia and Europe. Thus, reflecting the wide international contribution to the book. The broad range of subjects presented in the book offers a general overview of the main issues in modern solid-state circuit technology. Furthermore, the book offers an in depth analysis on specific subjects for specialists. We believe the book is of great scientific and educational value for many readers. I am profoundly indebted to the support provided by all of those involved in the work. First and foremost I would like to acknowledge and thank the authors who worked hard and generously agreed to share their results and knowledge. Second I would like to express my gratitude to the Intech team that invited me to edit the book and give me their full support and a fruitful experience while working together to combine this book.

Download or read book The VLSI Handbook written by Wai-Kai Chen and published by CRC Press. This book was released on 2019-07-17 with total page 1788 pages. Available in PDF, EPUB and Kindle. Book excerpt: Over the years, the fundamentals of VLSI technology have evolved to include a wide range of topics and a broad range of practices. To encompass such a vast amount of knowledge, The VLSI Handbook focuses on the key concepts, models, and equations that enable the electrical engineer to analyze, design, and predict the behavior of very large-scale integrated circuits. It provides the most up-to-date information on IC technology you can find. Using frequent examples, the Handbook stresses the fundamental theory behind professional applications. Focusing not only on the traditional design methods, it contains all relevant sources of information and tools to assist you in performing your job. This includes software, databases, standards, seminars, conferences and more. The VLSI Handbook answers all your needs in one comprehensive volume at a level that will enlighten and refresh the knowledge of experienced engineers and educate the novice. This one-source reference keeps you current on new techniques and procedures and serves as a review for standard practice. It will be your first choice when looking for a solution.

Download or read book Multichip Modules written by Ernest S. Kuh and published by World Scientific. This book was released on 1992 with total page 172 pages. Available in PDF, EPUB and Kindle. Book excerpt: Multichip Module (MCM) technology has been used in high-end systems, such as mainframe and supercomputers as well as military and space applications for some time. Rapid advances in VLSI technology and novel system architecture concepts have presented both challenges and opportunities for MCM technologists. Recent developments in MCM technology indicate that it will eventually take over much of the electronic packaging currently using printed circuit boards. This collection of articles gives an in-depth study of the state-of-the-art of MCM technology from systems, CAD and technology viewpoints. Written by outstanding experts in their fields, this volume should be considered essential reading.

Download or read book Microwave Circuit Modeling Using Electromagnetic Field Simulation written by Daniel G. Swanson and published by Artech House. This book was released on 2003 with total page 508 pages. Available in PDF, EPUB and Kindle. Book excerpt: Annotation This practical "how to" book is an ideal introduction to electromagnetic field-solvers. Where most books in this area are strictly theoretical, this unique resource provides engineers with helpful advice on selecting the right tools for their RF (radio frequency) and high-speed digital circuit design work